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photoresists

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Published: 01 November 2019
Figure 2 Photoresist on silicon, cleaved and imaged in SEM. More
Image
Published: 01 November 2019
Figure 99 AVC analysis of a polysilicon resistor showing (a) reference resistor, (b) failing resistor, and (c) in-line inspection SEM image of faulty photoresist shape. From [13] . More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ems.t53730139
EISBN: 978-1-62708-283-9
... and the porosity decreases. The decrease in porosity is accompanied by an increase in strength. Modern Manufacturing Techniques The intricate circuits formed on semiconductor chips are patterned by photolithography. A photosensitive material ( photoresist ) is applied to a semiconductor surface and baked...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
.... Dielectric and non-metallic materials such as oxides and nitrides typically cleave easily and can be imaged in the Scanning Electron Microscope (SEM) directly following cross-sectioning. Figure 2 shows photoresist on silicon cleaved and directly imaged in the SEM. Stacks coated with photoresist, Spin...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230339
EISBN: 978-1-62708-298-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ems.9781627082839
EISBN: 978-1-62708-283-9
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
... no yes 1800 Photoresist O2 10-200 0-500 50 yes yes 800 Platinum Cl2, Ar (90°C) 100-200 No 5 no yes 1600 Polyimide O2 + Ar 50-500 0-500 20 yes yes 5000 Polysilicon (isotropic) Cl2 50-250 180 yes yes 5000 Polysilicon (anisotropic) Cl2 + HBr 20-200 0-500...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090109
EISBN: 978-1-62708-462-8
... from image sensors while preserving electrical and optical access during the FA process is challenging. Cured/baked photoresist is resistant to most acids and solvents. Hence it is necessary to develop unique recipes for different color filter array and microlens materials. It is often necessary...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230207
EISBN: 978-1-62708-351-5
... two small leaks, which were ascribed to inadvertent contamination of the tin plating from residual photoresist. These leaks were subsequently sealed with a solder applied to the inner walls of the two heat exchangers and were perfectly usable thereafter. Fig. 6.8 Single sheet of copper...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740213
EISBN: 978-1-62708-308-9
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... narrow, no masking or other measures are required to prevent lateral solder flow along the tracks. The interconnects are not by any means restricted to a spherical geometry. Indeed, advances in photoresist technology make it possible to fabricate interconnects with aspect ratios of 5 to 1, even...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8