Skip Nav Destination
Close Modal
By
Becky Holdford
By
Rebecca D. Dar, Efrat Moyal, Janet Teshima
Search Results for
sectioning
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-20 of 2664
Search Results for sectioning
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Book Chapter
Cross-Sectioning: Mechanical Polishing, Ion Milling, and Focused Ion Beam (FIB)
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted...
Abstract
Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.
Book Chapter
Cross-Sectioning: Scribing and Cleaving
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting...
Abstract
Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.
Image
Schematics illustrating the taper sectioning procedure and the taper magnif...
Available to PurchasePublished: 01 December 1984
Figure 2-11 Schematics illustrating the taper sectioning procedure and the taper magnification.
More
Image
in Accepted Practice for Metallographic Preparation of Thermal Spray Coating Samples
> Thermal Spray Technology: Accepted Practices
Published: 01 June 2022
Figure 1 Resin-infiltrated coupon prior to initial sectioning
More
Image
in Accepted Practice for Metallographic Preparation of Thermal Spray Coating Samples
> Thermal Spray Technology: Accepted Practices
Published: 01 June 2022
Figure 2 Mounting orientation. (a) Sample coupon before sectioning. (b) Sample mounted with sectioned face expose. (c) Sample mounted with free edge exposed
More
Image
in Accepted Practice for Metallographic Preparation of Thermal Spray Coating Samples
> Thermal Spray Technology: Accepted Practices
Published: 01 June 2022
Figure 3 Sample undergoing sectioning. Note cushioning material between clamp and specimen. Coated surface is oriented toward the camera
More
Image
in Accepted Practice for Metallographic Preparation of Thermal Spray Coating Samples
> Thermal Spray Technology: Accepted Practices
Published: 01 June 2022
Figure 4 Typical sectioning orientation for thermal spray coatings
More
Image
in Accepted Practice for Recognizing Artifacts in Air Plasma Spray Thermal Barrier Coating Microstructures
> Thermal Spray Technology: Accepted Practices
Published: 01 June 2022
Figure 2 Artifacts in TBC caused by sectioning shown in (a) lower magnification images showing loss of TC by cracking and decohesion during sectioning and (b) high magnification image with arrows indicating additional horizontal cracking in the TC along the substrate interface in the BC
More
Image
Sectioning allowed partial exposure of the fracture surfaces of the crack i...
Available to Purchase
in Failure Analysis of Stress-Corrosion Cracking[1]
> Stress-Corrosion Cracking: Materials Performance and Evaluation
Published: 01 January 2017
Fig. 18.16 Sectioning allowed partial exposure of the fracture surfaces of the crack in Fig. 18.15 . Note the radial line pattern converging at the surface site of crack initiation just above the “3” on the ruler. Source: Ref 18.53
More
Image
Schematic of taper sectioning (mounting), as applied to a coated specimen. ...
Available to PurchasePublished: 01 April 2013
Fig. 1 Schematic of taper sectioning (mounting), as applied to a coated specimen. Taper magnification equals the cosecant of taper angle α. Source: Ref 1
More
Image
in Failure of Bolts in a Radar Antenna System Reflector Joint
> Failure Analysis of Engineering Structures: Methodology and Case Histories
Published: 01 October 2005
Fig. CH3.2 Bolt head after sectioning
More
Image
Diamond saw used for sectioning of very hard specimens. Very thin cuts can ...
Available to PurchasePublished: 01 December 2003
Fig. 5 Diamond saw used for sectioning of very hard specimens. Very thin cuts can be made with this tool.
More
Image
Carbon fiber composite laminate labeled for sectioning using a silver ink f...
Available to PurchasePublished: 01 November 2010
Fig. 2.3 Carbon fiber composite laminate labeled for sectioning using a silver ink felt-tip permanent marker. This sample with the corresponding section map was originally sent for nondestructive inspection.
More
Image
Cut edge of a composite material after sectioning with an abrasive cut-off ...
Available to PurchasePublished: 01 November 2010
Fig. 2.6 Cut edge of a composite material after sectioning with an abrasive cut-off saw. The composite was mounted using a Rhodamine-B-dyed epoxy resin and viewed using epi-fluorescence, 390–440 nm excitation, 25× objective.
More
Image
Schematic showing the sectioning of a composite part on an angle through th...
Available to PurchasePublished: 01 November 2010
Fig. 7.9 Schematic showing the sectioning of a composite part on an angle through the thickness. This is done to elongate the fibers for easier determination of the ply angles.
More
Image
Observation of fatigue damage at specimen surface by taper sectioning. Sour...
Available to PurchasePublished: 01 March 2006
Fig. 10.5 Observation of fatigue damage at specimen surface by taper sectioning. Source: Ref 10.10
More
Image
One type of sample sectioning block assembled and on grinding wheel. Upper ...
Available to Purchase
in Cross-Sectioning: Mechanical Polishing, Ion Milling, and Focused Ion Beam (FIB)
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Fig. 3 One type of sample sectioning block assembled and on grinding wheel. Upper image is actual block, lower image is a cartoon of the block showing components
More
Image
Modified sectioning block for large samples. Top is the cartoon showing the...
Available to Purchase
in Cross-Sectioning: Mechanical Polishing, Ion Milling, and Focused Ion Beam (FIB)
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Fig. 11 Modified sectioning block for large samples. Top is the cartoon showing the components. Bottom shows the actual block with sample.
More
Image
in DRAM Failure Analysis and Defect Localization Techniques[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 7 Failure site after cross sectioning by FIB again inspected by SEM [4] .
More
Image
Drawing of oxide VCSEL prepared by FIB for cross-sectioning (top) or plan-v...
Available to Purchase
in Failure Analysis and Reliability of Optoelectronic Devices[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Fig 14 Drawing of oxide VCSEL prepared by FIB for cross-sectioning (top) or plan-view imaging (bottom). Plan view image shows DLD network originating from the etch hole and traveling into emitting area.
More
1