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problem-solving approach

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780001
EISBN: 978-1-62708-268-6
... Abstract This chapter focuses on what can cause a system to fail and addresses the challenge in approaching a system failure. It then examines the steps involved in the four-step problem-solving process: defining the problem, identifying all potential failure causes and evaluating the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780025
EISBN: 978-1-62708-268-6
... engaging in a free-flow of suggestions to solve a problem. The approach typically includes the following steps: Notification: The person scheduling the brainstorming sessions notifies the people invited to the session, with a clear problem statement. This allows those invited to the meeting to...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130001
EISBN: 978-1-62708-284-6
... components. It ends with a section on risk-based approach applicable to heat treated steel components. heat treatment steel components welded components component design heat-transfer model DESIGN involves different creative aspects: planning, development, procedures, availability, and...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420263
EISBN: 978-1-62708-310-2
... offer global minimization methods as part of their calculation capability. However, if the problem to be solved involves multicomponent alloys with numerous multiple sublattice phases containing a potentially large number of local minima, speed issues will still arise. Whether to use local or more...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780183
EISBN: 978-1-62708-268-6
... interim corrective actions to overcome design, process, and other failure causes. The chapter concludes by describing the process of corrective action implementation. corrective action failure analysis failure causes problem-solving process THE FOUR-STEP PROBLEM-SOLVING PROCESS ( Fig. 18.1...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420289
EISBN: 978-1-62708-310-2
... of these alloys into useful configurations, (3) design and control of heat treatment procedures for specific alloys that will produce the required mechanical, physical, and chemical properties, and (4) solving problems that arise with specific alloys in their performance in commercial applications...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.tb.ssde.t52310243
EISBN: 978-1-62708-286-0
... stainless steel made since then have thankfully made these statements obsolete. Not only have basic corrosion problems been solved, stress corrosion cracking also can be avoided. More impressively, this can be done with alloys with strengths much higher than those of the alloys, such as 316, that they...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110673
EISBN: 978-1-62708-247-1
.... The analyst also needs to adopt the attitude that he or she will do it right the first time. Doing the job right the first time may seem to require more time, but the opposite is true. The president of your firm would much rather see 10 yield problems thoroughly addressed and solved, than 50 yield...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780019
EISBN: 978-1-62708-268-6
... this gap, the Air Force, Boeing, and Bell Laboratories created fault-tree analysis. Fault-tree analysis is discussed in much greater detail in the next several chapters. It is the basic tool primarily used for answering the second question in the four-step problem-solving process (What is the cause of...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780067
EISBN: 978-1-62708-268-6
... future. The failure analysis team uses the FMA&A to manage the failure analysis and updates and distributes the FMA&A after each failure analysis team meeting. The analysis techniques covered thus far have been focused on steps 1 and 2 of the four-step problem-solving process ( Fig. 1.2...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780035
EISBN: 978-1-62708-268-6
...-solving process. It is the problem definition. When the Air Force, Boeing, and Bell Laboratories worked together to develop the fault-tree analysis technique, they hypothesized the top undesired event (inadvertent nuclear missile launch) and then used the fault tree to identify all possible causes. In...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... general, analytic solution to the inverse problem that is not based on the specific details of the current distribution, as these are not known a priori. This requires solving a specific subset of Maxwell’s equations, namely the Biott-Savart law, that can be expressed in general (integral) form as: (1...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... underlying root cause that has the most impact on yield. A 100% failure analysis success based on a couple of worse failing dies is no longer meaningful to yield. To ensure a fast product yield ramp-up, a prompt, conclusive, defect-learning approach is necessary in order to devise a precise corrective action...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... difficulties in its manual problem solving. Our descriptions emphasize this manual approach with its accompanying quick insights into transistor circuit behavior. Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130311
EISBN: 978-1-62708-284-6
... effect on tool life, as described in this chapter. In some applications, three major points are equally related to tool performance (supposing that operation is constant): Design and manufacture finishing Steel composition and its quality Heat treatment applied Even though this approach...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870255
EISBN: 978-1-62708-314-0
... during curing. As the number of these solutions indicates, core migration and crushing are major problems, particularly in cocured assemblies. Fig. 9.18 Edge crush in cocured honeycomb panels. F , force vector. Source: Ref 23 There are three basic approaches to producing honeycomb...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.tb.ssde.t52310091
EISBN: 978-1-62708-286-0
... very large degree ameliorated, if not solved, that problem. SCC is unfortunately poorly understood. Like pitting, whose initiation mechanism has not been identified, SCC has both its initiation and propagation mechanisms still open to debate. But the duplex alloys have good strength mainly through...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... solve this problem. Electronic devices can emit light correlated to electronic operation. As for all electronic processes in solid state materials, the energy band model and application of Fermi statistics are the keys to understanding and categorizing the effects. In order to detect light, two...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... product by doing finger print of the trace elements in this small particle. Based on our failure Pareto, 30-40% of the field return failures in semiconductor products are caused by a process or material aberration. To solve the problem and prevent re-occurrence, our manufacturing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870401
EISBN: 978-1-62708-314-0
... Abstract This chapter describes the conditions under which environmental degradation is likely to occur in polymer matrix composites and the potential damage it can cause. It discusses the problems associated with moisture absorption and exposure to solvents, fuels, ultraviolet radiation...