Search Results for sample mounting

Specimen preparation is the first step that determines the quality of the microstructural information that can be obtained using optical microscopy. This chapter describes the sample preparation methods that are applicable to most types of composite materials containing short discontinuous or continuous fibers. The sample preparation methods cover documentation and labeling of samples, sectioning the composite, clamp-mounting composite samples, mounting composite samples in casting resins, and the addition of contrast dyes to casting resins. Information on the molds used for mounting composite materials is provided. The steps recommended to achieve a good mounted specimen without voids or specimen pull-out are also described. The chapter discusses the processes for clamping mounted composite samples in automated polishing heads and mounting composite materials for hand polishing. A summary of the mounting technique is also included.

This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

This chapter explains how to prepare material samples for optical microscopy, the most common method for characterizing the microstructure of cast iron and steel. It provides information on sectioning, mounting, polishing, etching, and recording. It describes the nature of surface roughness, the factors that contribute to it, and its effect on image quality. It discusses the use of fixturing and holding devices, includes photographic examples of polishing defects and drying marks, and provides an overview of micrographic etchants and the features they reveal. It also describes the steps involved in replicating part surfaces.

This article presents best practices for the metallographic preparation of specimens produced via thermal spray coating methods. It outlines typical metallographic preparation process flow, highlighting important considerations for obtaining a clear and representative specimen suitable for characterization via examination techniques, such as optical or electron microscopy. The process flow includes preliminary resin infiltration, sectioning, mounting, grinding, and polishing. To aid in the identification and resolution of common issues during subsequent specimen analysis, the article presents common issues, along with causes and mitigation strategies. It describes the processes involved in the interpretation of the thermal spray coating microstructure.

This chapter explains how to prepare metallographic samples for light microscopy and how to anticipate and avoid related problems. It describes standard practices and procedures for sectioning, mounting, grinding, and polishing and identifies common defects along with their causes and cures. It also provides recommendations for handling specific materials and addresses safety concerns.

Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite materials. First, it provides information on grinding and polishing equipment and describes the processes and process variables for sample preparation. Then, the chapter discusses the processes of abrasive sizing for grinding and rough polishing. Next, it provides a summary of grinding methods, rough polishing, and final polishing. Finally, information on common polishing artifacts that can result from any of the steps is provided.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.