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residual-stress analysis

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290099
EISBN: 978-1-62708-306-5
... section provides information on the residual stresses and distortion that remain after welding. The focus then shifts to distortion control of weldments. Inclusions and cracking are discussed in detail. The chapter also discusses the causes for reduced fatigue strength of a component by a weld: stress...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130255
EISBN: 978-1-62708-284-6
... Abstract This chapter provides an overview of the fundamental material- and process-related parameters of quenching on residual stress, distortion control, and cracking. It begins with a description of phase transformations during heating and quenching of steel. This is followed by a section on...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130417
EISBN: 978-1-62708-284-6
... analysis of the microstructure and microhardness in the thin surface layer resulting from the machining process under given machining conditions. The second level of the surface-integrity description includes studies of residual stresses in the surface layer and of mechanical properties of the given...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2020
DOI: 10.31399/asm.tb.phtbp.t59310055
EISBN: 978-1-62708-326-3
... information on the causes and characteristics of residual stresses, distortion, and quench cracking of steel. austenite transformation continuous cooling transformation diagram cooling rate distortion isothermal transformation diagram quench cracking quenchants quenching steel THE...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870201
EISBN: 978-1-62708-314-0
... problem in composite structures. In fact, analysis of residual stresses in composites is probably one of the most complex problems analysts have tried to address, and there is quite a bit of conflicting data in the literature on the various causes of residual stresses and the effects of material, lay-up...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130177
EISBN: 978-1-62708-284-6
... Abstract This chapter provides information on various contributors to failure of carburized and carbonitrided components, with the primary focus on carburized components. The most common contributors covered include component design, selection of proper hardenability, increased residual stress...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550325
EISBN: 978-1-62708-307-2
... affect impact and tensile strength, shrinkage, thermal expansion, and thermal conductivity. It examines the relationship between tensile modulus and temperature, provides thermal property data for selected plastics, and discusses the effect of chemical exposure, operating temperature, and residual stress...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
... check or destructive testing, chemical analysis Loading direction may show failure was secondary Short-term, high-temperature, high-stress rupture has ductile appearance (see creep) Load exceeded the dynamic strength of the part Check for proper alloy and processing as well as proper...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130503
EISBN: 978-1-62708-284-6
... cracking, and hydrogen-assisted reduced ductility. failure analysis steel welds weld discontinuities hydrogen-assisted cracking stress-corrosion cracking fatigue solidification cracking FAILURE ANALYSIS OF STEEL WELDS may be divided into three categories. They include failures due to...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... solder residue from the board mounting process was the root cause of the failure. Figure 1 Red circle highlights the residue observed between Pins A2 and A3 after THB stress. Defects embedded into the package which cannot be seen optically can be seen with 2D and 3D X-ray imaging. X-ray...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870421
EISBN: 978-1-62708-314-0
... Abstract This chapter discusses some of the challenges associated with the analysis of composite structures. It begins with a review of lamina fundamentals and the stress-strain relationships in a single ply under various types of loads. It demonstrates the use of classical lamination theory...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130311
EISBN: 978-1-62708-284-6
... temperatures that can affect steel microstructures, normally above 500 °C. Depending on time and stress conditions, such high temperatures lead to a decrease in hardness that accelerates several die failure mechanisms, especially hot wear, plastic deformation at working temperatures, and heat checking. The...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... effective. Good results for these two quantities tell you that the package is hermetic, the beams are not stuck or impeded, the beam CDs and gaps are good, and the package stress is good. Measuring the resonant frequency is an essential measurement for nearly all MEMS devices for these reasons. More...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... as well as the solder connections. Once the CAP is electrically isolated by cutting the traces on the board, ESR should be measured again. Removal of the CAP from the board should be done with the least amount of thermal and mechanical stress on the CAP, as either one of these could change the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130395
EISBN: 978-1-62708-284-6
... negatively affects the hardenability of powder metal parts ( Table 1 ). It is recommended that the part selected for induction hardening has a density of at least 7 g/cc. Carbon, copper, nickel, and molybdenum are the most commonly used alloying elements in PM parts. The stresses due to high carbon content...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... to enable the diffusion of these elements along the bond wire to the IMC. Moisture is needed for this migration/corrosion and therefore, this is a typical failure mode occurring early in the field. If the bond pad is disrupted, this failure mode was sometime misinterpreted as electrical over stress...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
... constructing on the surface of the die Focused Ion Beam (FIB) deposited tungsten microprobe pads on which to land microprobe needles. Microprobing was required in the failure analysis of defective semiconductor devices to access specific functional nodes in the device to track down and localize the point of...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... the roll, high-temperature oxides were found on the crack faces, strongly suggesting forging laps. Processing can have a large influence on properties and the resulting residual stresses. Typically, this is related to wrong procedures or improperly specified procedures. Ambiguous processes or...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130001
EISBN: 978-1-62708-284-6
...) : Control of microstructure formation Increase of strength, toughness, or perhaps creep resistance Relief of residual stresses and prevention of cracking Control of hardness (and softness) Improvement of machinability Improvement of corrosion resistance or wear resistance...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... moisture/thermal-induced stresses sufficient to exceed the mechanical strength of the materials and interfaces in the package, resulting in “popcorn crack” failures. The term “popcorn crack” was coined due to the sounds of cracking packages near the Vapor Phase Reflow processors. Studies were published...