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polyimide
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Image
Published: 01 December 2003
Fig. 12 Exposure of fiber splinters in a glass/polyimide laminate having inadequate resin content, following mode I tension loading of the specimen. 40×
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Image
Published: 01 December 2003
Fig. 24 Chop marks on the fracture surface of the glass fibers in a glass/polyimide composite tested as a notched four-point bend specimen that failed in compression. 1800×
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Image
in Physical, Chemical, and Thermal Analysis of Thermoset Resins[1]
> Characterization and Failure Analysis of Plastics
Published: 01 December 2003
Fig. 3 HPLC chromatogram for PMR-15 polyimide
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Image
in Special Applications of Induction Heating
> Elements of Induction Heating: Design, Control, and Applications
Published: 01 June 1988
Fig. 11.6 Photograph of a processing line for induction curing of a polyimide film on wire Source: Lepel Corp.
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870063
EISBN: 978-1-62708-314-0
..., epoxy, bismaleimide, cyanate ester, polyimide, and phenolic resins and various toughening methods. The chapter also covers thermoplastic matrix materials and product forms and provides an introduction to the physiochemical tests used to characterize resins and cured laminates. physiochemical test...
Abstract
This chapter discusses the use of thermoset and thermoplastic resins in polymer matrix composites. It begins by explaining how the two classes of polymer differ and how it impacts their use as matrix materials. It then goes on to describe the characteristics of polyester, vinyl ester, epoxy, bismaleimide, cyanate ester, polyimide, and phenolic resins and various toughening methods. The chapter also covers thermoplastic matrix materials and product forms and provides an introduction to the physiochemical tests used to characterize resins and cured laminates.
Image
Published: 01 July 2009
Fig. 24.8 Effect of operating temperature on the tensile strength of beryllium, steel, and titanium bonded with polyimide adhesives. Source: Snogren 1970
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Image
Published: 01 December 2003
Fig. 22 Radial marks on the surfaces of glass fibers indicative of tensile failure in a glass/polyimide composite following failure of a notched four-point bend specimen. 3000×
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Image
Published: 01 June 1983
Figure 12.13 Temperature dependence of thermal conductivity in the direction normal to the reinforcement (flatwise direction) for a series of silicon-, polyimide-, epoxy-, and phenolic-matrix laminates ( Dahlerup-Petersen and Perrot, 1979 ). Wt.% = fiber weight fraction.
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Image
in Tribology of Plastics and Elastomers
> Tribomaterials: Properties and Selection for Friction, Wear, and Erosion Applications
Published: 30 April 2021
Fig. 11.7 Two-body abrasion test results of selected plastics. UHMWPE, ultrahigh-molecular-weight polyethylene; PTFE, polytetrafluoroethylene; PVC, polyvinyl chloride; CE, canvas electrical grade; PMMA, polymethyl methacrylate; PI, polyimide
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Image
in Tribology of Plastics and Elastomers
> Tribomaterials: Properties and Selection for Friction, Wear, and Erosion Applications
Published: 30 April 2021
Fig. 11.29 Estimate of the relative applicability of types of plastics for bearing-type applications, where + indicates polyethylene, ultrahigh-molecular-weight polyethylene, and so on; and * indicates polyetheretherketone, polyimide, polyphenylene sulfide, polyamide, polyoxymethylene
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Image
Published: 01 December 2003
Fig. 13 Relative thermal stability of polymers by thermogravimetric analysis; 10 mg (0.15 gr) at 5 °C/min (9 °F/min) in nitrogen. PVC, polyvinyl chloride; PMMA, polymethylmethacrylate; HPPE, high-pressure polyethylene; PTFE, polytetrafluoroethylene; PI, polyimide
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in Tribology of Plastics and Elastomers
> Tribomaterials: Properties and Selection for Friction, Wear, and Erosion Applications
Published: 30 April 2021
Fig. 11.13 Wear results of block-on-ring tests on various plastics versus titanium and 316 stainless steel rings. POM, polyoxymethylene; PTFE, polytetrafluoroethylene; PE, polyethylene; PPS, polyphenylene sulfide; CF, carbon fiber; PI, polyimide; PEEK, polyetheretherketone; PAI, polyamide
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780417
EISBN: 978-1-62708-281-5
.... Material systems examined include epoxy resins with different fibers, such as carbon/epoxy (AS4/3501-6), fiberglass/epoxy (Hexcel E-glass/F155) and aramid/epoxy (Kevlar 49/3501-6), as well as fibers with different thermosetting resins, including carbon/bismaleimide (AS4/5250-3) and glass/polyimide (Celion...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870183
EISBN: 978-1-62708-314-0
... and pressures. In a typical bagging operation ( Fig. 6.3 ), the materials required include high-temperature polyimide bagging material, glass bleeder cloth, and silicone bag sealant. The polyimide bagging materials (for example, Kapton or Upilex) are more brittle and harder to work with than the nylon materials...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060273
EISBN: 978-1-62708-355-3
... . . . . . . Malleable ferritic cast irons 241 35 221 32 Palladium 207 30 34 5 Gold 207 30 . . . . . . Magnesium alloys, cast 207 30 83 12 Polyimides, reinforced 193 28 34 5 Platinum 186 27 14 2 Iron P/M parts; as-sintered 179 26 76 11 Aluminum alloys, 1000 series 165...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
... for full processed die: Attempt to remove material that can be possibly removed by chemical or RIE, such as polyimide, passivation and aluminum layer. For example: Polyimide can be removed by dipping into Hydrofluoric Acid (HF) or using the RIE recipe Oxygen (O 2 ) + Argon (Ar). Perform RIE...
