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This article is a compilation of terms and definitions related to failure analysis that have been addressed in the proceedings of the International Symposium for Testing and Failure Analysis.

This appendix includes selected references on topics related to the production and application of superalloys, including properties and microstructure; melting/ingot breakdown; forging/powder metallurgy; machining, heat treating, joining, refurbishment/repair; investment casting; coatings/corrosion; and modeling.

This appendix contains bibliographies related to the history of stainless steel.

A second-stage turbine blade in an aircraft engine failed in service, fracturing along a path through the shroud hole. Cracks were also found in the shroud holes of the two adjacent blades. Based on the results of visual examination and SEM fractography, investigators concluded that the fracture and cracks were due to the fretting action of the pins inside the shroud holes.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

Any forming process that converts stored energy to plastic deformation in less than a few milliseconds is considered a high-velocity or impulse forming process. This chapter discusses the operating principles, equipment, and applications of the most common high-rate forming processes, including high-velocity hydroforming, high-velocity mechanical forming, and electromagnetic or energy-based forming.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.

This chapter provides a comprehensive overview over all phenomena related to Voltage Contrast (VC) mechanisms in SEM and FIB. The multiple advantages, possibilities, and limits of active and passive VC failure localization are systemized and discussed. The knowledge of all facts influencing the VC generation (capacitance, leakage, doping, and circuitry) is very helpful for successful failure localization.

An aircraft tire burst while inflating, causing one of the flanges on the wheel hub to fracture. This chapter provides a summary of the investigation along with key findings. It includes images of the damaged hub and describes how various parts failed as the pressure in the tire increased. It explains that the hub material was of good quality under uniform load and that it fractured quickly by cleavage due to the force exerted by the overinflated tire.

This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.

This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.

Electromagnetic induction, or simply "induction," is a method of heating electrically conductive materials such as metals. It is commonly used for heating workpieces prior to metalworking and in heat treating, welding, and melting. This technique also lends itself to various other applications involving packaging and curing of resins and coatings. This chapter provides a brief review of the history of induction heating and discusses its applications and advantages.