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Book Chapter
Failure Analysis and Reliability of Optoelectronic Devices
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components. failure analysis light emitting diodes optoelectronic devices product reliability semiconductor lasers...
Abstract
Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.
Book Chapter
Reliability and Quality Basics for Failure Analysts
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110666
EISBN: 978-1-62708-247-1
... Abstract This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design...
Abstract
This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.
Image
Block diagram for the analysis and reliability evaluation of ceramic compon...
Available to PurchasePublished: 01 October 2012
Fig. 10.12 Block diagram for the analysis and reliability evaluation of ceramic components. Source: Ref 10.6
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Image
Lognormal plot of reliability versus time on lifetest for 4 different tempe...
Available to Purchase
in Failure Analysis and Reliability of Optoelectronic Devices[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Fig 26 Lognormal plot of reliability versus time on lifetest for 4 different temperatures: 150°C, 130°C, 110°C, and 90°C (from left to right). Courtesy of Chris Helms at Emcore, after [37] .
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Published: 01 July 1997
Fig. 5 The reliability factor ( R f ) is calculated for the desired level of safety given the scatter in the fatigue data for the detail.
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Image
Published: 01 July 1997
Fig. 27 The reliability factor ( R F ) for each of the data sources in Table 7
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Probability of passing versus product reliability. To have zero failures in...
Available to PurchasePublished: 01 December 2009
Fig. 16.5 Probability of passing versus product reliability. To have zero failures in a test with 32 samples, the product reliability must be extremely high. As the reliability decreases below 100%, the probability of passing falls quickly.
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One-piece cast missile tail cone. A cost-effective and reliable alternative...
Available to PurchasePublished: 01 December 2004
Fig. 1.2 One-piece cast missile tail cone. A cost-effective and reliable alternative to what had been a multicomponent assembly
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... stress superimpositions influences can lead to reliability failures. The superimposition of various stressors at the same time: humidity, vibration, mechanical shock, temperature, bending stress etc… Many reliability qualification specifications do not cover stress impact variations; the issue...
Abstract
Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.
Book Chapter
Statistics and Probability
Available to PurchaseBook: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780157
EISBN: 978-1-62708-268-6
... is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing. failure analysis probability reliability statistical distribution statistics FAILURE ANALYSIS can sometimes involve considerations of statistics...
Abstract
Failure analysis can sometimes involve considerations of statistics and probability. This chapter reviews some of the basic types of statistical distributions in order to understand some basic principles in their use. The main focus is on the uses of the normal distribution, which is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing.
Book Chapter
Design with Plastics
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780055
EISBN: 978-1-62708-281-5
... Abstract The key to any successful part development is the proper choice of material, process, and design matched to the part performance requirements. This article presents examples of reliable material performance indicators and common practices to avoid. Simple tools and techniques...
Abstract
The key to any successful part development is the proper choice of material, process, and design matched to the part performance requirements. This article presents examples of reliable material performance indicators and common practices to avoid. Simple tools and techniques for predicting plastic part performance (stiffness, strength/impact, creep/stress relaxation, and fatigue) integrated with manufacturing concerns (flow length and cycle time) are demonstrated for design and material selection.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130001
EISBN: 978-1-62708-284-6
... Abstract A systematic procedure for minimizing risks involved in heat treated steel components requires a combination of metallurgical failure analysis and fitness for service with respect to safety and reliability based on risk analysis. This chapter begins with an overview of heat treat...
Abstract
A systematic procedure for minimizing risks involved in heat treated steel components requires a combination of metallurgical failure analysis and fitness for service with respect to safety and reliability based on risk analysis. This chapter begins with an overview of heat treat processing of steels. This is followed by sections on various aspects of heat treatment design and heat treating practices for minimizing distortion. Influence of design, steel grade, and condition is then illustrated in the examples of failures due to heat treatment. A procedure is analyzed to improve the performance of the design process of a component. A heat-transfer model, coupling with a phase transformation model, a thermomechanical model, and a thermochemical model, is also considered. The chapter further provides information on the failure aspects of and heat treatment procedures applied to welded components. It ends with a section on risk-based approach applicable to heat treated steel components.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2022
DOI: 10.31399/asm.tb.tstap.t56040020
EISBN: 978-1-62708-428-4
... spray markets and applications, and process robustness, reliability, and economics. thermal spray markets thermal spraying Introduction and Background Thermal spray is regarded as a key surface engineering technology that underpins the competitiveness of critical manufacturing...
Abstract
This article summarizes the results of work completed by the ASM Thermal Spray Society Advisory Committee to identify key research challenges and opportunities in the thermal spray field. It describes and prioritizes research priorities related to emerging process methods, thermal spray markets and applications, and process robustness, reliability, and economics.
Book Chapter
A Few Pitfalls and More Useful Tools
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180127
EISBN: 978-1-62708-256-3
...: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC. failure investigation technical skills communication skills technical...
Abstract
This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics that a professional engineer must improve to conduct an effective and successful failure investigation, namely technical skills, communication skills, and technical integrity. The chapter also provides information on the additional basic tools available for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC.
Book Chapter
Transistor Characterization: Physics and Instrumentation
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110279
EISBN: 978-1-62708-247-1
... Abstract Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor...
Abstract
Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor technology from design to manufacturing and the characterization methods are discussed. The focus is on two prominent MOS structures: planar MOS device and FinFET device. The article covers the device parameters and device properties that determine the design criteria and the device tuning procedures. The discussion includes the effects of drain induced barrier lowering, velocity saturation, hot carrier degradation, and short channel on these devices.
Book Chapter
The Power of Semiconductor Memory Failure Signature Analysis
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... Abstract Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design...
Abstract
Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.
Book Chapter
Failure Analysis of Capacitors and Inductors
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... Abstract Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis...
Abstract
Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types include tantalum, aluminum electrolytic, multi-layered ceramics, film, and super capacitors. The article then provides a discussion on the two common types of inductors, namely, common mode choke coil and surface mount powder choke coil.
Book Chapter
An Overview of Integrated Circuit Testing Methods
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends...
Abstract
This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.
Book Chapter
Package Innovation Roadmap
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
... the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools. 3D packaging artificial intelligence deep learning disintegration...
Abstract
This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.
Book Chapter
Induction Soldering Equipment
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110123
EISBN: 978-1-62708-483-3
... Abstract This chapter describes important aspects of the interrelationship between the workpiece and the inductor coil, an understanding of which is essential for achieving an efficient soldering process and a solder joint with the desired performance and reliability. It also discusses...
Abstract
This chapter describes important aspects of the interrelationship between the workpiece and the inductor coil, an understanding of which is essential for achieving an efficient soldering process and a solder joint with the desired performance and reliability. It also discusses induction soldering machine operation parameters, including temperature measurement and control sensors. The chapter illustrates the equipment used in a fully automated induction heating system. Fully automated soldering systems include temperature monitoring devices to control the temperature-time profile, the movement of workpieces, the supply of solder filler metal and flux, and the provision of shielding gas in the solder joint area.
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