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printed wiring board

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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... and costly. Although soldered connections can be disconnected, removing the solder sometimes causes irreparable physical or electrical damage. Small wires with thin insulation can melt or burn off easily, and printed circuit boards can stand only so much heat before the circuit traces either lift off...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780089
EISBN: 978-1-62708-281-5
... ’84 , Society of Plastics Engineers , 1984 , p 311 – 315 134. Jensen W.M. , Controlled Thermal Expansion in Printed Wiring Boards , SAMPE J. , Jan/Feb 1983 , p 58 – 59 135. Sichina W.J. , Gill P.S. , and Baker K.F. , Thermal Analysis for the PC Shop...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740325
EISBN: 978-1-62708-308-9
... Relative cost, low = 1 Typical deposit thickness, mm Flame 3,000 40 8 10–15 10–15 2–6 1 0.1–15 Arc wire NA 100 12 10–20 10 12 2 0.1 to >50 High-velocity oxyfuel (Jet Kote) 3,000 800 >70 1–5 1–2 2–4 3 0.1 to >2 Detonation gun 4,000 800 >70 1–5 1–2 0.5...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... in the terminations of passive parts). Reclaimed parts are parts that have been recovered from assembled printed circuit boards of discarded electronic assemblies and failed boards which are scrapped by contract manufacturers. The pedigree of these discarded assemblies is often unknown. Parts that are reclaimed...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550325
EISBN: 978-1-62708-307-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... [1] . Even though it was mounted to a board, all four package edges were carefully imaged. Contamination between the shorted Pins A2 and A3 was uncovered on the PCB (printed circuit board) surface. Subsequent investigations identified the contamination as tin dendrites. Working with the CAR...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780383
EISBN: 978-1-62708-281-5
... Techniques XPS Application Depth Profiles Angle-Dependent Analysis Example 2: Printed Circuit Boards Start with Copperclad Catalytic-Based Material Make Format Board Laminate with RC-205 Adhesive Do Wiring Analysis of Failures in the Field Example 1: Delamination of Polyester...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... , November 2018 Introduction More Detailed Early Life Failure Examples from Practice ESD (Electrostatic Discharge) Under Operation Packaging and PCB (Printed Circuit Board) Layout in Automotive Electronics LEDs in Car Applications Inductive Loads Failure Anamnesis Conclusion...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... of moisture and applied bias with surface contamination can create an ideal environment for electromigration of metals such as Sn, Ag or Cu, which are used in the construction of these MLCC as well as in the solders used for mounting and the printed circuit boards themselves. The scanning electron microscopy...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
... , Vol 25 , p 27 – 30 10.1108/eb044447 • Plumbridge B. , 1995 . The Gas Turbine Laptop: A New Era for Solders , Mater. World , Sept , p 422 – 424 • Richards B.P. , Burton P. , and Footner P.K. , 1993 . Damage-Free Ultrasonically Assisted Cleaning of Printed...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... of Polymeric Lid Sealant , Proc. 25th Electronics Components Conference , April , p 361 – 367 • Vianco P.T. , 1998 . An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Joint Performance , Circuit World , Vol 25 (No. 1 ), p 6 – 24 10.1108...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440103
EISBN: 978-1-62708-352-2
... when fabricating fluxed printed circuit boards (PCBs) using lead-tin solder has been studied. In general, if the oxygen level can be decreased to below 10 ppm then the soldering process will generally be insensitive to many process variables, because the molten solder has a low surface tension...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220039
EISBN: 978-1-62708-259-4
.... “ Standard Terminology Relating to Metallography ,” E7-15, ASTM , 2015 2. “ Guide for Preparation of Metallographic Specimens ,” E3-11, ASTM , 2011 3. “ Standard Practice for Macroetching Metals and Alloys ,” E340-15, ASTM , 2015 4. “ Standard Practice for Preparing Sulfur Prints...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
...-recognition software. Allied with these facilities are image-recognition systems that read individual chip, resistor, and capacitor values and check that printed circuit boards (PCBs) have been populated with the specified components in the desired orientation. The cumulation of these advances is industries...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... and 10um wide Edge Microline indent. Figure 10 Scribe on the edge of the sample. Abstract Abstract Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170550
EISBN: 978-1-62708-297-6
...-control equipment and for making the spinnerettes used in the manufacture of synthetic fibers for clothing; the use of silver for photographic processes; the use of gold, palladium, and their alloys in printed circuit board assemblies; silver, gold, and platinum-group metals for electrical contacts...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2000
DOI: 10.31399/asm.tb.ttg2.t61120345
EISBN: 978-1-62708-269-3
... • Titanium News , an occasional newsletter of Suisman Titanium Corporation , Hartford, CT , published since the early 1970s • “ Titanium: Past, Present and Future ,” NMAB-392 , National Materials Advisory Board , Washington, DC , 1983 • Wood R.A. , Titanium Utilization...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060315
EISBN: 978-1-62708-261-7
... such as brasses are the largest zinc consumers. Rolled zinc is the principal form in which wrought zinc alloys are supplied, although drawn zinc wire for metallizing is increasingly being used. In the zinc chemical category, zinc oxide is the major compound. Zinc oxide is employed in rubber, paints, ceramics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... between package and die will damage wire bonds. If delamination at the die surface is initiated during board mounting, it spreads during subsequent temperature cycling, leading to early device failure from stress-induced damage and wire bond degradation. Also, package cracks and delamination at the leads...