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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030115
EISBN: 978-1-62708-349-2
... Abstract Transmitted-light methods reveal more details of the morphology of fiber-reinforced polymeric composites than are observable using any other available microscopy techniques. This chapter describes the various aspects relating to the selection and preparation of ultrathin-section...
Abstract
Transmitted-light methods reveal more details of the morphology of fiber-reinforced polymeric composites than are observable using any other available microscopy techniques. This chapter describes the various aspects relating to the selection and preparation of ultrathin-section specimens of fiber-reinforced polymeric composites for examination by transmitted-light microscopy techniques. The preparation steps covered are a selection of the rough section, preparation of the rough section for preliminary mounting, grinding and polishing the primary-mount first surface, mounting the first surface on a glass slide, and preparing the second surface (top surface). The optimization of microscope conditions and analysis of specimens by microscopy techniques are also covered. In addition, examples of composite ultrathin sections that are analyzed using transmitted-light microscopy contrast methods are shown throughout.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting...
Abstract
Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2016
DOI: 10.31399/asm.tb.ascaam.t59190147
EISBN: 978-1-62708-296-9
... in chemical composition. cast aluminum-silicon alloys etching intermetallic phase microstructure phase constituents 4.1 Visual Attributes of the Intermetallic Phase Precipitates in Aluminum Alloy Microstructure MICROSCOPIC OBSERVATION of metallographic cross sections allows...
Abstract
Intermetallic phase precipitates in aluminum alloys can often be identified without resorting to chemical analysis. Very often the determination can be made based on the shape, color, and refractive properties of the particular phase. This chapter explains how these visual attributes can be observed using metallographic techniques. It describes, and in many cases illustrates, the characteristic shapes, colors, and optical properties associated with aluminum alloy intermetallic phases and how they can be enhanced through selective etching. It provides an atlas of microstructures comparing the effects of selective etching procedures on various phase constituents in cast aluminum-silicon alloys. The compilation of images demonstrates the use of two types of reagents: those that reveal discontinuities in crystal orientation and grain boundaries, and those that reveal differences in chemical composition.
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Published: 01 March 2000
Fig. 32 Automatic section stacker. (1) Section stacker depositing in section basket. Source: SMS Engineering Inc.
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Published: 01 August 2018
Fig. 17.84 Isopleth section (section with constant silicon content) at 2.5% Si of the Fe-C-Si phase diagram. Gr: graphite, α: ferrite, γ: austenite. Silicon increases the eutectoid equilibrium temperature. During cooling, austenite in equilibrium with graphite may start transforming to ferrite
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Published: 01 November 2019
Figure 12 Typical cross-section created by FIB milling. A polished cross-section is flanked at the sides by material re-deposition.
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Published: 01 December 2006
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Published: 01 December 2006
Fig. 7.79 Section die for the production of the steel section at right. The die aperture has a heavily rounded entry. The mantle surface of the die is cylindrical, with a shoulder for location in the die holder. Source: Krupp/Hoesch, Schwerte
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in Programming Techniques, Computer-Aided Manufacturing, and Simulation Software
> Composite Filament Winding
Published: 01 September 2011
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Published: 01 December 2006
Fig. 2.15 (a) Carriage shell cross section ICE2 and (b) carriage shell cross section ICE3, self-supporting using welded large section technology. Source: ADtranz
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Published: 01 December 2006
Fig. 2.52 Cross section of an 800 mm wide large section in the alloy AlMgSi0.5 for the production of fixing plates for pneumatic control elements. Source: Alusuisse
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in The Effects of Lightning Strikes on Polymeric Composites
> Optical Microscopy of Fiber-Reinforced Composites
Published: 01 November 2010
Fig. 15.3 Cross section taken at the edge of the strike zone corresponding to section plane A in Fig. 15.1 . The micrographs are taken away from the main damage area to show the effects of interply arcing. A Kevlar stitch is shown between the carbon fibers. (a) Slightly uncrossed polarized
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted...
Abstract
Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.
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Published: 01 December 2015
Fig. 13 Section of ASTM A106 carbon steel pipe with wall severely damaged by hydrogen attack. The pipe failed after 15 months of service in hydrogen-rich gas at 34.5 MPa (5000 psig) and 320 °C (610 °F). (a) Overall view of failed pipe section. (b) Microstructure of hydrogen-attacked pipe near
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Published: 01 December 2015
Fig. 15 Internal surface of carbon steel pipe section damaged by cavitation
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Published: 01 October 2011
Fig. 2.13 Section through an edge dislocation (indicated by the symbol ⊥) with an axis perpendicular to the plane of the illustration and line dislocation. (a) Positive edge dislocation, (b) negative edge dislocation
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Published: 01 October 2011
Fig. 10.24 Effect of cast section size on the fatigue properties of pearlitic and ferritic ductile irons
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Published: 01 October 2011
Fig. 15.12 Micrograph of a polished and etched section through a pit with the start of a fatigue crack at the bottom of the pit
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Published: 01 October 2011
Fig. 16.9 Crack origin subsurface in a gear tooth section due to rolling-contact fatigue. Progression was parallel to surface and inward away from surface. Not etched. Original magnification: 60×
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in Consequences of Using Advanced High-Strength Steels
> Advanced-High Strength Steels: Science, Technology, and Applications
Published: 01 August 2013
Fig. 12.2 Measured press load for a hat-section cross member. Source: Ref 12.2
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