The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

This chapter instructs the metallographer on the basic skills required to prepare a polished metallographic specimen. It is organized in a chronological sequence starting with the information-gathering process on the material being investigated, then moving on to sectioning, mounting, grinding, and polishing processes, and ending with methods used to properly store metallographic specimens. The discussion covers the preparation procedures, the materials being investigated, and equipment used to perform these procedures.

Surface cleanliness requirements depend on which nitrocarburizing process is selected for component treatment. This chapter discusses the processes involved in some of the more commonly used precleaning methods for gas ferritic nitrocarburizing and provides information on the methods used to accomplish enhanced plasma cleaning.

Specimen preparation is the first step that determines the quality of the microstructural information that can be obtained using optical microscopy. This chapter describes the sample preparation methods that are applicable to most types of composite materials containing short discontinuous or continuous fibers. The sample preparation methods cover documentation and labeling of samples, sectioning the composite, clamp-mounting composite samples, mounting composite samples in casting resins, and the addition of contrast dyes to casting resins. Information on the molds used for mounting composite materials is provided. The steps recommended to achieve a good mounted specimen without voids or specimen pull-out are also described. The chapter discusses the processes for clamping mounted composite samples in automated polishing heads and mounting composite materials for hand polishing. A summary of the mounting technique is also included.

This chapter explains how to prepare metallographic samples for light microscopy and how to anticipate and avoid related problems. It describes standard practices and procedures for sectioning, mounting, grinding, and polishing and identifies common defects along with their causes and cures. It also provides recommendations for handling specific materials and addresses safety concerns.

The most common methods for preparing polymeric composites for microscopic analysis can be used for most fiber-reinforced composite materials. There are, however, a few composite materials that require special preparation techniques. This chapter discusses the processes involved in the preparation of titanium honeycomb composites, boron fiber composites, titanium/polymeric composite hybrids, and uncured prepreg materials.

Transmitted-light methods reveal more details of the morphology of fiber-reinforced polymeric composites than are observable using any other available microscopy techniques. This chapter describes the various aspects relating to the selection and preparation of ultrathin-section specimens of fiber-reinforced polymeric composites for examination by transmitted-light microscopy techniques. The preparation steps covered are a selection of the rough section, preparation of the rough section for preliminary mounting, grinding and polishing the primary-mount first surface, mounting the first surface on a glass slide, and preparing the second surface (top surface). The optimization of microscope conditions and analysis of specimens by microscopy techniques are also covered. In addition, examples of composite ultrathin sections that are analyzed using transmitted-light microscopy contrast methods are shown throughout.

This article presents best practices for the metallographic preparation of specimens produced via thermal spray coating methods. It outlines typical metallographic preparation process flow, highlighting important considerations for obtaining a clear and representative specimen suitable for characterization via examination techniques, such as optical or electron microscopy. The process flow includes preliminary resin infiltration, sectioning, mounting, grinding, and polishing. To aid in the identification and resolution of common issues during subsequent specimen analysis, the article presents common issues, along with causes and mitigation strategies. It describes the processes involved in the interpretation of the thermal spray coating microstructure.

Abradable coatings (such as Ni-4Cr-4Al/bentonite) are used throughout jet engines, primarily as sacrificial coatings into which moving components wear. This article presents the Accepted Practice for sample preparation of abradable coatings for metallographic analysis, based on round robin testing by several laboratories.

Molybdenum thermal spray coatings are used in aerospace and other industries for wear resistance applications. Metallographic sample preparation of molybdenum coatings presents unique challenges. The purpose of the investigation described in this article is to determine Accepted Practices for sample preparation to better understand the process related microstructures of thermal spray molybdenum powders. The committee followed a round robin approach to assess metallographic sample preparation by a variety of laboratories. The article summarizes the results of the committee’s work.

Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite materials. First, it provides information on grinding and polishing equipment and describes the processes and process variables for sample preparation. Then, the chapter discusses the processes of abrasive sizing for grinding and rough polishing. Next, it provides a summary of grinding methods, rough polishing, and final polishing. Finally, information on common polishing artifacts that can result from any of the steps is provided.

The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.

This chapter describes the methods and equipment applicable to metallographic studies and discusses the preparation of specimens for examination by light optical microscopy. Five major operations for preparation of metallographic specimens are discussed: sectioning, mounting, grinding, polishing, and etching. The discussion covers their basic principles, advantages, types, and applications, as well as the equipment setup. The chapter includes tables that list etchants used for microscopic examination. It also provides information on microscopic examination, microphotography, and the effects of grain size on the structural properties of the material.

Examining and evaluating the nitrided case is generally accomplished by hardness testing and microscopic examination. This chapter discusses both characterization methods, as well as sample preparation. The chapter also discusses the processes involved in the etching of the sample after microhardness testing and provides practices that contribute to the safe preparation of specimens. Examples of nitrided case microstructures, using optical light microscopy, are also presented.

The analysis of composite materials using optical microscopy is a process that can be made easy and efficient with only a few contrast methods and preparation techniques. This chapter is intended to provide information that will help an investigator select the appropriate microscopy technique for the specific analysis objectives with a given composite material. The chapter opens with a discussion of macrophotography and microscope alignment, and then goes on to describe various illumination techniques that are useful for specific analysis requirements. These techniques include bright-field illumination, dark-field illumination, polarized-light microscopy, interference and contrast microscopy, and fluorescence microscopy. The chapter also provides a discussion of sample preparation materials such as dyes, etchants, and stains for the analysis of composite materials using optical microscopy.

This chapter explains how to safely prepare beryllium alloy samples for metallographic analysis. It describes grinding, polishing, and etching procedures in detail. It also discusses the identification of major and minor constituents and the general appearance of beryllium microstructure.

Beryllium has been successfully joined by fusion welding, brazing, solid-state bonding, and soldering. This chapter describes these processes in detail along with their advantages and disadvantages. It also addresses application considerations such as surface preparation, joint design, and testing.

This chapter explains how to join beryllium parts using adhesive bonding and mechanical fastening techniques and discusses the advantages and disadvantages of each method. It describes the stresses that need to be considered when designing adhesive bonds, the benefits and limitations of different adhesives, and surface preparation requirements. It explains how adhesives are applied and cured and how curing times and temperatures affect bonding strength. It also discusses the use of bolts and rivets and the different types of joints that can be made with them.

Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.