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scanning transmission electron microscopy (STEM)
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Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.9781627082921
EISBN: 978-1-62708-292-1
Book: STEM in SEM Introduction to Scanning Transmission Electron Microscopy for Microelectronics Failure
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.t56000001
EISBN: 978-1-62708-292-1
... Abstract This chapter discusses the principles of scanning transmission electron microscopy (STEM) as implemented using conventional scanning electron microscopes (SEMs). It describes the pros and cons of low-energy imaging and diffraction, addresses basic hardware requirements, and provides...
Abstract
This chapter discusses the principles of scanning transmission electron microscopy (STEM) as implemented using conventional scanning electron microscopes (SEMs). It describes the pros and cons of low-energy imaging and diffraction, addresses basic hardware requirements, and provides information on imaging modes, detector positioning and alignment, and the effect of contrast reversal. It also discusses beam convergence and angular selectivity, the use of application-specific masks, and how to generate grain orientation maps for different material systems.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... preparation involves thinning the area of interest containing the defect to achieve electron transparency, which is an irreversible destructive process. A variety of TEM operation modes and techniques, including the conventional parallel beam illumination TEM, scanning transmission electron microscopy (STEM...
Abstract
The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.
Book: STEM in SEM Introduction to Scanning Transmission Electron Microscopy for Microelectronics Failure
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.t56000020
EISBN: 978-1-62708-292-1
... at each SEM beam raster spot and reconstruct various real-space images based on those diffraction patterns. This image reconstruction approach is one of numer- ous recent developments in conventional scanning and transmission electron microscopy that also lends itself well to STEM-in-SEM. The Future...
Abstract
This chapter discusses the setup and use of a transmission electron detector in a typical scanning electron microscope (SEM). It describes the arrangement and function of the primary components in the detector, following the signal path from the sample to a micromirror array where it is directed by the user to either a CMOS sensor (to record diffraction patterns) or a photomultiplier tube (to observe real-space images). The chapter discusses some of the nuances of digital imaging and diffraction and includes examples in which transmission electron detectors are used to analyze gold films, carbon nanotubes, zeolite sheets, and monolayer graphene. It also describes emerging techniques, including four-dimensional STEM, thermal diffuse scattering, energy filtering, aberration correction, and atomic resolution imaging.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220085
EISBN: 978-1-62708-259-4
... is still the most appropriate approach for fine precipitates and fine phase dispersions. Dislocations and their orientations in a crystal can be observed and identified. 6.3 Scanning Transmission Electron Microscopy Like a SEM, scanning transmission electron microscopy (STEM) uses a finely...
Abstract
This chapter discusses the use of electron microscopy in metallographic analysis. It explains how electrons interact with metals and how these interactions can be harnessed to produce two- and three-dimensional images of metal surfaces and generate crystallographic and compositional data as well. It discusses the basic design and operating principles of scanning electron microscopes, transmission electron microscopes, and scanning transmission electron microscopes and how they are typically used. It describes the additional information contained in backscattered electrons and emitted x-rays and the methods used to access it, namely wavelength and energy dispersive spectroscopy and electron backscattering diffraction techniques. It also describes the role of focused ion beam milling in sample preparation and provides information on atom probes, atomic force microscopes, and laser scanning microscopes.
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in About the Authors
> STEM in SEM<subtitle>Introduction to Scanning Transmission Electron Microscopy for Microelectronics
Published: 23 January 2020
Holm
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in About the Authors
> STEM in SEM<subtitle>Introduction to Scanning Transmission Electron Microscopy for Microelectronics
Published: 23 January 2020
Caplins
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400149
EISBN: 978-1-62708-258-7
...). Another electron microscope, used mainly in a research environment, is the scanning transmission electron microscope (STEM). A description of these four electron microscopes is given subsequently. First, we must understand why electron microscopes are important tools for metallographic analysis...
Abstract
Several specialized instruments are available for the metallographer to use as tools to gather key information on the characteristics of the microstructure being analyzed. These include microscopes that use electrons as a source of illumination instead of light and x-ray diffraction equipment. This chapter describes how these instruments can be used to gather important information about a microstructure. The instruments covered include image analyzers, transmission electron microscopes, scanning electron microscopes, electron probe microanalyzers, scanning transmission electron microscopes, x-ray diffractometers, microhardness testers, and hot microhardness testers. A list of other instruments that are usually located in a research laboratory or specialized testing laboratory is also provided.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 30 September 2024
DOI: 10.31399/asm.tb.pmamfa.t59400391
EISBN: 978-1-62708-479-6
... PP polypropylene SAD selected area diffraction SE secondary electron SEM scanning electron microscopy SL sheet lamination SLA stereolithography SLM selective laser melting SLS selective laser sintering STEM scanning transmission electron microscopy TEM...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 September 2024
DOI: 10.31399/asm.tb.pmamfa.t59400027
EISBN: 978-1-62708-479-6
...-field mode. In bright-field TEM, the study of nanoparticles with higher atomic mass appears to be dark due to electron scattering by nanoparticles. Scanning transmission electron microscopy (STEM) offers several imaging modes, such as high-angle annular dark-field and electron energy-loss spectroscopy...
