Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

This chapter instructs the metallographer on the basic skills required to prepare a polished metallographic specimen. It is organized in a chronological sequence starting with the information-gathering process on the material being investigated, then moving on to sectioning, mounting, grinding, and polishing processes, and ending with methods used to properly store metallographic specimens. The discussion covers the preparation procedures, the materials being investigated, and equipment used to perform these procedures.

This chapter describes the methods and equipment applicable to metallographic studies and discusses the preparation of specimens for examination by light optical microscopy. Five major operations for preparation of metallographic specimens are discussed: sectioning, mounting, grinding, polishing, and etching. The discussion covers their basic principles, advantages, types, and applications, as well as the equipment setup. The chapter includes tables that list etchants used for microscopic examination. It also provides information on microscopic examination, microphotography, and the effects of grain size on the structural properties of the material.

Intermetallic phase precipitates in aluminum alloys can often be identified without resorting to chemical analysis. Very often the determination can be made based on the shape, color, and refractive properties of the particular phase. This chapter explains how these visual attributes can be observed using metallographic techniques. It describes, and in many cases illustrates, the characteristic shapes, colors, and optical properties associated with aluminum alloy intermetallic phases and how they can be enhanced through selective etching. It provides an atlas of microstructures comparing the effects of selective etching procedures on various phase constituents in cast aluminum-silicon alloys. The compilation of images demonstrates the use of two types of reagents: those that reveal discontinuities in crystal orientation and grain boundaries, and those that reveal differences in chemical composition.

Organic coatings (paints and plastic or rubber linings), metallic coatings, and nonmetallic inorganic coatings (conversion coatings, cements, ceramics, and glasses) are used in applications requiring corrosion protection. These coatings and linings may protect substrates by three basic mechanisms: barrier protection, chemical inhibition, and galvanic (sacrificial) protection. This chapter begins with a section on organic coating and linings, providing a detailed account of the steps involved in the coating process, namely, design and selection, surface preparation, application, and inspection and quality assurance. The next section discusses the methods by which metals, and in some cases their alloys, can be applied to almost all other metals and alloys: electroplating, electroless plating, hot dipping, thermal spraying, cladding, pack cementation, vapor deposition, ion implantation, and laser processing. The last section focuses on nonmetallic inorganic coatings including ceramic coating materials, conversion coatings, and anodized coatings.

Creep occurs in any metal or alloy at a temperature where atoms become sufficiently mobile to allow the time-dependent rearrangement of structure. This chapter begins with a section on creep curves, covering the three distinct stages: primary, secondary, and tertiary. It then provides information on the stress-rupture test used to measure the time it takes for a metal to fail at a given stress at elevated temperature. The major classes of creep mechanism, namely Nabarro-Herring creep and Coble creep, are then covered. The chapter also provides information on three primary modes of elevated fracture, namely, rupture, transgranular fracture, and intergranular fracture. The next section focuses on some of the metallurgical instabilities caused by overaging, intermetallic phase precipitation, and carbide reactions. Subsequent sections address creep life prediction and creep-fatigue interaction and the approaches to design against creep.

This chapter discusses the ways in which the evolution of filament winding software systems has capitalized on the inherent flexibility of computer numerical controlled winding machines and enhanced their productivity. It provides a detailed discussion on different types of geometries that can be wound, from the simple to the highly complex, with insight into the limitations, advantages, and challenges of each. Components covered include classic axisymmetric parts (rings, pipes, driveshafts, pipe reducers, tapered shafts, closed-end pressure vessels, and storage tanks), nonround sections (aeromasts, airfoils, box sections, and fuselage sections), curved-axis parts (elbows, ducts), and special applications (tees). Basic winding concepts, such as band pattern, are discussed and explained, and some simple predictive formulae are introduced. The chapter also provides examples of programming various geometries using advanced software tools and discusses how various materials, such as rovings, tow-preg, prepreg tape, and woven materials, affect winding program generation.

This chapter serves as a study and guide on the main phase constituents of cast aluminum-silicon alloys, alpha-Al solid solution and Si crystals. The first section focuses on the structure of Al-Si castings in the as-cast state, covering the morphology of the alpha-Al solid solution grains and the process by which they form. It describes how cooling rates, temperature gradients, and local concentrations influence the topology of the crystallization front, and how they play a role in determining the morphology and dispersion degree of the grains observed in cross sections of cast parts. It also describes the mechanism behind dendritic grain crystallization and how factors such as surface tension, capillary length, and lattice symmetry affect dendritic arm size and spacing. The section that follows examines the morphology of the silicon crystals that form in aluminum-silicon castings and its effect on properties and processing characteristics. It discusses the faceted nature of primary Si crystals and the modification techniques used to optimize their shape. It also describes the morphology of the (alpha-Al + Si) eutectic, which can be lamellar or rodlike in shape, and explains how it can be modified through temperature control or alloy additions to improve properties such as tensile strength and plasticity and reduce shrinkage.

This chapter, a detailed account of furnaces and related equipment for heat treating, begins by describing three basic modes of heat transmission, namely conduction, convection, and radiation, followed by a discussion on the working principle, applications, advantages, and disadvantages of furnaces classified based on the heat transfer medium employed. The types of furnaces covered are batch-type, continuous-type, liquid bath, fluidized bed, and vacuum. The subsequent sections provide information on furnace parts, fixtures, quenching mediums, and quenching systems. The final section of the chapter describes the types of atmospheres available, emphasizing their applications and limitations.

