Search Results for ph.d

The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its microstructure in order to identify the root cause of failure. This chapter assesses the tools and techniques used for those purposes and the challenges brought on by continued transistor scaling, advanced 3D packages, and new IC architectures. The areas covered include sample preparation, nanoprobing, microscopy, FIB circuit edit, and scanning probe microscopy.

This chapter provides information on the biennial International Wear of Materials Conference, which is the inspiration for this book. It reviews the fundamentals of tribology, tribosystems, and related terminology. The glossary at the end of this chapter is intended to familiarize readers with some of the fundamental tribology terms that will be repeated throughout this book.

This chapter sheds light on the challenges involved in diagnosing faults in analog, mixed-signal, and RF circuits. It describes some of the work being done to leverage the benefits of standardization, improve fault simulation tools, and overcome limitations on optical fault isolation techniques. One of the solutions being considered is to integrate LEDs throughout the analog circuit, thereby using light to report the status of internal signals.

This chapter assesses the benefits of using a solid immersion lens (SIL) to detect faults in ICs via optical imaging and laser-stimulation techniques. It discusses the advantages and limitations of different types of SILs and their effect on spatial resolution, spot size, focus depth, and collection efficiency. It also provides a brief overview of technical challenges at the die level.

This chapter lists all of the references cited in the chapters on damage mechanisms.

This chapter describes the effects of metallurgical variables on the corrosion of aluminum alloys. Emphasis is placed on the effect of constituent particles on pitting corrosion of aluminum.

This article describes the weldability tests that are used to evaluate the effects of welding on such properties and characteristics as base-metal and weld-metal cracking; base-metal and weld-metal ductility; weld penetration; and weld pool shape and fluid flow. It also describes several weldability tests for evaluating cracking susceptibility, classified as self-restraint or externally loaded tests. The article discusses the processes, advantages, and disadvantages of the weld pool shape tests, the weld penetration tests, and the Gleeble test.

Process gas control for plasma (ion) nitriding is a matter of estimating the flows necessary to accomplish the required surface metallurgy. This chapter reviews several studies aimed at better understanding process gas control in plasma nitriding and its influence on compound zone formation. Emphasis is placed on the effect of sputtering on the kinetics of compound zone formation. The discussion covers the processes involved in process gas control analysis by photo spectrometry and mass spectrometry and the difficulties associated with gas analysis.

This chapter recounts some of the early efforts and milestones in the development of stainless steel powders and their use in powder metallurgy applications.

This article is a detailed account of the mechanisms of fatigue failure of polymers, namely thermal fatigue failure and mechanical fatigue failure. The mechanical fatigue failure is discussed in terms of fatigue crack initiation and fatigue crack propagation.

This chapter describes a sheet metal forming method, called hydroforming, that uses pressurized liquid and a shaped punch or die. It discusses the advantages and disadvantages of the two approaches, the effect of process variations, and tooling modifications intended to reduce sheet bulging. It identifies the factors that influence part quality and explains how finite-element analysis can be used to optimize hydroforming operations. It also discusses the economics of sheet hydroforming and presents several application examples.

An architectural shift to buried power rails (BPRs) with backside power delivery (BPD) is on the horizon as CMOS technology approaches the 2 nm node. The obstruction created by the presence of BPD networks obsoletes many of the electrical fault isolation (EFI) techniques that have been used for the past few decades and severely degrades the performance of others. This chapter provides an overview of EFI methods that are still applicable to ICs with BPD networks, including e-beam and atomic force probing, x-ray and magnetic field imaging, and lock-in thermography. It assesses the technical challenges of each method as well as the potential for improvement.

Any forming process that converts stored energy to plastic deformation in less than a few milliseconds is considered a high-velocity or impulse forming process. This chapter discusses the operating principles, equipment, and applications of the most common high-rate forming processes, including high-velocity hydroforming, high-velocity mechanical forming, and electromagnetic or energy-based forming.

This chapter reviews the nomenclature of different vehicle components helpful in identifying the target applications and discusses the implementation of advanced high-strength steels (AHSS) in automotive and nonautomotive industries. In addition, the chapter provides information on the utilization and trends of AHSS in vehicle bodies and closures.

This chapter summarizes the microstructural basis of conventional high-strength steels (HSS) and the three generations of advanced high-strength steels (AHSS). It presents the requirements of a third generation advanced high-strength steel and its microstructural design. The chapter also includes a discussion about novel AHSS processing routes: quenching, partitioning, and double-stabilization thermal cycling.

This chapter discusses the ambient-temperature corrosion characteristics of aluminum metal-matrix composites (MMCs), including composites formed with boron, graphite, silicon carbide, aluminum oxide, and mica. It also discusses the effect of stress-corrosion cracking on graphite-aluminum composites and the use of protective coatings and design criteria for corrosion prevention.

Boiler tubes subjected to cyclic or fluctuating loads over extended periods of time are prone to fatigue failure. Fatigue can occur at relatively low stresses and is implicated in almost 80% of the tube failures in firetube boilers. This chapter covers the most common forms of boiler tube fatigue, including mechanical or vibrational fatigue, corrosion fatigue, thermal fatigue, and creep-fatigue interaction. It discusses the causes, characteristics, and impacts of each type and provides several case studies.

This chapter focuses on key requirements for obtaining third-generation advanced high-strength steels (AHSS). The discussion covers the microstructure design for AHSS, novel AHSS processing routes, the development of nanostructured AHSS, and the development of third-generation AHSS by the Integrated Computational Materials Engineering approach.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.