Abstract
This chapter explains how to measure the shape, size, microstructure, and composition of powders as well as their flowability and crystallization behavior. It presents detailed workflows and calculations based on SEM, TEM, FESEM, and STEM imaging, x-ray diffraction, differential scanning calorimetry, EDS and EELS spectroscopy, and powder sieving. It also discusses the measurement of crystallite size, lattice mismatch, and crystallinity and the relationship between surface area and flowability.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
... at low magnification one can increase the working distance which will produce a lower beam deflection angle for a given magnification. Figure 11 Pincushion distortion in a low magnification SEM image. Sample Charging One of the greatest challenges in scanning electron microscopy is how...
Abstract
This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... be incorporated to collect signals with trajectories parallel to the optical axis. In-lens BSE detectors are commonly used to monitor FIB milling processes [21] . Electron transmission detectors enable scanning transmission electron microscopy (STEM) which are useful where features are resolvable to >0.6 nm...
Abstract
With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.tb.hpcspa.t54460121
EISBN: 978-1-62708-285-3
... coatings. The techniques covered are optical microscopy, X-Ray diffraction, scanning electron microscopy, focused ion beam machining, electron probe microanalysis, transmission electron microscopy, and electron backscattered diffraction. The techniques also include electron channeling contrast imaging, X...
Abstract
This chapter elucidates the indispensable role of characterization in the development of cold-sprayed coatings and illustrates some of the common processes used during coatings development. Emphasis is placed on the advanced microstructural characterization techniques that are used in high-pressure cold spray coating characterization, including residual-stress characterization. The chapter includes some preliminary screening of tool hardness and bond adhesion strength, as well as a distinction between surface and bulk characterization techniques and their importance for cold spray coatings. The techniques covered are optical microscopy, X-Ray diffraction, scanning electron microscopy, focused ion beam machining, electron probe microanalysis, transmission electron microscopy, and electron backscattered diffraction. The techniques also include electron channeling contrast imaging, X-Ray photoelectron spectroscopy, X-ray fluorescence, Auger electron spectroscopy, Raman spectroscopy, oxygen analysis, and nanoindentation.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.9781627082815
EISBN: 978-1-62708-281-5
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780383
EISBN: 978-1-62708-281-5
... analysis in SAM; light-element analysis in STEM where scattering is in forward direction Secondary ~5 eV Loosely bound electrons scattered from surface Main signal for image formation in SEM SEM, scanning electron microscope; STEM, scanning transmission electron microscope; SAM, scanning Auger...
Abstract
This article covers common techniques for surface characterization, including the modern scanning electron microscopy and methods for the chemical characterization of surfaces by Auger electron spectroscopy, X-ray photoelectron spectroscopy, and time-of-flight secondary ion mass spectrometry. The principles of surface analysis and some of the applications of the technique in polymer failure studies are also provided.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780433
EISBN: 978-1-62708-281-5
...-butadiene-styrene styrene-ethylene-butylene-styrene size-exclusion chromatography scanning electron microscopy short- ber-reinforced polymer secondary ion mass spectroscopy styrene-maleic anhydride sheet molding compound sheet molding compound Society of Plastics Engineers structural reaction injection...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110434
EISBN: 978-1-62708-247-1
... or other methods for viewing in a TEM (transmission electron microscope) or STEM (scanning transmission electron microscope.) Thin samples can also be viewed in an ordinary SEM by using a STEM detector [5] or a special sample holder [6 , 7] . For EDS elemental mapping of thin samples in a SEM, one...
Abstract
This article provides an overview of the most common micro-analytical technique in the failure analysis laboratory: energy dispersive X-ray spectroscopy (EDS). It discusses the general characteristics, advantages, and disadvantages of some of the X-ray detectors attached to the scanning electron microscope chamber including the lithium-drifted EDS detector, silicon drift detector (SDD), and wavelength dispersive X-ray detector. The article then provides information on qualitative and quantitative X-ray analysis programs followed by a discussion on EDS elemental mapping. The discussion includes a comparison of scanning transmission electron microscope-EDS elemental mapping and mapping with an SDD. A brief section is devoted to the discussion on the artifacts that occur during X-ray mapping.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... wavelengths. Introduction Multiple scanning optical microscopy methods for integrated circuit (IC) FA have become essential tools to locate and diagnose defects and failure sites. The popularity of laser-based approaches stems from their relatively straight forward application, information delivered...
Abstract
This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... requirements and hopefully dispel many of the associated myths and assumptions. Many have heard Analysts and Scientists in our field refer to sample preparation as “Black Magic” stemming from a lack of understanding for the complexities of sample preparation. Leading to an oversight of the nearly infinite...
Abstract
The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.
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