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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... in silicon ,” Phys. Rev. , vol. 102 , no. 2 , p. 369 , 1956 . 10.1103/PhysRev.102.369 [4] Khurana N. and Chiang C. L. , “ Analysis of Product Hot Electron Problems by Gated Emission Microscopy ,” Proc. IEEE IRPS , p. 189 , 1986 . 10.1109/IRPS.1986.362132 [5] Breitenstein...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260119
EISBN: 978-1-62708-336-2
... Technology seminars. Principle of Billet Making Casting Practices Casting Defects References References 1. Nussbaum A. , Recent Advances in Vertical Direct Chill Casting Equipment for Extrusion Billet Production , Proc. Fifth International Aluminum Extrusion Technology Seminar...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260029
EISBN: 978-1-62708-336-2
... R. , A Numerical Analysis of Temperature Distribution in Extrusion , J. Inst. Met. , Vol 95 , 1967 3. Lahoti G.D. and Altan T. , Prediction of Metal Flow and Temperatures in Axisymmetric Deformation Processes , Proc. of the 21st Sagamore Army Materials Research Conference...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.htcma.t52080359
EISBN: 978-1-62708-304-1
... , ( 1992 ), p 74 3. Grant T.J. , Update of the American Forest & Paper Association’s Recovery Boiler Program , TAPPI Engineering & Papermakers Conference (Conf. Proc.), Book 2, TAPPI , ( 1997 ), p 589 4. Gommi J. , Root Causes of Recovery Boiler Leaks , TAPPI...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2017
DOI: 10.31399/asm.tb.sccmpe2.t55090191
EISBN: 978-1-62708-266-2
.... , and Perks J.M. , State of Knowledge of Radiation Effects on Environmental Cracking in Light Water Reactor Core Materials , Proc. 4th Int. Conf. on Environmental Degradation of Materials in Nuclear Power Systems—Water Reactors , National Association of Corrosion Engineers , 1990 6.2...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260087
EISBN: 978-1-62708-336-2
.... , Billhardt C. , Altan T. , and Gagne R. , Automated Design of Extrusion Dies by Computer , Proc. Second International Aluminum Extrusion Technology Seminar , Vol 2 , Aluminum Association and Aluminum Extruders Council , 1977 2. Purnell C. and Males D. , Extrusion Die...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260233
EISBN: 978-1-62708-336-2
... in Billet Making Quality Control of Dies Quality Control of Extrusion Total Quality Management References References 1. Bird V.R. , Use of Statistically Designed Experiments in an Extrusion Plant , Proc. Fourth International Aluminum Extrusion Technology Seminar , Aluminum...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260055
EISBN: 978-1-62708-336-2
... Selection and Specification Extrusion Press Components Auxiliary Equipment Integrated System References References 1. Fielding R.A.P. , How to Operate Extrusion Presses Well , Proc. Sixth International Aluminum Extrusion Technology Seminar , Vol 1 , Aluminum Association...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780089
EISBN: 978-1-62708-281-5
... Good from Bad ,” Waters Associates, Inc ., Feb 1975 10. Larsen F.N. , Gel Permeation Chromatographic Analysis of Commercial Epoxy Resins , Proc. Sixth International Seminar on GPC , 1968 , p 111 11. Ekmanis J. and Church S. , Simple Test of Incoming Resins Rates...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.tb.hpcspa.t54460209
EISBN: 978-1-62708-285-3
... , Proc. 2006 International Thermal Spray Conference , 2006 8.22 Bobzin K. , Ote M. , Linke T.F. , Schulz C. , Hopmann C. , and Wunderle J. , Integration of Electrical Functionality by Transplantation of Cold Sprayed Electrical Conductive Cu Tracks via Injection...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110101
EISBN: 978-1-62708-247-1
.... , Nayak D. , Venkataraman S. , “ Improving Precision Using Mixed-level Fault Diagnosis , Proc. IEEE Int'l Test Conf. , 2006 , Paper: 22.3 10.1109/TEST.2006.297661 8. Fan X. , Moore W. , Hora C. , Konijnenburg M. and Gronthoud G. , “ A Gate-Level Method...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110643
EISBN: 978-1-62708-247-1
... – Part 1, ‘Can EDA Help Solve Analog Test and DFT Challenges?’ ” IEEE Design & Test , Jan/Feb 2010 [2] Poehl F. , Demmerle F. , Alt J. , Obermeir H. , “ Production Test Challenges for Highly Integrated Mobile Phone SOCs – A Case Staudy ”, Proc. of European Test Symp...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... isolation techniques ”, Microelectronic Failure Analysis: Desk Reference 2001 Supplement , pp. 1 - 17 , 2001 . [11] Kim Y. L. , Yeo J. H. , Choi J. I. , Kim C.S. , Jeong, Proc 43th Int’l Symp for Testing and Failure Analysis , Phoenix, AZ , November 2018 , pg. 219 - 223...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.htcma.t52080249
EISBN: 978-1-62708-304-1
..., Harford House , London , 1973 11. Fairbanks J.W. and Machlin I. , Ed., Proc. 1974 Gas Turbine Materials in The Marine Environment Conf. , MCIC-75-27, Battelle Columbus Laboratories , 1974 12. Hot Corrosion Problems Associated with Gas Turbines , STP 421, ASTM , 1967 13...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... vs. Logic Testing of Gate Oxide Short, Floating Gate and Bridging Failures in CMOS, ” Int. Test Conf. , 1991 , pp. 510 - 519 . [11] Henderson C. , Soden J. and Hawkins C. , “ The behavior and Testing Implications of CMOS IC Logic Gate Open Circuits, ” Proc ITC. , 1991 , pp...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780055
EISBN: 978-1-62708-281-5
... Conclusions References References 1. Trantina G.G. and Ysseldyke D.A. , An Engineering Design System for Thermoplastics , 1989 ANTEC Conf. Proc. , Society of Plastics Engineers , p 635 – 639 2. Nielsen E.H. , Dixon J.R. , and Simmons M.K. , “ GERES: A Knowledge...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030338
EISBN: 978-1-62708-282-2
... and Mitigation Requirements , Paper 04206, Corrosion 2004 , NACE International , 2004 14. Wenk R.L. , Field Investigation of Stress Corrosion Cracking , Proc. Fifth Symposium on Line Pipe Research , Pipeline Research Council International , 1974 , p T-1 15. Justice J.T...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
.... , Huffman K. , Wagner L. , Kazmi S. , “ The SEMATECH Failure Analysis Roadmap ”, Proc Int’l Symp for Testing and Failure Analysis , 1995 , pp. 1 – 5 . [3] Vallet D.P. , “ IC Failure Analysis: The Importance of Test and Diagnostics ”, IEEE Design and Test of Computers , Vol. 14...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270199
EISBN: 978-1-62708-301-0
... , 1981 Dickson J.J. et al. , Failure Analysis: Techniques and Applications , Proc. 1st International Conference on Failure Analysis ( Montreal, Canada ), July 1991 , ASM International , 1992 Esaklul K.A. et al. , Ed., Handbook of Case Histories in Failure Analysis , Vol...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
..., USA , April 2011 [2] Schmidt C. , et al. , “ Nanoscale 3D X-Ray Microscopy for high density Multi-Chip Packaging FA ,” Proc 44rd Int’l Symp for Testing and Failure Analysis , Phoenix, CA , November 2018 , pp. 424 – 428 . [3] Cardoso A. et al. , “ Development of Novel...