Skip Nav Destination
Close Modal
By
Huei Hao Yap, Zhi Jie Lau
By
Becky Holdford
Search Results for
polishing
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-20 of 749
Search Results for polishing
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Book Chapter
Rough Grinding and Polishing
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030043
EISBN: 978-1-62708-349-2
... Abstract Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite materials. First, it provides information on grinding and polishing equipment and describes the processes...
Abstract
Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite materials. First, it provides information on grinding and polishing equipment and describes the processes and process variables for sample preparation. Then, the chapter discusses the processes of abrasive sizing for grinding and rough polishing. Next, it provides a summary of grinding methods, rough polishing, and final polishing. Finally, information on common polishing artifacts that can result from any of the steps is provided.
Book Chapter
Special Sample Preparation and Polishing
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030067
EISBN: 978-1-62708-349-2
... in the preparation of titanium honeycomb composites, boron fiber composites, titanium/polymeric composite hybrids, and uncured prepreg materials. boron fiber composites microscopic analysis polishing polymeric composites sample preparation titanium honeycomb composites titanium/polymeric composite...
Abstract
The most common methods for preparing polymeric composites for microscopic analysis can be used for most fiber-reinforced composite materials. There are, however, a few composite materials that require special preparation techniques. This chapter discusses the processes involved in the preparation of titanium honeycomb composites, boron fiber composites, titanium/polymeric composite hybrids, and uncured prepreg materials.
Book Chapter
Electromechanical Polishing Procedures
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850541
EISBN: 978-1-62708-260-0
... Abstract This appendix contains recipes of the electrolytic solutions in which various metals are polished in preparation for metallographic examination. electrolyte electromechanical polishing Metallography Principles and Practice George F. Vander Voort, p 541-542 DOI: 10.31399...
Abstract
This appendix contains recipes of the electrolytic solutions in which various metals are polished in preparation for metallographic examination.
Book Chapter
Attack Polishing Procedures
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850543
EISBN: 978-1-62708-260-0
... Abstract This appendix lists attack-polishing solutions and procedures used in metallographic sample preparation. attack polishing metals Metallography Principles and Practice George F. Vander Voort, p 543-551 DOI: 10.31399/asm.tb.mpp.t67850543 Copyright © 1999 ASM International® All...
Abstract
This appendix lists attack-polishing solutions and procedures used in metallographic sample preparation.
Book Chapter
Chemical Polishing Solutions
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850552
EISBN: 978-1-62708-260-0
... Abstract This appendix lists chemical polishing solutions and procedures used in metallographic sample preparation. chemical polishing metals Metallography Principles and Practice George F. Vander Voort, p 552-561 DOI: 10.31399/asm.tb.mpp.t67850552 Copyright © 1999 ASM International®...
Abstract
This appendix lists chemical polishing solutions and procedures used in metallographic sample preparation.
Book Chapter
Electrolytic Polishing Solutions
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850562
EISBN: 978-1-62708-260-0
... Abstract This appendix provides detailed information on the processes and procedures used in electrolytic polishing. It lists important process parameters, including time, temperature, voltage, and current density, as well as the recipes of electrolytic solutions used. The information...
Abstract
This appendix provides detailed information on the processes and procedures used in electrolytic polishing. It lists important process parameters, including time, temperature, voltage, and current density, as well as the recipes of electrolytic solutions used. The information is presented in tabular form, corresponding to specific metals and their alloys.
Book Chapter
Delayering Techniques: Dry/Wet Etch Deprocessing and Mechanical Top-Down Polishing
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
... layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques...
Abstract
With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.
Book Chapter
Cross-Sectioning: Mechanical Polishing, Ion Milling, and Focused Ion Beam (FIB)
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
...) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing...
Abstract
Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.
Image
Application of alumina polishing suspension during hand polishing of a comp...
Available to PurchasePublished: 01 November 2010
Fig. 3.16 Application of alumina polishing suspension during hand polishing of a composite sample
More
Image
Effect of peening, honing, and polishing on the reversed bending fatigue st...
Available to PurchasePublished: 01 December 1999
Fig. 8.32 Effect of peening, honing, and polishing on the reversed bending fatigue strength of a carburized alloy steel. Source: Ref 35
More
Image
in Types of Wear and Erosion and Their Mechanisms
> Tribomaterials: Properties and Selection for Friction, Wear, and Erosion Applications
Published: 30 April 2021
Fig. 4.21 Polishing abrasion; Ra, roughness average
More
Image
(a) Schematic cross section through a sample subjected to polishing, indica...
Available to Purchase
in Metallographic Technique: Micrography
> Metallography of Steels: Interpretation of Structure and the Effects of Processing
Published: 01 August 2018
Fig. 5.2 (a) Schematic cross section through a sample subjected to polishing, indicating the three most relevant thicknesses, related to the surface quality: e r —rugosity, e d —deformed thickness, and e t —total thickness affected by the polishing process. (b) Evolution of the three
More
Image
Some ways of holding small parts to facilitate proper polishing for microgr...
Available to Purchase
in Metallographic Technique: Micrography
> Metallography of Steels: Interpretation of Structure and the Effects of Processing
Published: 01 August 2018
Fig. 5.4 Some ways of holding small parts to facilitate proper polishing for micrographic examination. These are practical ways of avoiding mounting samples in polymers.
More
Image
Polishing defects: A—comets; B—brown stains; C—halos surrounding small pore...
Available to Purchase
in Metallographic Technique: Micrography
> Metallography of Steels: Interpretation of Structure and the Effects of Processing
Published: 01 August 2018
Fig. 5.8 Polishing defects: A—comets; B—brown stains; C—halos surrounding small pores in the sample.
More
Image
Published: 01 December 2003
Fig. 10 Application of diamond paste to a nylon cloth for preliminary polishing
More
Image
Automated grinding/polishing head showing composite specimens mounted in th...
Available to PurchasePublished: 01 November 2010
Fig. 2.7 Automated grinding/polishing head showing composite specimens mounted in the three rectangular openings. After the specimens are cut to shape, they can be clamped in the openings of the head for polishing and then easily removed for analysis. All composite samples to be polished
More
Image
(a) Automated polishing head containing circular sample openings. Notice th...
Available to PurchasePublished: 01 November 2010
Fig. 2.15 (a) Automated polishing head containing circular sample openings. Notice the smaller sample length in the circular mounts. Also, circular cavities cannot accommodate unmounted composite specimens. The samples in this mount have been made with different mounting resins, which result
More
Image
Preparation steps for the development of a manual polishing mount. (a) Back...
Available to PurchasePublished: 01 November 2010
Fig. 2.16 Preparation steps for the development of a manual polishing mount. (a) Backup sides with three specimens in the center. (b) Mount before bonding with epoxy. (c) Mold with taped ends for retaining the bonding resin and holding samples while curing. (d) Mounted specimens ready
More
Image
Photograph of automated polishing equipment showing a series of four automa...
Available to PurchasePublished: 01 November 2010
Fig. 3.2 Photograph of automated polishing equipment showing a series of four automated polishing stations. This allows easy sample movement from one automated polisher to the next without having to change platens or process parameters.
More
Image
Photograph of a manual polishing wheel with a magnetic disk adhered to the ...
Available to PurchasePublished: 01 November 2010
Fig. 3.3 Photograph of a manual polishing wheel with a magnetic disk adhered to the platen and the corresponding metal disk, which has the polishing pad or cloth adhered to the surface. All samples to be processed should be subjected to the first step and proceed in order, so that the platens
More
1