Search Results for protocol preparation

This article addresses some established protocols in characterizing thermoplastics, whether they are homogeneous resins, alloyed or blended compositions, or highly modified thermoplastic composites. It begins with a description of various approaches used for the determination of molecular weight (MW) by viscosity measurements. This is followed by a discussion of the use of cone and plate and parallel plate geometries in determining the viscoelastic properties of a polymer melt. Details on some of the chromatographic techniques that allow determination of MW and MW distribution of polymers are then provided. The article concludes with information on three distinctive, but complementary operations of thermoanalytical techniques, namely differential scanning calorimetry, thermogravimetric analysis, and thermomechanical testing.

The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its microstructure in order to identify the root cause of failure. This chapter assesses the tools and techniques used for those purposes and the challenges brought on by continued transistor scaling, advanced 3D packages, and new IC architectures. The areas covered include sample preparation, nanoprobing, microscopy, FIB circuit edit, and scanning probe microscopy.

This chapter explains how to measure the shape, size, microstructure, and composition of powders as well as their flowability and crystallization behavior. It presents detailed workflows and calculations based on SEM, TEM, FESEM, and STEM imaging, x-ray diffraction, differential scanning calorimetry, EDS and EELS spectroscopy, and powder sieving. It also discusses the measurement of crystallite size, lattice mismatch, and crystallinity and the relationship between surface area and flowability.

The aim of every extrusion plant is the efficient production of competitive products that meet the appropriate quality requirements. This chapter discusses the processes involved in the selection and introduction of a quality management system, along with its application, advantages, and disadvantages. It describes the process chain for order processing within the quality circle and provides information on product liability legal issues. In addition, the chapter discusses the processes involved in quality control, along with its organization, responsibilities, audits, and testing.

High-pressure cold spray repair process has been used on a number of different applications in the defense industry. This chapter describes various applications for cold spray systems that have operating pressures greater than 2.4 MPa (350 psi) and operating temperatures greater than 500 deg C (930 deg F).

The design process is the first and most important step in corrosion control. Major savings in operating costs are possible by anticipating corrosion problems so as to provide proper design for equipment before assembly or construction begins. This chapter describes the role of the design team in producing a successful final design, general considerations in corrosion-control design, and design details that accelerate corrosion. The details that must be considered when attempting to control corrosion by design include plant/site location, plant environment, component/assembly shape, fluid movement, surface preparation and coating procedures, and compatibility, insulation, and stress considerations. Design solutions for specific forms of corrosion, namely crevice corrosion, galvanic corrosion, erosion-corrosion, and stress-corrosion cracking, are then considered. A brief section is devoted to the discussion on corrosion allowance used for steel parts subject to uniform corrosion. Finally, the chapter describes the design considerations for using weathering steels.

Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.

In dynamic hardness tests, the test force is applied to the defined indenter in an accelerated way (with a high application rate). Dynamic test methods relate hardness to the elastic response of a material, whereas the classical static indentation tests determine hardness in terms of plastic behavior. This chapter describes the most important and widespread dynamic hardness testing methods. These tests fall into two categories: methods in which the deformation is measured and methods in which the energy is measured. Methods that measure deformation include the Poldi hammer method, the shearing force method, the Baumann hammer method, and the Dynatest method. Methods that measure energy include the Shore method, the Leeb method, and the Nitronic method. The chapter concludes with a discussion of applications of dynamic hardness testing.

Recent trends in electronic packaging, including the growing use of 3D designs and heterogeneous integration, are greatly adding to the complexity of isolating faults in semiconductor products. This chapter reviews the latest IC packaging and integration solutions and assesses the readiness level of fault isolation tools and techniques. It examines the capabilities, limitations, and optimization potential of x-ray tomography and magnetic field imaging, describes various approaches for optical fault isolation, and compares and contrasts pre-OFI sample preparation methods. The chapter also explains how time-domain and electro-optical terahertz pulse reflectometry are used to find shorts and opens in ICs and how challenges related to heterogenous integration may be met through design for testability (DFT) and built-in self-test (BIST) accommodations and the use of passive interposers.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

This chapter covers the engineering aspects of corrosion inhibitors and their effect on corrosion reactions. It explains how different metallic salts and heterocyclic compounds influence chemical reactions on metal surfaces exposed to corrosive media or environments. It describes how to evaluate inhibition efficiency through weight loss measurements, linear polarization resistance tests, electrochemical impedance spectroscopy, electrochemical noise monitoring, and surface analysis. It demonstrates the use of potentiodynamic polarization curves, Tafel extrapolations, equivalent circuit models, and various methods for characterizing corrosion damage and protective surface films. It also discusses typical applications, industry trends, and the emerging role of high-throughput experimentation, quantitative modeling, and machine learning in the development of cleaner and more effective corrosion inhibitors.

This chapter is a detailed account of various attributes related to mixing and testing of powder-binder feedstocks. Mixing parameters and their effects on feedstock properties is discussed. The attributes reviewed include mixture homogeneity, wetting, powder-binder ratio, feedstock density, elastic modulus, rheological behavior, particle size, formulation control, feedstock mixing, and feedstock properties. The chapter also provides information on the processes involved in feedstock preparation and testing.

This chapter discusses the selection, use, and integration of methods to control process variables in induction heating, including control of workpiece and processing temperature and materials handling systems. The discussion of temperature control includes a review of proportional controllers and heat-regulating devices. Integration of control functions is illustrated with examples related to heating of steel slabs, surface hardening of steel parts, vacuum induction melting for casting operations, and process optimization for electric-demand control. Distributed control within larger manufacturing systems is discussed. The chapter also covers nondestructive techniques for process control and methods for process simulation.

Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.

This chapter covers the different types of wear encountered in metalworking processes. It discusses the mechanisms involved in adhesive, abrasive, chemical, and fatigue wear and key contributing factors, including the composition and structure of tool and workpiece materials, the characteristics of contact surfaces, and loading forces imposed by the process. It describes the nature of metal transfer between tool and workpiece surfaces and the role of lubricants, coatings, and textures. It also discusses the use of wear maps, the effects of adhesion, and material-lubricant interactions.

The chapter covers various aspects of biotribology in the context of dental care, orthopedic implants, haptics, eyewear, and stents and fixation devices. It also addresses the issue of biocompatibility and the effects of friction and contact pressure on skin.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

This chapter covers the failure modes and mechanisms associated with boiler components and the tools and techniques used to assess damages and predict remaining component life. It begins with a review of the design and operation of a utility boiler and the materials used in construction. It then describes the various causes of failure in boiler tubes, headers, and steam pipes, explaining how and why they occur, how they are diagnosed, and how to mitigate their effects. The final and by far largest section in the chapter is a tutorial on damage and life assessment techniques for boiler components and assemblies. It demonstrates the use of various methods, including analytical techniques that estimate life expenditure based on operating history, component geometry, and material properties; predictive methods based on the extrapolation of failure statistics; methods that predict life based on dimensional measurements; methods based on metallographic studies; methods based on temperature estimates; and a method for estimating remaining life under creep conditions based on stress-rupture testing of service-exposed material samples. The chapter also discusses the use of fracture mechanics and presents a number of cases in which life assessments are made based on the integration of several methods.