The aim of every extrusion plant is the efficient production of competitive products that meet the appropriate quality requirements. This chapter discusses the processes involved in the selection and introduction of a quality management system, along with its application, advantages, and disadvantages. It describes the process chain for order processing within the quality circle and provides information on product liability legal issues. In addition, the chapter discusses the processes involved in quality control, along with its organization, responsibilities, audits, and testing.

This article describes in more detail the fundamental building-block level, atomic, then expands to a discussion of molecular considerations, intermolecular structures, and finally supermolecular issues. An explanation of important thermal, mechanical, and physical properties of engineering plastics and commodity plastics follows, and the final section briefly outlines the most common plastics manufacturing processes.

In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.

This article provides a basic review of polymer photochemistry as it relates to the weatherability of engineering plastics, considering the chemistry induced by exposure to sunlight in open air. Elementary aspects of weatherability chemistry that are discussed include the light wavelengths responsible for polymer photochemistry, problems with artificial light sources, general photooxidation and specific photochemical reactions important in plastics, and the factors influencing the rate of degradation. The approaches used to stabilize plastics against photochemical damage, including ultraviolet light absorbers, oxidation inhibitors, and the use of protective coatings, are also considered.

This introductory article describes the various aspects of chemical structure and composition that are important to an understanding of polymer properties and their eventual effect on the end-use performance of engineering plastics, namely thermoplastics and thermosets. The most important properties of polymers and the most significant influences of structure on those properties are covered. The article also includes some general information on the classification and naming of polymers and plastics.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

This chapter discusses the use of thermoset and thermoplastic resins in polymer matrix composites. It begins by explaining how the two classes of polymer differ and how it impacts their use as matrix materials. It then goes on to describe the characteristics of polyester, vinyl ester, epoxy, bismaleimide, cyanate ester, polyimide, and phenolic resins and various toughening methods. The chapter also covers thermoplastic matrix materials and product forms and provides an introduction to the physiochemical tests used to characterize resins and cured laminates.

This article discusses the chemical susceptibility of a polymeric material. The discussion covers significant absorption and transportation of an environmental reagent by the polymer; the chemical susceptibility of additives; and thermal degradation, thermal oxidative degradation, photo-oxidative degradation, environmental corrosion, and chemical corrosion of polymers. It also includes some of the techniques used to detect changes in structure during polymer exposure to hostile environments. In addition, the article describes the effects of environment on polymer performance, namely plasticization, solvation, swelling, environmental stress cracking, polymer degradation, surface embrittlement, and temperature effects.

The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.

The susceptibility of plastics to environmental failure, when exposed to organic chemicals, limits their use in many applications. Environmental factors can be classified into two categories: chemical and physical effects. This article discusses the effects of these environmental factors on the mechanical properties of plastics.

This chapter reviews the development of filament winding systems and the automated processes used in state-of-the-art filament winding facilities. It first provides a description on the early stages of modern filament winding, followed by brief information on the advances of filament winding in the computer age. Then, the chapter discusses the requirements for filament winding in manufacturing oil and gas industry components and in high-volume production of sporting goods, propane tanks, and curing ovens. The chapter concludes with examples of the versatility of filament winding in producing complex parts.

This article covers the thermal analysis and thermal properties of engineering plastics with respect to chemical composition, chain configuration, and/or conformation of the base polymers. The thermal analysis techniques covered are differential scanning calorimetry, thermogravimetric analysis, thermomechanical analysis, and rheological analysis. The basic thermal properties covered include thermal conductivity, temperature resistance, thermal expansion, specific heat, and the determination of glass-transition temperatures. The article further describes various factors influencing the determination of service temperature of a material. Representative examples of different types of engineering thermoplastics are discussed in terms of structure and thermal properties. The article also discusses the thermal and related properties of thermoset resin systems.

A typical mobile processor die may contain, among other things, a variety of high-performance as well as low-power processing cores along with 5G modems, Wi-Fi modules, image processors, GPUs, and security modules, with a total transistor count exceeding 10 billion. Such designs pose many challenges for yield ramp and diagnostics. This chapter examines these challenges and the growing demand for innovative solutions to help failure analysts quickly and accurately isolate faults. It also assesses the capabilities and future potential of ATPG scan diagnostics, streaming scan networks, and advanced fault models for diagnosing embedded memory.

This chapter covers the fatigue and fracture behaviors of ceramics and polymers. It discusses the benefits of transformation toughening, the use of ceramic-matrix composites, fracture mechanisms, and the relationship between fatigue and subcritical crack growth. In regard to polymers, it covers general characteristics, viscoelastic properties, and static strength. It also discusses fatigue life, impact strength, fracture toughness, and stress-rupture behaviors as well as environmental effects such as plasticization, solvation, swelling, stress cracking, degradation, and surface embrittlement.

Generally, binders consist of at least three ingredients: a backbone to provide strength (compounds such as polyethylene, polypropylene, ethylene vinyl acetate, and polystyrene); a filler, such as polyacetal and paraffin wax, to occupy space between particles; and additives, such as stearates, stearic acid, or magnesium stearate, as well as phosphates and sulfonates, to adjust viscosity, lubricate tooling, disperse particles, or induce binder wetting of the powder. In the case of binders deposited via ink jet printing, the binder contains solvents to lower the viscosity for easier jetting. The chapter provides a detailed description of these constituents. The requirements of a binder as well as the factors determining the physical and thermal properties of polymers are discussed. Then, two factors associated with solvation of polymers, namely solubility parameter and wetting, are covered. The chapter ends with information on the specification of polymers used in binders.

This chapter describes the molecular structures and chemical reactions associated with the production of thermoset and thermoplastic components. It compares and contrasts the mechanical properties of engineering plastics with those of metals, and explains how fillers and reinforcements affect impact and tensile strength, shrinkage, thermal expansion, and thermal conductivity. It examines the relationship between tensile modulus and temperature, provides thermal property data for selected plastics, and discusses the effect of chemical exposure, operating temperature, and residual stress. The chapter also includes a section on the uses of thermoplastic and thermosetting resins and provides information on fabrication processes and fastening and joining methods.

This chapter covers the friction and wear behaviors of plastics and elastomers. It begins by describing the molecular differences between the two types of polymers and their typical uses. It then discusses the important attributes of engineering plastics and their suitability for applications involving friction, erosion, and adhesive and abrasive wear. It also discusses the tribology of elastomers and rubber along with their basic differences and the conditions under which they produce Schallamach waves. It includes information on polymer composites as well.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.