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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting...
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Published: 01 November 2019
Fig. 3 One type of sample sectioning block assembled and on grinding wheel. Upper image is actual block, lower image is a cartoon of the block showing components More
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Published: 01 November 2019
Fig. 11 Modified sectioning block for large samples. Top is the cartoon showing the components. Bottom shows the actual block with sample. More
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Published: 01 November 2019
Figure 7 Failure site after cross sectioning by FIB again inspected by SEM [4] . More
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Published: 01 November 2019
Fig 14 Drawing of oxide VCSEL prepared by FIB for cross-sectioning (top) or plan-view imaging (bottom). Plan view image shows DLD network originating from the etch hole and traveling into emitting area. More
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Published: 01 November 2019
Figure 4 X-ray CT analysis shows the virtual sectioning of a hermetically sealed Polymer Ta-CAP from three different directions. More
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