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Published: 01 December 2001
Fig. 10 Effect of temperature and alloying on the scaling behavior of gray irons after 200 h at temperature in air. Source: Ref 19 Iron Type Chemical analysis, % TC Si Mn P Ni Cr Cu A Low-Si gray iron 2.98 1.14 1.07 0.18 … … … B Ni-Cr gray iron 3.45 1.64
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Image
Published: 01 December 2001
Fig. 22 Scaling losses developed in 12 intermittent heating and cooling cycles by various stainless steels
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in Surface Engineering to Change the Surface Chemistry
> Surface Engineering for Corrosion and Wear Resistance
Published: 01 March 2001
Fig. 8 Oxidation of steels in air at the temperature at which scaling is less than 10 mg/cm 2 . Source: Ref 22
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Image
in Failures Due to Lack of Quality Control or Improper Quality Control
> Failure Investigation of Boiler Tubes: A Comprehensive Approach
Published: 01 December 2018
Fig. 6.156 SEM micrograph of the crack surface showing presence of scaling and microcracks, 1000×
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Image
in Laser-Based, Photon, and Thermal Emission
> Electronic Device Failure Analysis Technology Roadmap
Published: 01 November 2023
Fig. 1 Technology scaling trends until 2028 ( Ref 9 ). More-Moore Technology scaling roadmap, with lateral gate all-arounds (LGAA) predicted to be introduced in 2022 (node 3 nm), and complimentary field-effect transistor (CFET) in 2028 (node 1.5 nm). Copyright 2022 IEEE, Ref 9
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in Laser-Based, Photon, and Thermal Emission
> Electronic Device Failure Analysis Technology Roadmap
Published: 01 November 2023
Fig. 2 (a) Spatial resolution requirements with technology scaling trends until 2028. The required resolution (in blue) appears to flatten out at about 100 nm. The available microscope resolution (in green) tracks the required resolution well. With visible probing, the spatial resolution
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in Laser-Based, Photon, and Thermal Emission
> Electronic Device Failure Analysis Technology Roadmap
Published: 01 November 2023
Fig. 3 More-than-Moore scaling with heterogeneous integration, such as 2.5D, die-on-die stacking such as the 3D, and disruptive backside power-delivery schemes introduced as early as 2025 ( Ref 29 )
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in Leading Edge Technologies: Backside Power Delivery
> Electronic Device Failure Analysis Technology Roadmap
Published: 01 November 2023
Fig. 3 IMEC Technology scaling roadmap to iN3. BPR enables transition from 6T to 5T for 1 fin or nanosheet devices to reduce area by 17% without pitch scaling. Standard-cell track-height reduction enabled by BPR allows logic area to be scaled without requiring a reduction in minimum feature
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Published: 01 November 2013
Fig. 8 Oxidation of steels in air at the temperature at which scaling is less than 10 mg/cm 2 . Source: Ref 5
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Published: 01 December 2000
Fig. 8.4 Scaling rates of titanium and some titanium alloys in air at various temperatures
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... Abstract Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis...
Abstract
Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis. This article provides an overview of CSPs and their classification as well as their advantages and applications, and reveals some of the challenges in performing failure analysis on CSPs, particularly for CSPs in special package configurations such as stacked die multi-chip-packages (MCPs) and wafer level CSPs (WLCSPs). The discussion covers special requirements of CSPs such as precision decapsulation for fine ball grid array packages, accessing the failing die for MCP packages, and careful handling for WLCSP. Solutions and best practices are shared on how to overcome these challenges. The article also presents a few case studies to demonstrate how failure analysis work on CSPs can be successfully completed.
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Published: 01 December 2008
Fig. 4 Metal with oxide scale. (a) A protective scale that prevents gas access. (b) Schematic of electrochemical oxidation through a protective oxide scale that serves as electrolyte and electron lead. The case is for mobile cations
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Published: 01 December 2018
Fig. 6.28 (a) Dark brown scale on OD surface. (b) Brownish black scale on the ID surface of a tube
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720021
EISBN: 978-1-62708-305-8
... Abstract Visual inspection is the most important method of inspection of materials. This chapter describes the procedures involved in visual inspection such as identification markings, identification of defects caused by heating problems, scaling of materials, cracking characterization...
Abstract
Visual inspection is the most important method of inspection of materials. This chapter describes the procedures involved in visual inspection such as identification markings, identification of defects caused by heating problems, scaling of materials, cracking characterization, and measurement of material dimensions. It discusses the mechanisms, advantages, limitations, components, and applications of various visual inspection tools, namely magnifying devices, lighting for visual inspection, measuring devices, miscellaneous measuring equipment, record-keeping devices, and macroetching.
Image
Published: 01 August 1999
Fig. 12.1 (Part 1) Oxide scales formed below 570 °C. Figures (a) to (c) show the same area. (a) to (d) High-purity iron. (a) Oxidized at 550 °C. Unetched. 500×. (b) Cathodic ion beam (details given in Ref 3 ). 500×. (c) Scanning electron micrograph. Cathodic ion beam (details given
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Published: 01 August 1999
Fig. 12.2 (Part 1) Oxide scale formed above the A 3 temperature and rapidly cooled. 0.3% C (0.29C-0.03Si-0.56Mn, wt%) normalized. Heated in air at 800 °C for 30 min. Cooled to room temperature at ~500 °C/h. (a) The white band at the top of the micrographs is an electrodeposit of nickel used
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Published: 01 August 1999
Fig. 12.2 (Part 2) Oxide scale formed above the A 3 temperature and rapidly cooled. 0.3% C (0.29C-0.03Si-0.56Mn, wt%) normalized. Heated in air at 800 °C for 30 min. Cooled to room temperature at ~500 °C/h. (a) The white band at the top of the micrographs is an electrodeposit of nickel used
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Image
Published: 01 August 1999
Fig. 12.3 (Part 1) Oxide scale formed above the A 3 temperature and slowly cooled. 0.3% C(0.29C-0.03Si-0.56Mn, wt%) normalized. Heated in air at 800 °C for 30 min, cooled to room temperature at ~25 °C/min. The white band at the top of micrographs (a) to (c) is an electrodeposit of nickel used
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Image
Published: 01 August 1999
Fig. 12.3 (Part 2) Oxide scale formed above the A 3 temperature and slowly cooled. 0.3% C (0.29C-0.03Si-0.56Mn, wt%) normalized. Heated in air at 800 °C for 30 min, cooled to room temperature at ~25 °C/min. The white band at the top of micrographs (a) to (c) is an electrodeposit of nickel
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Image
Published: 01 August 1999
Fig. 12.4 (Part 1) Oxide scale formed at 700 °C. High-purity 1%C (0.99C-0.003Si-0.0005Mn, wt%). Austenitized at 950 °C, cooled slowly, oxidized at 700 °C in pure dry oxygen for (magnification shown in parentheses): (a) 2 min (2000×). (b) 1 h (750×). (c) 20 h (500×), and (d) 20 h (500×).
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