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Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340339
EISBN: 978-1-62708-427-7
.... A huge range of products in this industry segment is also illustrated. The need for sustainable production and recyclability is also discussed. aluminum alloys aluminum cans aluminum foil packaging products recyclability sustainable production Finishing process for thin aluminum foil...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340453
EISBN: 978-1-62708-427-7
... and products estimate sustainability from an accounting of the energy and usage costs through the lifetime: production, use, reuse, and/or disposal. The ongoing waste management challenge is becoming an increasingly large consideration in materials selection. Although plastic packaging in particular receives...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860065
EISBN: 978-1-62708-338-6
... heating means, depending on the resin requirements. After cure, the wound product and mandrel are separated. An alternate part fabrication method is to use uncured filament-wound fabric as a sheet molding material. The material is removed from the mandrel, placed in a mold, and cured. Comprehensive...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110673
EISBN: 978-1-62708-247-1
..., cross-training, and techniques. For the purposes of this paper, I will discuss the history of training activities in the failure/product analysis discipline, and describe where this area is heading. Training for design, packaging, processing, reliability, and test, although different in content...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780141
EISBN: 978-1-62708-268-6
... be obvious or quite subtle. The following list summarizes a few commonly encountered contaminant sources: Packaging materials may contaminate products. This can occur even with new packaging materials if the packing material flakes, generates dust, exudes oil, or otherwise transfers substances from...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Abstract The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340117
EISBN: 978-1-62708-427-7
... . The use of the term is not common, but it may be encountered in the product used for fuel tankers. The applications of rolled products, which cover the range from soft packaging foil to high-strength aerospace plate, are described in Chapters 11 – 19 in this book. The processing steps required...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090021
EISBN: 978-1-62708-462-8
... Abstract Recent trends in electronic packaging, including the growing use of 3D designs and heterogeneous integration, are greatly adding to the complexity of isolating faults in semiconductor products. This chapter reviews the latest IC packaging and integration solutions and assesses...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... inspection followed by material evaluation and characterization. These processes are typically followed by evaluation of the packages to identify defects, degradations, and failure mechanisms that are caused by the processes (e.g., cleaning, solder dipping of leads, reballing) used in creating counterfeit...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870001
EISBN: 978-1-62708-299-0
... and the classifications, designations, and grades of available product forms. It also explains how aluminum alloys are used in aerospace, automotive, rail, and marine applications as well as in building and construction, electrical products, manufacturing equipment, packaging, and consumer durables such as appliances...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090001
EISBN: 978-1-62708-462-8
..., and thermal emissions; (2) 2D/2.5D/3D packaging; (3) system-level, analog/radio frequency (RF), and digital functional; (4) product yield, tests, and diagnostics; and (5) general issues (leading-edge technologies). Reference Reference 1. Beyne E. , A Look Inside the 3D Technology Toolbox...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Image
Published: 30 June 2023
Fig. 7.12 Cold-finished rod and bar (CFRB). (a) Standard straight-length cold-finished rod packaged for customer shipment and (b) a variety of final products manufactured from CFRB stock More
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340001
EISBN: 978-1-62708-427-7
... by the world’s metals industries. Transportation, packaging, building and construction, and other industrial uses require aluminum alloy products in many shapes and forms to meet a multitude of customer specifications. The guiding principle for aluminum technologists is to understand customer requirements...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... package (QFP) device parts ( Figure 1 ). The result is that with one AES measurement the solder quality assessment of the product can be made. Figure 1 Examples of QFPs (top) and BGAs (bottom) Every year semiconductor devices that are deemed obsolete or unusable are sent to recycling centers...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410009
EISBN: 978-1-62708-280-8
... product designers and casting engineers. Although each of these disciplines contributes individual expertise to the team, they share critical common goals. Figure 2.1 summarizes the expertise of each discipline and their common goals. Together, they strive to achieve common objectives...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ems.t53730149
EISBN: 978-1-62708-283-9
... for brooms, battery cases, ice scrapers, trays, and pallets. Virgin polystyrene (PS) is used for rigid and foamed products including coffee cups; among the recycled applications are foam packaging, thermal insulation, egg cartons, carryout containers, and rulers. Rubber Because most rubber products...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090155
EISBN: 978-1-62708-462-8
... Abstract This chapter summarizes critical gaps and long-term needs in failure analysis technology as it relates to logic and memory devices and IC packages. It assesses the impact of vertical integration, new materials, and expansion in the third dimension on volume analysis, sample preparation...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110262
EISBN: 978-1-62708-247-1
... (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
... a single, fully integrated monolithic chip. It favors die yield and allows faster product time to market as intellectual property (IP) reuse is enabled. Stacking implies increased functionality and performance without compromising the X-Y footprint. Examples of packaging technologies that enable...