Search Results for sample handling

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.

This chapter explains how to prepare metallographic samples for light microscopy and how to anticipate and avoid related problems. It describes standard practices and procedures for sectioning, mounting, grinding, and polishing and identifies common defects along with their causes and cures. It also provides recommendations for handling specific materials and addresses safety concerns.

This article covers common techniques for surface characterization, including the modern scanning electron microscopy and methods for the chemical characterization of surfaces by Auger electron spectroscopy, X-ray photoelectron spectroscopy, and time-of-flight secondary ion mass spectrometry. The principles of surface analysis and some of the applications of the technique in polymer failure studies are also provided.

This chapter covers regulatory requirements, safe handling practices, hazard analysis and control, dismantling and decommissioning, and waste disposal. It also includes references for additional information on government regulations.

Sand and metallic charge materials are two essential and heavy raw materials that are needed for molding and casting. This chapter focuses on planning and provision for storage and handling of the raw materials needed for casting manufacturing. The major raw materials used for molding and casting are metallic charge materials and nonmetallic materials. The chapter also presents the advantages, limitations, and applications of drum or rotary dryers (also known as rotary kiln dryers) and fluidized bed dryers (also known as vibration fluidized bed dryers).

Examining and evaluating the nitrided case is generally accomplished by hardness testing and microscopic examination. This chapter discusses both characterization methods, as well as sample preparation. The chapter also discusses the processes involved in the etching of the sample after microhardness testing and provides practices that contribute to the safe preparation of specimens. Examples of nitrided case microstructures, using optical light microscopy, are also presented.

This chapter discusses the important role of metallography and the metallographer in predicting and understanding the properties of metals and alloys. Examples are presented of a metallographer working as part of a team in a research laboratory of a large steel company and a metallographer working alone at a small iron foundry. The three basic areas in all metallography laboratories are discussed: the specimen preparation area, the polishing/etching area, and the observation/micrography area. Important safety issues in a metallographic laboratory are also considered.

Product design requires an understanding of the mechanical properties of materials, much of which is based on tensile testing. This chapter describes how tensile tests are conducted and how to extract useful information from measurement data. It begins with a review of the different types of test equipment used and how they compare in terms of loading force, displacement rate, accuracy, and allowable sample sizes. It then discusses the various ways tensile measurements are plotted and presents examples of each method. It examines a typical load-displacement curve as well as engineering and true stress-strain curves, calling attention to certain points and features and what they reveal about the test sample and, in some cases, the cause of the behavior observed. It explains, for example, why some materials exhibit discontinuous yielding while others do not, and in such cases, how to determine when yielding begins. It also explains how to determine other properties via tensile tests, including ductility, toughness, and modulus of resilience.

Because of its speed and ease of control, induction heating can be readily automated and integrated with other processing steps such as forming, quenching, and joining. Completely automated heating/handling/control systems have been developed and are offered by induction equipment manufacturers. This chapter deals with materials handling and automation. First, it summarizes basic considerations such as generic system designs, fixture materials, and special electrical problems to be avoided. Next, it describes and provides examples of materials-handling systems in induction billet heating, bar heating, heat treatment, soldering, brazing, and other induction-based processes. The final section discusses the use of robots for parts handling in induction heating systems.

Beryllium-related lung diseases were first reported in the 1930s, several years after the emergence of beryllium metals in manufactured products. Since then, there have been numerous studies around the world and continued refinement of recommendations and safety standards. This chapter provides a summary of the studies that have been conducted along with the findings. It discusses the effects of acute and chronic exposure, toxicity levels, potential sources and risks, treatment, and protective and preventive measures.

This chapter assesses the benefits of using a solid immersion lens (SIL) to detect faults in ICs via optical imaging and laser-stimulation techniques. It discusses the advantages and limitations of different types of SILs and their effect on spatial resolution, spot size, focus depth, and collection efficiency. It also provides a brief overview of technical challenges at the die level.

In dynamic hardness tests, the test force is applied to the defined indenter in an accelerated way (with a high application rate). Dynamic test methods relate hardness to the elastic response of a material, whereas the classical static indentation tests determine hardness in terms of plastic behavior. This chapter describes the most important and widespread dynamic hardness testing methods. These tests fall into two categories: methods in which the deformation is measured and methods in which the energy is measured. Methods that measure deformation include the Poldi hammer method, the shearing force method, the Baumann hammer method, and the Dynatest method. Methods that measure energy include the Shore method, the Leeb method, and the Nitronic method. The chapter concludes with a discussion of applications of dynamic hardness testing.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

This chapter provides details on several specific binder formulations and a discussion of basic binder design concepts. The focus is on customization of the feedstock response to heating, pressurization, or solvent exposure for a specific shaping process. The discussion starts with the requirements of a binder system, the historical progression of binder formulations, and the use of binder alternatives to adapt to specific applications. The importance of binder handling strength to shape preservation is emphasized. The chapter provides information on the binders used for room-temperature shaping, namely slurry and tape casting systems.

Liquid metals are frequently used as a heat-transfer medium because of their high thermal conductivities and low vapor pressures. Containment materials used in such heat-transfer systems are subject to molten metal corrosion as well as other problems. This chapter reviews the corrosion behavior of alloys in molten aluminum, zinc, lead, lithium, sodium, magnesium, mercury, cadmium, tin, antimony, and bismuth. It also discusses the problem of liquid metal embrittlement, explaining how it is caused by low-melting-point metals during brazing, welding, and heat treating operations.

Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis. This article provides an overview of CSPs and their classification as well as their advantages and applications, and reveals some of the challenges in performing failure analysis on CSPs, particularly for CSPs in special package configurations such as stacked die multi-chip-packages (MCPs) and wafer level CSPs (WLCSPs). The discussion covers special requirements of CSPs such as precision decapsulation for fine ball grid array packages, accessing the failing die for MCP packages, and careful handling for WLCSP. Solutions and best practices are shared on how to overcome these challenges. The article also presents a few case studies to demonstrate how failure analysis work on CSPs can be successfully completed.

This chapter discusses the basic steps of a failure investigation. It explains that the first step is to gather and document information about the failed component and its operating history. It advises investigators to visit the failure site as soon as possible to record damages and collect test specimens for subsequent examination and chemical analysis. It also discusses the role of mechanical property testing, the use of nondestructive evaluation, and the final step of generating a report.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

Stainless steels have a wide variety of applications for household products, food-handling equipment, major appliances, medical equipment, and industrial equipment. Stainless is also featured in many architectural designs and monuments. Many of the most important applications of stainless steel can be found in the transportation industry, where both the cutlery martensitic and the chromium-nickel austenitic stainless steels have been used. This chapter provides a detailed discussion on these applications.