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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... show normal ring at mesa edge, plus evidence of damage in the bright areas. Fig 26 Lognormal plot of reliability versus time on lifetest for 4 different temperatures: 150°C, 130°C, 110°C, and 90°C (from left to right). Courtesy of Chris Helms at Emcore, after [37] . Fig. 27...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110666
EISBN: 978-1-62708-247-1
... Exponential Distribution where λ = 1. The Weibull Distribution Figure 7 Weibull Distribution Probability Density Function. Abstract Abstract This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... [1] Jacob P. , “Early life field failures in modern automotive electronics – An overview; root causes and precautions” , Microelectronics Reliability Special ESREF edition 2016, MR12038 , http://dx.doi.org/10.1016/j.microrel.2016.07.015 10.1016/j.microrel.2016.07.015 [2] Jacob P...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780157
EISBN: 978-1-62708-268-6
..., which is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing. failure analysis probability reliability statistical distribution statistics FAILURE ANALYSIS can sometimes involve considerations...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180127
EISBN: 978-1-62708-256-3
... for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC. References References...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... Fig. 2 Example failure mode distribution snapshot Fig. 1 Example bitmap application Abstract Abstract Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110279
EISBN: 978-1-62708-247-1
... Abstract Abstract Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130001
EISBN: 978-1-62708-284-6
...Abstract Abstract A systematic procedure for minimizing risks involved in heat treated steel components requires a combination of metallurgical failure analysis and fitness for service with respect to safety and reliability based on risk analysis. This chapter begins with an overview of heat...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780055
EISBN: 978-1-62708-281-5
...Abstract Abstract The key to any successful part development is the proper choice of material, process, and design matched to the part performance requirements. This article presents examples of reliable material performance indicators and common practices to avoid. Simple tools and techniques...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
.... , “ Low temperature wafer bonding for MEMS processes and 3D integration ”, 2012 3rd IEEE Int'l Workshop on Low Temperature Bonding for 3D integration , Tokyo , 2012 . 10.1109/LTB-3D.2012.6238097 [9] Hartzell A.L. , DaSilva M.G. , Shea H.R. , MEMS Reliability , Springer ( New...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110673
EISBN: 978-1-62708-247-1
... The design, fabrication, reliability, and analysis of semiconductor components has become an increasingly complex task. Today’s engineer is called on to pull “a rabbit out of a hat.” Every year, the feature sizes get smaller, the designs get bigger, and the customer wants it made faster. With this in mind...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550511
EISBN: 978-1-62708-307-2
... such as turbocharger rotors and roller cam followers, power generation components, cutting tools, biomedical implants, and processing equipment used for fabricating a variety of polymer, metal, and ceramic parts. Major obstacles to their more widespread use are their reliability and cost. The selection process...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030235
EISBN: 978-1-62708-282-2
...Design aspects for reliability Table 1 Design aspects for reliability Approach Factors to be taken into account (typical) Avoid-failure approach Control product duty Keep product simple Predict reliability Study variable interfaces Instill care for familiar items or designs...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270003
EISBN: 978-1-62708-301-0
... and the reliability of their products Thus, failures have a great impact on the society and its economy. Failures of structures can occur at various locations, for instance, at home, on the road, in a machine, in an aircraft, or in a big plant. Failure of an aluminum ladder in a home, which led to personal...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220667
EISBN: 978-1-62708-259-4
... on. If any of this information is lost, the reliability of the examination and its results is seriously compromised. Because samples tend to change in shape and size during preparations for various reasons, such as size reduction as sample preparation proceeds and surface wear by grinding, polishing, etching...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780057
EISBN: 978-1-62708-268-6
... Failure Analysis Summary References References 1. Kirwan B. , A Guide to Practical Human Reliability Assessment , Taylor & Francis, Ltd. , London , 1994 2. Reliability Prediction of Electronic Equipment , MIL-HDBK-217F, U.S. Department of Defense Selected References...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
.... 229 - 239 , ( 1996 ). 10.1007/BF00133386 8. Degraeve R. , Kaczer B. , De Keersgieter A. , and Groeseneken G. , “ Relation between breakdown mode and breakdown location in short channel NMOSFETs, ” International Reliability Physics Symposium (IRPS) , pp. 360 - 366 , May...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030360
EISBN: 978-1-62708-282-2
... • Recommendations for the Training, Development and Competency Assessment of Inspection Personnel , Engineering Equipment Manufacturers and Users Association, EEMUA 193, 2000 • Health and Safety Executive (UK) HSE Offshore Technology Report 2000/095 , “ Reliability Assessment for Containers of Hazardous...