Abstract
With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870255
EISBN: 978-1-62708-314-0
... cores, such as glass or aramid, must be held in the expanded position and dipped in a liquid resin, which then must be cured before the expansion force can be released. Although epoxy and polyester resin systems are possible, phenolic and to some extent polyimide for higher-temperature applications...
Abstract
This chapter discusses the advantages and disadvantages of sandwich and integral cocured structures, and the methods by which they are made. It begins by explaining where and how sandwich construction is used and why it is so efficient. It then describes the design and fabrication of honeycomb panels and foam cores along with their respective applications and unique attributes. The chapter also discusses the cocuring process and its use in fabricating unitized structures.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300301
EISBN: 978-1-62708-323-2
... wheel test with reduced test time. Some of the winning plastics are ultrahigh-molecular-weight polyethylene (UHMWPE), synthetic fluorine-containing resin (polytetrafluoroethylene), nylon and molybdenum disulfide (MoS 2 ), and polyimide containing carbon; this suggests that slippery plastics do well...
Abstract
This chapter covers the friction and wear behaviors of plastics and elastomers. It begins by describing the molecular differences between the two types of polymers and their typical uses. It then discusses the important attributes of engineering plastics and their suitability for applications involving friction, erosion, and adhesive and abrasive wear. It also discusses the tribology of elastomers and rubber along with their basic differences and the conditions under which they produce Schallamach waves. It includes information on polymer composites as well.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2005
DOI: 10.31399/asm.tb.gmpm.t51250077
EISBN: 978-1-62708-345-4
... for some thermosets also limits their use. Polyimides Polyimides, which are available commercially either as thermoplastic or thermoset resins, are used for high-temperature gear applications. Finish machined thermoset polyimide grades are unmodified or internally lubricated. Thermoplastic polyimide...
Abstract
Plastic gears are continuing to displace metal gears in applications ranging from automotive components to office automation equipment. This chapter discusses the characteristics, classification, advantages, and disadvantages of plastics for gear applications. It provides a comparison between the properties of metals and plastics for designing gears. The chapter reviews some of the commonly used plastic materials for gear applications including thermoplastic and thermoset gear materials. The chapter also describes the processes involved in plastic gear manufacturing.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550325
EISBN: 978-1-62708-307-2
... of a water molecule each time the reaction occurs. When thermosets such as phenolics and polyimides that cure by condensation reactions are used for molded parts, they often contain high porosity levels, due to the water or alcohol vapors created by the condensation reactions. Addition-curing thermosets...
Abstract
This chapter describes the molecular structures and chemical reactions associated with the production of thermoset and thermoplastic components. It compares and contrasts the mechanical properties of engineering plastics with those of metals, and explains how fillers and reinforcements affect impact and tensile strength, shrinkage, thermal expansion, and thermal conductivity. It examines the relationship between tensile modulus and temperature, provides thermal property data for selected plastics, and discusses the effect of chemical exposure, operating temperature, and residual stress. The chapter also includes a section on the uses of thermoplastic and thermosetting resins and provides information on fabrication processes and fastening and joining methods.
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