A systematic procedure for minimizing risks involved in heat treated steel components requires a combination of metallurgical failure analysis and fitness for service with respect to safety and reliability based on risk analysis. This chapter begins with an overview of heat treat processing of steels. This is followed by sections on various aspects of heat treatment design and heat treating practices for minimizing distortion. Influence of design, steel grade, and condition is then illustrated in the examples of failures due to heat treatment. A procedure is analyzed to improve the performance of the design process of a component. A heat-transfer model, coupling with a phase transformation model, a thermomechanical model, and a thermochemical model, is also considered. The chapter further provides information on the failure aspects of and heat treatment procedures applied to welded components. It ends with a section on risk-based approach applicable to heat treated steel components.

Corrosion testing and monitoring are powerful tools in the fight to control corrosion. This chapter provides a general overview of three major categories of corrosion tests, namely laboratory tests, pilot-plant tests, and field tests. It begins with brief sections describing the purposes of corrosion tests, the logical steps in a test program, and the preparation and cleaning of test specimens. The focus then moves on to discuss the types and applications of these test categories and the associated evaluation procedures. Excluding electrochemical tests which are addressed separately in this chapter, the other laboratory tests covered under this category are simulated atmosphere tests, salt-spray tests, and immersion tests. Only corrosion testing in the atmosphere is discussed in the section on field tests. Corrosion monitoring techniques are finally considered, covering the characteristics of corrosion monitoring techniques, the factors to be considered in selecting a corrosion-monitoring method, and the strategies in corrosion monitoring.

Phase diagrams are graphical representations that show the phases present in the material at various compositions, temperatures, and pressures. This chapter begins with a section describing the construction of phase diagrams for the simple binary isomorphous system. A binary phase diagram can be used to determine three important types of information: the phases that are present, the composition of the phases, and the percentages or fractions of the phases. The chapter then describes the construction of one common type of binary phase diagram i.e., the eutectic alloy system. The major eutectic systems include the aluminum-silicon eutectic system and the lead-tin eutectic system. The chapter discusses the construction of eutectic phase diagrams from free energy curves. It also provides information on peritectic, monotectic, and solid-state reactions in alloy systems. The presence of intermediate phases is also described. Finally, a brief section provides some information on ternary phase diagrams.

This chapter describes three approaches for 3D hot-spot localization of thermally active defects by lock-in thermography (LIT). In the first section, phase-shift analysis for analyzing stacked die packages is performed. The second example employs defocusing sequences for the localization of resistive electrical shorts in 3D architectures, and the third operates in cross sectional LIT mode to investigate defects in the insulation liner of Through Silicon Vias. All three approaches allow for a precise localization of thermally active defects in all three spatial dimensions to guide subsequent high-resolution physical analyses.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

During fusion welding, the thermal cycles produced by the moving heat source causes physical state changes, metallurgical phase transformations, and transient thermal stresses and metal movement. This chapter begins by discussing weld metal solidification behavior and the solid-state transformations of the main classes of metals and alloys during fusion welding. The main classes include work- or strain-hardened metals and alloys, precipitation-hardened alloys, transformation-hardened steels and cast irons, stainless steels, and solid-solution and dispersion-hardened alloys. The following section provides information on the residual stresses and distortion that remain after welding. The focus then shifts to distortion control of weldments. Inclusions and cracking are discussed in detail. The chapter also discusses the causes for reduced fatigue strength of a component by a weld: stress concentration due to weld shape and joint geometry; stress concentration due to weld imperfections; and residual welding stresses. Inspection and characterization of welds are described in the final section of this chapter.

This chapter presents a comprehensive coverage of mechanical fastening methods. It begins with a discussion on the advantages and disadvantages of mechanical fastening followed by sections providing information on mechanically fastened joints and the selection of the correct fastener system. The chapter then describes important structural fasteners, namely bolts, screws, pins, collar fasteners, rivets, blind fasteners, machine pins, and spring clip fasteners. The following sections describe the process involved in presses, shrink fits, hole generation, and fastener installation. The chapter ends with information on miscellaneous mechanical fastening methods.

Adhesive bonding is a widely used industrial joining process in which a polymeric material is used to join two separate pieces (the adherends or substrates). This chapter begins with a discussion on the advantages and disadvantages of adhesive bonding, followed by a section providing information on the theory of adhesion. The chapter then describes the considerations for designing adhesively bonded joints and for testing or characterizing adhesive materials. The following section covers the characteristics of the most important synthetic adhesive systems and five groups of adhesives, namely structural, hot melt, pressure sensitive, water based, and ultraviolet and electron beam cured. The chapter ends with a discussion on some general guidelines for adhesive bonding and the basic steps in the adhesive bonding process.

Beryllium, despite its relatively simple atomic structure, possesses a wide range of useful engineering properties. It has the highest strength-to-weight ratio and modulus of elasticity among structural metals and is an important alloy addition in copper, nickel, and aluminum alloys. It also has excellent thermal properties, low atomic mass, a small x-ray absorption cross section, and a large neutron scattering cross section. This brief introductory chapter provides an overview of the unique qualities of beryllium along with typical applications and uses.