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process analysis

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050215
EISBN: 978-1-62708-311-9
... Abstract This chapters discusses the considerations involved in the qualification and analysis of induction hardening treatments. The discussion covers material selection and prior heat treatment, hardness and case depth, frequency selection, power density and heating time, part and process...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... Abstract This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040193
EISBN: 978-1-62708-300-3
... a variety of application examples. closed-die forging finite-element analysis impression-die forging microstructure process modeling References [Becker et al., 1972] Becker J.R. , Douglas J.R. , Simonen F.A. , “ Effective Tooling Designs for Production...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040237
EISBN: 978-1-62708-300-3
... finite-element analysis friction process modeling References [Altan et al., 1990] Altan T. , Oh S.I. , “ Application of FEM to 2-D Metal Flow Simulation: Practical Examples, ” Advanced Technology of Plasticity , Vol 4 , p 1779 , 1990 . [Altan et al., 2001...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610549
EISBN: 978-1-62708-303-4
... Abstract This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410009
EISBN: 978-1-62708-280-8
... This chapter is a brief account of various factors pertinent to the development of an engineering component. The discussion covers the disciplines and interactions of design development, engineering of component design, validation of design and process analysis, and matrix of design and manufacturing elements...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... Abstract Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180061
EISBN: 978-1-62708-256-3
... Abstract Statistics, data analysis, root cause analysis, and problem-solving processes play a key role in failure investigations. This chapter explains how to collect failure investigation data, how to build and maintain a database for company-related failures, and how to use corresponding...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... Abstract The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780189
EISBN: 978-1-62708-268-6
..., of process guidelines based on previous failure analyses, and of troubleshooting and repair guidelines. Also provided is a listing of the various steps that should be included in a failure analysis procedure. failure analysis libraries failure causes post failure analysis UP TO THIS POINT...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130001
EISBN: 978-1-62708-284-6
... physical processes. A systematic procedure for minimizing risks involved in heat treated steel components requires a combination of metallurgical failure analysis and fitness for service with respect to safety and reliability based on risk analysis. The effects of steel heat treatment may include (Ref 1...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
... Abstract Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180127
EISBN: 978-1-62708-256-3
... Abstract This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smff.t53400105
EISBN: 978-1-62708-316-4
... Abstract This chapter provides a detailed analysis of the deep drawing process. It begins by explaining that different areas of the workpiece are subjected to different types of forces and loads, equating to five deformation zones. After describing the various zones, it discusses the effect...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780081
EISBN: 978-1-62708-268-6
... Abstract This chapter targets areas that determine if a change occurred and if the change induced the failure: change or what's different analysis. It describes the different sources of changes that induce process deficiencies: design, process, test and inspection, environmental, supplier lot...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... of specimens, mechanical testing, macroexamination, microexamination, metallographic examination, determination of the fracture mechanism, chemical analysis, exemplar testing, and analysis and writing the report. The chapter ends with a discussion on various processes involved in the determination...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410253
EISBN: 978-1-62708-280-8
..., product launch, and continuous improvement. This is followed by sections covering product-process flow diagrams and also the process elements considered for process failure mode and effects analysis. Some of the aspects covered by the engineering specifications to meet the product performance requirements...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... Abstract This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780057
EISBN: 978-1-62708-268-6
... determinations, mean times between failure, and related topics are also discussed. The discussion covers the practices observed in fault-tree analysis quantification and processes involved in calculating the probability of the top undesired event. failure rate failure rate sources fault-tree analysis...