1-20 of 2664

Search Results for sectioning

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting...
Image
Published: 01 December 1984
Figure 2-11 Schematics illustrating the taper sectioning procedure and the taper magnification. More
Image
Published: 01 June 2022
Figure 1 Resin-infiltrated coupon prior to initial sectioning More
Image
Published: 01 June 2022
Figure 2 Mounting orientation. (a) Sample coupon before sectioning. (b) Sample mounted with sectioned face expose. (c) Sample mounted with free edge exposed More
Image
Published: 01 June 2022
Figure 3 Sample undergoing sectioning. Note cushioning material between clamp and specimen. Coated surface is oriented toward the camera More
Image
Published: 01 June 2022
Figure 4 Typical sectioning orientation for thermal spray coatings More
Image
Published: 01 June 2022
Figure 2 Artifacts in TBC caused by sectioning shown in (a) lower magnification images showing loss of TC by cracking and decohesion during sectioning and (b) high magnification image with arrows indicating additional horizontal cracking in the TC along the substrate interface in the BC More
Image
Published: 01 January 2017
Fig. 18.16 Sectioning allowed partial exposure of the fracture surfaces of the crack in Fig. 18.15 . Note the radial line pattern converging at the surface site of crack initiation just above the “3” on the ruler. Source: Ref 18.53 More
Image
Published: 01 April 2013
Fig. 1 Schematic of taper sectioning (mounting), as applied to a coated specimen. Taper magnification equals the cosecant of taper angle α. Source: Ref 1 More
Image
Published: 01 October 2005
Fig. CH3.2 Bolt head after sectioning More
Image
Published: 01 December 2003
Fig. 5 Diamond saw used for sectioning of very hard specimens. Very thin cuts can be made with this tool. More
Image
Published: 01 November 2010
Fig. 2.3 Carbon fiber composite laminate labeled for sectioning using a silver ink felt-tip permanent marker. This sample with the corresponding section map was originally sent for nondestructive inspection. More
Image
Published: 01 November 2010
Fig. 2.6 Cut edge of a composite material after sectioning with an abrasive cut-off saw. The composite was mounted using a Rhodamine-B-dyed epoxy resin and viewed using epi-fluorescence, 390–440 nm excitation, 25× objective. More
Image
Published: 01 November 2010
Fig. 7.9 Schematic showing the sectioning of a composite part on an angle through the thickness. This is done to elongate the fibers for easier determination of the ply angles. More
Image
Published: 01 March 2006
Fig. 10.5 Observation of fatigue damage at specimen surface by taper sectioning. Source: Ref 10.10 More
Image
Published: 01 November 2019
Fig. 3 One type of sample sectioning block assembled and on grinding wheel. Upper image is actual block, lower image is a cartoon of the block showing components More
Image
Published: 01 November 2019
Fig. 11 Modified sectioning block for large samples. Top is the cartoon showing the components. Bottom shows the actual block with sample. More
Image
Published: 01 November 2019
Figure 7 Failure site after cross sectioning by FIB again inspected by SEM [4] . More
Image
Published: 01 November 2019
Fig 14 Drawing of oxide VCSEL prepared by FIB for cross-sectioning (top) or plan-view imaging (bottom). Plan view image shows DLD network originating from the etch hole and traveling into emitting area. More