Designs and materials continue to become more complex, with novel technologies developed to create them, and novel instruments invented to analyze them. Engineers at all stages of the design and manufacturing process should appreciate the reasons why formal failure analysis is performed. This chapter describes why failure analysis is conducted and outlines the responsibilities of the failure analyst.

This chapter is a brief bibliography of content sources that provide information related to the subject matter of the book.

In the second step of the four-step problem-solving process, the failure analysis team should identify all potential failure causes. This chapter discusses the steps involved in five such techniques for identifying potential causes of failure, namely brainstorming, mind mapping, Ishikawa diagrams, the “five whys” technique, and flow charting.

This chapter describes the nine steps of a failure investigation. The steps add detail to the problem-solving process introduced in Chapter 3. The first five steps are (1) understanding and negotiating the investigation goals, (2) obtaining an understanding of the failure, (3) objectively and clearly identifying all possible root causes, (4) evaluating the likelihood of each root cause, and (5) converging on the most likely root cause(s). Many failure investigations stop at this point, but significant value is provided in the next four steps, which are (6) identifying all possible corrective actions, (7) evaluating each corrective action, (8) selecting the optimal corrective action(s), and (9) evaluating the effectiveness of each corrective action. Each step is discussed in detail with examples along with information on the procedures to be followed and resources needed for the investigation.

A turbine blade in an aircraft engine failed, fracturing at the root above the fir tree region. Fractography indicated that a fatigue crack initiated at the trailing edge of the blade and the final fracture occurred when the crack reached critical length. Although the exact cause of crack initiation could not be established, material defects, improper root loading, and high operating temperatures were ruled out. This chapter describes how investigators came to their conclusions and what they learned through visual and SEM examination and qualitative elemental analysis. It includes images of the microstructure and fracture surfaces and explains what some of the details reveal about the failure.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

Statistics, data analysis, root cause analysis, and problem-solving processes play a key role in failure investigations. This chapter explains how to collect failure investigation data, how to build and maintain a database for company-related failures, and how to use corresponding statistics including type of failure, material, and root cause. It describes the purpose and benefits of conducting a root cause analysis and the factors, namely relative failure importance and company value, that determine when an investigation should be performed. The chapter also discusses the four-step problem-solving process as it applies to failure investigation, how to assemble an investigation team, and the details of organization and planning. It concludes with a case history of the Firestone 500 steel-belted tire failure, stressing the importance of a systematic approach to failure investigations.

This report describes the failure of a gas turbine in a combined-cycle power plant and the examination and tests that were conducted to determine the cause. Based on microstructural analysis, hardness measurements, and tensile tests, the failure was attributed to inadequate clearances in the seal land region between two stages in the compressor section of the rotor. The report also recommends changes to remediate the problem.

This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics that a professional engineer must improve to conduct an effective and successful failure investigation, namely technical skills, communication skills, and technical integrity. The chapter also provides information on the additional basic tools available for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

This chapter explains how to take the known facts of a specific failure, place them in a systematic context to arrive at a logical conclusion, and point to a corrective measure. It presents example examinations to describe a systematic approach to failure examination.

A first-stage compressor blade failed prematurely in an aircraft engine, fracturing at the midpoint of the root transition region. An examination of the fracture surface revealed beach marks, striations, and pitting, indicating that the blade failed by fatigue due to a crack initiated by corrosion pits in the root transition region. The chapter recommends further investigations to determine the cause of pitting, which appears to be confined to the dovetail region.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

A compressor blade made of titanium alloy fractured during an engine test. The material and processing conditions of the blade were found to be satisfactory, turning the focus of the investigation to operating anomalies and human error. A photograph of the failed blade shows well-defined chevron marks along the fracture surface that end in a shear lip on the convex side. Further examination using a SEM shows that the failure was due to overload. Based on these observations and the results of tensile testing and microstructural analysis, investigators concluded that a sudden impact load on the concave side of the blade caused it to fracture.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

Fastening screws used in fuel-injection pumps failed during assembly and were examined to determine the cause. Based on observations and the result SEM fractography and hardness measurements, the screws failed by brittle intergranular fracture due to hydrogen embrittlement associated with plating procedures. The report includes recommendations for improving the quality of the screws.

This chapter discusses the failure of a compressor blade in an aircraft engine and explains how investigators determined the cause. Based on visual examination and the results of SEM fractography and chemical analysis, it was concluded that blade failed due to fatigue fracture originating from nonmetallic inclusions in the blade root.

At the conclusion of a systems failure analysis, the people involved should have a much more in-depth understanding of how the system is supposed to work. The analysis should help understand shortfalls in the design, production, testing, and use of the system. The failure analysis team will have identified other potential failure causes and actions required to preclude future failures. This is valuable knowledge, and it should not be set aside or ignored when the failure analysis team concludes its activities. This chapter is a brief account of the creation of failure analysis libraries, of process guidelines based on previous failure analyses, and of troubleshooting and repair guidelines. Also provided is a listing of the various steps that should be included in a failure analysis procedure.

Failure investigation is an integral part of any design and manufacturing operation, providing critical information to solve manufacturing problems and assist in redesigns. This chapter addresses several aspects of failure investigation, beginning with the challenges of organizing such efforts and the need to define a clear and concise goal, direction, and plan prior to the investigation. It covers the causes of failure and the training and education organizations require to understand and prevent them. The chapter emphasizes the importance of discovering the root cause of failures, and uses examples to explain the factors involved and how to recognize them when the first appear.