Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

Irradiation-assisted stress-corrosion cracking (IASCC) has been a topic of engineering interest since it was first reported in the 1960s, having been observed in stainless steel cladding on light water reactor fuel elements. This chapter summarizes the results of decades of investigation, showing that IASCC can essentially be defined as the intergranular cracking of austenitic alloys in high-temperature water, where both the material and its environment have been altered by radiation. Of the many interactions that can occur when metals and water are exposed to radiation, the international consensus is that the three with the greatest impact on crack growth rates are the formation of material defects, radiation-induced segregation, and chemical reactions that increase the corrosion potential of water. The chapter discusses each of these in great detail, and includes information on predictive modeling as well.

The mechanical properties of a material describe the relations between the stresses acting on the material and its resulting deformations. Stresses capable of producing permanent deformations, which remain after the stresses are removed, are considered in this chapter. The effects of cryogenic temperatures on the mechanical properties of metals and alloys are reviewed in this chapter; the effects on polymers and glasses are discussed briefly. The fundamental mechanisms controlling temperature-dependent mechanical behavior, phenomena encountered in low-temperature testing, and the mechanical properties of some representative engineering metals and alloys are described. Modifications of test procedures for low temperatures and sources of data are also included.

This chapter describes the phenomenological aspects of fatigue and how to assess its effect on the life of components operating in high-temperature environments. It explains how fatigue is measured and expressed and how it is affected by loading conditions (stress cycles, amplitude, and frequency) and factors such as temperature, material defects, component geometry, and processing history. It provides a detailed overview of the damage mechanisms associated with high-cycle and low-cycle fatigue as well as thermal fatigue, creep-fatigue, and fatigue-crack growth. It also demonstrates the use of tools and techniques that have been developed to quantify fatigue-related damage and its effect on the remaining life of components.