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polishing
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
... layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques...
Abstract
With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
...) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing...
Abstract
Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850541
EISBN: 978-1-62708-260-0
... Abstract This appendix contains recipes of the electrolytic solutions in which various metals are polished in preparation for metallographic examination. electrolyte electromechanical polishing Metallography Principles and Practice George F. Vander Voort, p 541-542 DOI: 10.31399...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850543
EISBN: 978-1-62708-260-0
... Abstract This appendix lists attack-polishing solutions and procedures used in metallographic sample preparation. attack polishing metals Metallography Principles and Practice George F. Vander Voort, p 543-551 DOI: 10.31399/asm.tb.mpp.t67850543 Copyright © 1999 ASM International® All...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850552
EISBN: 978-1-62708-260-0
... Abstract This appendix lists chemical polishing solutions and procedures used in metallographic sample preparation. chemical polishing metals Metallography Principles and Practice George F. Vander Voort, p 552-561 DOI: 10.31399/asm.tb.mpp.t67850552 Copyright © 1999 ASM International®...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850562
EISBN: 978-1-62708-260-0
... Abstract This appendix provides detailed information on the processes and procedures used in electrolytic polishing. It lists important process parameters, including time, temperature, voltage, and current density, as well as the recipes of electrolytic solutions used. The information...
Abstract
This appendix provides detailed information on the processes and procedures used in electrolytic polishing. It lists important process parameters, including time, temperature, voltage, and current density, as well as the recipes of electrolytic solutions used. The information is presented in tabular form, corresponding to specific metals and their alloys.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030043
EISBN: 978-1-62708-349-2
... 2000 … 10 … 1000 9 2500 … 8 … 1200 6 Fig. 3.9 Cross sections of 120-grit silicon carbide paper that was polished using diamond polishing compound. (a) Unused paper. Bright-field illumination, 50× objective. (b) After the preparation of one sample. A more uniform surface can...
Abstract
Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite materials. First, it provides information on grinding and polishing equipment and describes the processes and process variables for sample preparation. Then, the chapter discusses the processes of abrasive sizing for grinding and rough polishing. Next, it provides a summary of grinding methods, rough polishing, and final polishing. Finally, information on common polishing artifacts that can result from any of the steps is provided.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030067
EISBN: 978-1-62708-349-2
... composite specimens in a diallyl phthalate blank Fig. 4.5 Polished boron fiber composite cross section. Bright-field illumination, 10× objective Fig. 4.6 Montage showing a polished titanium fastener/polymer composite assembly. Bright-field illumination, 65 mm macrophotograph Fig...
Abstract
The most common methods for preparing polymeric composites for microscopic analysis can be used for most fiber-reinforced composite materials. There are, however, a few composite materials that require special preparation techniques. This chapter discusses the processes involved in the preparation of titanium honeycomb composites, boron fiber composites, titanium/polymeric composite hybrids, and uncured prepreg materials.
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Published: 01 November 2010
Fig. 3.16 Application of alumina polishing suspension during hand polishing of a composite sample
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in Silicon Device Backside De-Processing and Fault Isolation Techniques
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 1 A packaged unit mounted on a stainless steel parallel polishing fixture is shown. The yellow triangle indicate the first pin location.
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Published: 01 November 2019
Figure 33 Side camera 45° view of in process polishing. Locally edges are flat but rough, center is smooth and flat. Corners sit 60 µm lower than the center due to natural convex warpage of this particular BGA package.
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Published: 01 November 2019
Figure 49 Original package after leadframe removal and polishing.
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Published: 01 December 1984
Figure 2-18 Example of a commercially available polishing table equipped with two 8-in wheels and a sink. (Courtesy of Leco Corp.)
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Published: 01 December 1984
Figure 2-19 Leco VP-50 variable-speed polishing wheel with AP-50 automatic variable-load polishing attachment. (Courtesy of Leco Corp.)
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Published: 01 December 1984
Figure 2-22 (Part 1) Appearance of commonly used polishing cloths (Buehler Ltd. cloths shown), 60 ×.
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Published: 01 December 1984
Figure 2-22 (Part 2) Appearance of commonly used polishing cloths (Buehler Ltd. cloths shown), 60 ×.
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Published: 01 September 2008
Fig. 3 (a) Plastic molds for a drilling machine body, showing a polishing operation, (b) Baby bath plastic injection mold, after final polishing. Courtesy of Villares Metals.
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in Case Studies of Steel Component Failures in Aerospace Applications
> Failure Analysis of Heat Treated Steel Components
Published: 01 September 2008
Fig. 77 Machining marks and polishing evident on the shank of the failed bolt
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Published: 01 November 2007
Fig. 3.8 Electron microscope image of pearlite after polishing and etching in nital. Original magnification: 11,000 ×. Source: Ref 3.2
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in Metallographic Technique: Micrography
> Metallography of Steels: Interpretation of Structure and the Effects of Processing
Published: 01 August 2018
Fig. 5.2 (a) Schematic cross section through a sample subjected to polishing, indicating the three most relevant thicknesses, related to the surface quality: e r —rugosity, e d —deformed thickness, and e t —total thickness affected by the polishing process. (b) Evolution of the three
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