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packaging
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... Abstract Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis...
Abstract
Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis. This article provides an overview of CSPs and their classification as well as their advantages and applications, and reveals some of the challenges in performing failure analysis on CSPs, particularly for CSPs in special package configurations such as stacked die multi-chip-packages (MCPs) and wafer level CSPs (WLCSPs). The discussion covers special requirements of CSPs such as precision decapsulation for fine ball grid array packages, accessing the failing die for MCP packages, and careful handling for WLCSP. Solutions and best practices are shared on how to overcome these challenges. The article also presents a few case studies to demonstrate how failure analysis work on CSPs can be successfully completed.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Abstract The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support...
Abstract
The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340339
EISBN: 978-1-62708-427-7
... Abstract This chapter describes how aluminum sheet and foil alloys are processed to produce functional, economical packages that meet the various industry performance criteria. The focus is on the key customer requirements for three main application segments: foil, cans, and impact extrusions...
Abstract
This chapter describes how aluminum sheet and foil alloys are processed to produce functional, economical packages that meet the various industry performance criteria. The focus is on the key customer requirements for three main application segments: foil, cans, and impact extrusions. A huge range of products in this industry segment is also illustrated. The need for sustainable production and recyclability is also discussed.
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in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 5 Examples of packaging failure analysis with 2D projection type x-ray imaging system. Images provided by Phoenix |x-ray, a division of GE Sensing and Inspection Technology.
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in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 7 (a) Volume rendering of a flip chip packaging with voxel size of 7 um. (b) Volume rendering of two neighboring BGA solder joints with cross sectional images to show solder contact with pad.
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Published: 01 August 2013
Fig. 6.7 Relative uses of aluminum. Packaging includes beverage cans. Trans-portation includes cars, trucks, and aircraft.
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in Non-destructive Techniques for Advanced Board Level Failure Analysis
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 1 Trend overview for semiconductor packaging integration on board and system level. [2]
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Published: 01 August 1999
Fig. 13 Penetration of the aluminum foil vapor barrier on laminated packaging. The interior of the package is back illuminated, showing the loss of aluminum foil to filiform attack. Light microscopy. 10×
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Published: 01 April 2004
Fig. 4.38 Predicted time for moisture to permeate various packaging materials in one geometry. Adapted from Traeger [1976 ]
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Published: 30 June 2023
Finishing process for thin aluminum foil to be used for packaging applications. Source: European Aluminium Foil Association
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Published: 30 June 2023
Fig. 15.1 Array of aluminum packaging forms of foil, semirigid containers, cans, and impact extrusions
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
... Abstract This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how...
Abstract
This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... Abstract The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents...
Abstract
The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... Abstract As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes...
Abstract
As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.
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in Conventional Heat Treatments—Usual Constituents and Their Formation
> Metallography of Steels: Interpretation of Structure and the Effects of Processing
Published: 01 August 2018
Fig. 9.14 Three-dimensional reconstruction of two laths in the martensite package in a Fe-0.2% C alloy. A series of micrographs 1.5 μm spaced in depth were made to create a reconstruction such as this one. A significant portion of the laths have a cross section that is approximately
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in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 3 Virtual cross section examples of package-level defects that are commonly imaged with 3D X-ray Microscopy tools [13] .
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