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process failure mode and effects analysis

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Published: 01 December 2018
Fig. 10.2 Potential failure mode and effects analysis (FMEA) process. RPN, risk priority number More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410253
EISBN: 978-1-62708-280-8
..., product launch, and continuous improvement. This is followed by sections covering product-process flow diagrams and also the process elements considered for process failure mode and effects analysis. Some of the aspects covered by the engineering specifications to meet the product performance requirements...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
... (corrosion) is also provided. failure analysis fracture distortion wear environmentally assisted corrosion FAILURE ANALYSIS is the process of collecting, examining, and interpreting damage evidence. The objective is to understand the possible conditions leading to a failure and perhaps prevent...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780417
EISBN: 978-1-62708-281-5
... fractographic features of each test specimen were then identified and documented. Further examination and analysis of the fractographs were then conducted in order to define the specific fractographic features that were indicative of a specific material, processing, environmental, or load condition at failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270031
EISBN: 978-1-62708-301-0
.... The chapter also covers quantitative fractography, fracture surface topography analysis, and the use of oxide dating as well as fault tree and failure modes and effects analysis (FMEA) and computational techniques. fault tree analysis fracture surface topography analysis oxide dating quantitative...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... elements, and spacer cells may have an affect on a failure mode because of very subtle process variations. Layout variations including rotation, mirroring, and stepping of bit cells are very common, and are actually desirable for signature analysis purposes. If the failure rate is tallied...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780067
EISBN: 978-1-62708-268-6
... Abstract Failure mode assessment and assignment (FMA&A) is a tool designed to help organize the evaluation of hypothesized failure modes. This chapter begins by describing the process of preparing an FMA&A. It then describes the follow-on activities to evaluate the hypothesized failure...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780081
EISBN: 978-1-62708-268-6
..., the failure analysis team should focus on areas identified in the failure mode assessment and assignment (FMA&A). Changes in designs, processes, tooling, operators, and environment occur almost constantly, so it is likely that the failure analysis team will find changes that occurred at approximately...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
..., namely, common mode choke coil and surface mount powder choke coil. capacitors failure analysis failure modes inductors General construction of Tantalum, Aluminum electrolytic, Multi-layer Ceramics, Film, and Super capacitors and Common Mode Choke and Surface Mount inductors are explained...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
..., such as logic and memory, together onto the same package. For the next decade or two, it is anticipated that heterogeneous integration will be a key technology, thus efficient and effective failure analysis (FA) of the new packaging solutions is paramount for the successful commercialization of this technology...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... to correct the conditions that allowed these nonconformances to occur, but the team cannot jump to the conclusion that just because a component is nonconforming it must have caused the failure. Each nonconformance should be compared to the fault-tree analysis and the failure mode assessment and assignment...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410009
EISBN: 978-1-62708-280-8
... to be implemented to prevent these potential failures. The designer prepares a design failure mode analysis (DFMEA) and the casting engineer prepares a process failure mode analysis (PFMEA). These processes are detailed in Chapter 10, “Product Launch Processes ,” in this book. A team review of the test results...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices. atomic force microscopy failure analysis magnetic force microscopy nanoscale semiconductor device process monitoring scanning capacitance microscopy scanning Kelvin probe microscopy...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780183
EISBN: 978-1-62708-268-6
... or interim corrective actions to overcome design, process, and other failure causes. The chapter concludes by describing the process of corrective action implementation. corrective action failure analysis failure causes problem-solving process THE FOUR-STEP PROBLEM-SOLVING PROCESS ( Fig. 18.1...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630257
EISBN: 978-1-62708-270-9
... Abstract Fracture mechanics is a well-developed quantitative approach to the study of failures. This chapter discusses fracture toughness and fracture mechanics, linear-elastic fracture mechanics, and modes of loading. The discussion also covers plane strain and stress and crack growth kinetics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110666
EISBN: 978-1-62708-247-1
..., it is important that failure analysis personnel understand basic concepts of other activities supporting the microelectronics development and fabrication processes. It is the intent of the authors that this discussion may facilitate that collaboration. References References [1] Henderson C...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780141
EISBN: 978-1-62708-268-6
... to remove the etchant after the desired diameter is attained. If any acid is left on the wire, the acid-etching process continues, and the wire diameter becomes too small. In any process where a rinse cycle is used and contamination is suspected, the failure analysis team should determine if the rinse...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780001
EISBN: 978-1-62708-268-6
... analysis team can address the other hypothesized causes and prevent them from recurring as well. The Four-Step Problem-Solving Process In subsequent chapters, this book introduces and develops several sophisticated approaches for identifying and evaluating potential failure modes, developing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780359
EISBN: 978-1-62708-281-5
... mechanical test plastics THE ULTIMATE OBJECTIVE of a failure analysis is to ascertain the mode and the cause of the failure, regardless of the material from which the part was fabricated. The investigation is performed in generally the same manner, whether the failed component was produced from metal...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... analysis image contrast imaging modes off-axis electron holography sample preparation semiconductor transmission electron microscopy Introduction The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. The aggressive...