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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components. failure analysis light emitting diodes optoelectronic devices product reliability semiconductor lasers...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110666
EISBN: 978-1-62708-247-1
... Abstract This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design...
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Published: 01 November 2019
Fig 26 Lognormal plot of reliability versus time on lifetest for 4 different temperatures: 150°C, 130°C, 110°C, and 90°C (from left to right). Courtesy of Chris Helms at Emcore, after [37] . More
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Published: 01 December 2009
Fig. 16.5 Probability of passing versus product reliability. To have zero failures in a test with 32 samples, the product reliability must be extremely high. As the reliability decreases below 100%, the probability of passing falls quickly. More
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Published: 01 October 2012
Fig. 10.12 Block diagram for the analysis and reliability evaluation of ceramic components. Source: Ref 10.6 More
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Published: 01 July 1997
Fig. 5 The reliability factor ( R f ) is calculated for the desired level of safety given the scatter in the fatigue data for the detail. More
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Published: 01 July 1997
Fig. 27 The reliability factor ( R F ) for each of the data sources in Table 7 More
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Published: 01 December 2004
Fig. 1.2 One-piece cast missile tail cone. A cost-effective and reliable alternative to what had been a multicomponent assembly More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... stress superimpositions influences can lead to reliability failures. The superimposition of various stressors at the same time: humidity, vibration, mechanical shock, temperature, bending stress etc… Many reliability qualification specifications do not cover stress impact variations; the issue...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780157
EISBN: 978-1-62708-268-6
... is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing. failure analysis probability reliability statistical distribution statistics FAILURE ANALYSIS can sometimes involve considerations of statistics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110279
EISBN: 978-1-62708-247-1
... Abstract Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... Abstract Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... Abstract Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130001
EISBN: 978-1-62708-284-6
... Abstract A systematic procedure for minimizing risks involved in heat treated steel components requires a combination of metallurgical failure analysis and fitness for service with respect to safety and reliability based on risk analysis. This chapter begins with an overview of heat treat...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780055
EISBN: 978-1-62708-281-5
... Abstract The key to any successful part development is the proper choice of material, process, and design matched to the part performance requirements. This article presents examples of reliable material performance indicators and common practices to avoid. Simple tools and techniques...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180127
EISBN: 978-1-62708-256-3
...: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC. failure investigation technical skills communication skills technical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.t56040020
EISBN: 978-1-62708-428-4
... spray markets and applications, and process robustness, reliability, and economics. thermal spray markets thermal spraying Introduction and Background Thermal spray is regarded as a key surface engineering technology that underpins the competitiveness of critical manufacturing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
... the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools. 3D packaging artificial intelligence deep learning disintegration...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... are available at foundries, they often need to be modified to optimize the functionality, manufacturability, and reliability of the final part based on the particular application. New product development in MEMS also means new process development. This means that much of the work of the failure analyst...