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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... Abstract Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Abstract The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340339
EISBN: 978-1-62708-427-7
... Abstract This chapter describes how aluminum sheet and foil alloys are processed to produce functional, economical packages that meet the various industry performance criteria. The focus is on the key customer requirements for three main application segments: foil, cans, and impact extrusions...
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Published: 01 November 2019
Figure 5 Examples of packaging failure analysis with 2D projection type x-ray imaging system. Images provided by Phoenix |x-ray, a division of GE Sensing and Inspection Technology. More
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Published: 01 November 2019
Figure 7 (a) Volume rendering of a flip chip packaging with voxel size of 7 um. (b) Volume rendering of two neighboring BGA solder joints with cross sectional images to show solder contact with pad. More
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Published: 01 August 2013
Fig. 6.7 Relative uses of aluminum. Packaging includes beverage cans. Trans-portation includes cars, trucks, and aircraft. More
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Published: 01 November 2019
Figure 1 Trend overview for semiconductor packaging integration on board and system level. [2] More
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Published: 01 August 1999
Fig. 13 Penetration of the aluminum foil vapor barrier on laminated packaging. The interior of the package is back illuminated, showing the loss of aluminum foil to filiform attack. Light microscopy. 10× More
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Published: 01 April 2004
Fig. 4.38 Predicted time for moisture to permeate various packaging materials in one geometry. Adapted from Traeger [1976 ] More
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Published: 30 June 2023
Finishing process for thin aluminum foil to be used for packaging applications. Source: European Aluminium Foil Association More
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Published: 30 June 2023
Fig. 15.1 Array of aluminum packaging forms of foil, semirigid containers, cans, and impact extrusions More
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Published: 01 November 2023
Fig. 1 Evolution of IC packaging More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
... Abstract This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... Abstract The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... Abstract As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes...
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Published: 01 September 2011
Fig. 6.7 Rotating fiber package creel More
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Published: 01 September 2011
Fig. 6.9 Rotating package paths to impregnator More
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Published: 01 September 2011
Fig. 6.12 Guide-to-package distance More
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Published: 01 August 2018
Fig. 9.14 Three-dimensional reconstruction of two laths in the martensite package in a Fe-0.2% C alloy. A series of micrographs 1.5 μm spaced in depth were made to create a reconstruction such as this one. A significant portion of the laths have a cross section that is approximately More
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Published: 01 November 2019
Figure 3 Virtual cross section examples of package-level defects that are commonly imaged with 3D X-ray Microscopy tools [13] . More