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Book Chapter
Cross-Sectioning: Scribing and Cleaving
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting...
Abstract
Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.
Image
Types of scribers and scribing tips. a) Handheld scribers with 4-6” handles...
Available to PurchasePublished: 01 November 2019
Figure 7 Types of scribers and scribing tips. a) Handheld scribers with 4-6” handles. b) Tip of diamond pen style scriber c) Wedge shaped diamond indenter from a tool with integrated weak point and cleaving d) Sharp tip from handheld diamond scribe (large lines shown on the scale are in mm
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Image
Scribing device mounted in one of the ports of the nosepiece. Before scribi...
Available to Purchase
in The Metallurgical Microscope
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 5.66 Scribing device mounted in one of the ports of the nosepiece. Before scribing, the specimen should be firmly mounted in clay on a glass or metal slide on the microscope stage.
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Image
The short scribe is used for crystalline materials while the long scribe is...
Available to PurchasePublished: 01 November 2019
Figure 5 The short scribe is used for crystalline materials while the long scribe is used for amorphous materials or to cleave counter to a crystal plane.
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Image
Copper film on (100) silicon cleaved after making a short scribe shows mirr...
Available to PurchasePublished: 01 November 2019
Figure 11 Copper film on (100) silicon cleaved after making a short scribe shows mirror finish edge.
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Image
Published: 01 November 2019
Figure 13 Sample cleaved at 45 degrees to (100) plane using a long scribe.
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Image
Cleaving over an edge. (a) Lay the scribe mark with the sample parallel to ...
Available to PurchasePublished: 01 November 2019
Figure 15 Cleaving over an edge. (a) Lay the scribe mark with the sample parallel to the ruler edge; (b) Using forefingers, push on either side of the scribe mark to initiate the cleave.
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Image
Photograph of a scribe device for the upright metallurgical microscope. The...
Available to Purchase
in The Metallurgical Microscope
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 5.51 Photograph of a scribe device for the upright metallurgical microscope. The device fits into an objective port on the nosepiece. Note the offset diamond tip that is rotated to produce a scribed circle around the feature on the specimen surface.
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Image
An example of a scribed groove around a oxide stringer-type nonmetallic inc...
Available to Purchase
in The Expanded Metallographic Laboratory
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 6.26 An example of a scribed groove around a oxide stringer-type nonmetallic inclusion. 100×
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Image
Effects of friction and die angle on distortion of a vertical line scribed ...
Available to PurchasePublished: 30 September 2023
Figure 9.9: Effects of friction and die angle on distortion of a vertical line scribed on the cross section of a round bar.
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Image
Weak points made by diamond scribers. a) microline indent made by an indent...
Available to PurchasePublished: 01 November 2019
Figure 4 Weak points made by diamond scribers. a) microline indent made by an indent and cleaving system; b) handheld scribe, free hand; c-e) various scribes using a ruler as a straight edge.
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Image
Plan-view EBIC of 60x600 µm GaAs QW stripe laser which was intentionally da...
Available to Purchase
in Failure Analysis and Reliability of Optoelectronic Devices[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Fig 11 Plan-view EBIC of 60x600 µm GaAs QW stripe laser which was intentionally damaged with two diamond scribes. Note the ❬100❭ DLDs that travel out of the scribes, and toward the lasing stripe (after [4] ).
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Image
(a) The portion of the sample to be used is positioned between the tweezers...
Available to PurchasePublished: 01 November 2019
Figure 17 (a) The portion of the sample to be used is positioned between the tweezers and the sample edge is scribed along the desired cleave line. The analyst then presses firmly on the top of sample. (b) The sample is cleaved in two pieces along the desired scribe line.
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Image
Expansion of surface area in back extrusion of a cup. (a) Expansion of a sc...
Available to PurchasePublished: 30 September 2023
Figure 11.18: Expansion of surface area in back extrusion of a cup. (a) Expansion of a scribed ring; (b) effect of punch profile on the rate of expansion in extrusion of a steel can with 76.5% reduction.
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Image
Cross-section of glass substrate showing: (a) the side of the substrate whe...
Available to PurchasePublished: 01 November 2019
Figure 6 Cross-section of glass substrate showing: (a) the side of the substrate where the weak point was placed, (b) the area of the initiation scribe, and (c) the area away from the weak point where the cleave was allowed to propagate.
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Image
Micrographs of a small titanium nitride inclusion in A8 tool steel. (a) Sur...
Available to Purchase
in The Metallurgical Microscope
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 5.67 Micrographs of a small titanium nitride inclusion in A8 tool steel. (a) Surrounded by three circular scribe marks and (b) a closer view of the inner circle showing the inclusion (see arrow). Vilella’s etch. (a) 50× and (b) 300×
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Book Chapter
The Metallurgical Microscope
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400109
EISBN: 978-1-62708-258-7
Abstract
This chapter describes the various features of the metallurgical microscope. Key concepts are defined such as resolving power, the virtual image, bright- and dark-field illumination, numerical aperture, focal length, image contrast, depth of field, and spherical and chromatic aberration. Metallurgical microscope features such as apochromatic objectives, hyperplane oculars, vertical illuminators, counting reticles, widefield oculars, polarization filters, field diaphragms, interferometers, and tungsten-halogen lamps are explained. The optical system, nosepiece, types of objectives (the lens assembly close to the specimen) and eyepieces, and components of the illumination system are all explained. The last part of this chapter describes special procedures involved in using and calibrating the metallurgical microscope.
Book Chapter
The Expanded Metallographic Laboratory
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400149
EISBN: 978-1-62708-258-7
... that have been etched will not yield accurate results, because of the roughened and chemically altered surface. In an etched specimen, the metallographer must find the area of interest, mechanically scribe a circular groove around the area, and then lightly polish the specimen to remove the etch...
Abstract
Several specialized instruments are available for the metallographer to use as tools to gather key information on the characteristics of the microstructure being analyzed. These include microscopes that use electrons as a source of illumination instead of light and x-ray diffraction equipment. This chapter describes how these instruments can be used to gather important information about a microstructure. The instruments covered include image analyzers, transmission electron microscopes, scanning electron microscopes, electron probe microanalyzers, scanning transmission electron microscopes, x-ray diffractometers, microhardness testers, and hot microhardness testers. A list of other instruments that are usually located in a research laboratory or specialized testing laboratory is also provided.
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