Search Results for science

This article summarizes the results of work completed by the ASM Thermal Spray Society Advisory Committee to identify key research challenges and opportunities in the thermal spray field. It describes and prioritizes research priorities related to emerging process methods, thermal spray markets and applications, and process robustness, reliability, and economics.

This chapter covers the early studies and various discoveries by metals researchers to study the internal structure of metals. The topics covered include light microscopy, phase diagrams, X-ray diffraction, principles of precipitation hardening, and dislocation theory.

This chapter reviews the current understanding of high-pressure cold spraying for different materials, covering widely accepted general mechanisms for particle deposition and the processes and parameters involved. It begins by reviewing the mechanisms of bonding. An overview of the optimization of the critical process parameters for improving coating qualities is then provided. This is followed by a separate section dealing with bonding between different materials and addressing influences on adhesion to the substrate as well as the cohesion between dissimilar coating constituents. The knowledge of the basic science and mechanisms finally allows for discussion on the requirements for suitable cold spray equipment and of the parameter sets needed for successful coating deposition.

This chapter provides an overview of the tools and techniques, as well as some of the underlying theory, that have proven useful for process modeling and simulation. It begins by presenting the framework of a thermoset cure model that accounts for kinetics, viscosity, heat transfer, flow, voids, and residual stress. It then discusses each variable in detail, explaining how it affects the cure process, how it is measured, and how it can be expressed mathematically in the form of a simple model. The discussions throughout the chapter are supported by numerous images, diagrams, and data plots.

This chapter explains the distinction between materials and matter through the concept of microstructure. It presents the history of matter science and the establishment of metallography. The chapter provides an overview of the progress of steel technology, progress in synthetic polymers and ceramics, and establishment and development of materials science.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.

Fracture mechanics is the science of predicting the load-carrying capabilities of cracked structures based on a mathematical description of the stress field surrounding the crack. The fundamental ideas stem from the work of Griffith, who demonstrated that the strain energy released upon crack extension is the driving force for fracture in a cracked material under load. This chapter provides a summary of Griffith’s work and the subsequent development of linear elastic and elastic-plastic fracture mechanics. It includes detailed illustrations and examples, familiarizing readers with the steps involved in determining strain energy release rates, stress intensity factors, J-integrals, R-curves, and crack tip opening displacement parameters. It also covers fracture toughness testing methods and the effect of measurement variables.