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optical analysis
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in Direct Chill Ingot and Continuous Casting Processes
> Aluminum: Technology, Industry, and Applications
Published: 30 June 2023
Fig. 4.6 Analysis of chemical composition by an optical emission spectroscopy (OES), which (a) creates a spark on the sample’s surface, and (b) then the aluminum alloy is vaporized and the different elements emit different wave lengths of energy
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in Accepted Practice for Recognizing Artifacts in Air Plasma Spray Thermal Barrier Coating Microstructures
> Thermal Spray Technology: Accepted Practices
Published: 01 June 2022
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030043
EISBN: 978-1-62708-349-2
... cloth. Note the rounded fiber interface and the lack of interferometer bands on the longitudinal fibers. Abstract Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite...
Abstract
Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite materials. First, it provides information on grinding and polishing equipment and describes the processes and process variables for sample preparation. Then, the chapter discusses the processes of abrasive sizing for grinding and rough polishing. Next, it provides a summary of grinding methods, rough polishing, and final polishing. Finally, information on common polishing artifacts that can result from any of the steps is provided.
Image
in Toughening Methods for Thermoset-Matrix Composites
> Optical Microscopy of Fiber-Reinforced Composites
Published: 01 November 2010
Fig. 10.5 Preformed-particle-modified interlayer regions of various carbon fiber composite materials showing differences in the optical analysis technique and the sample-preparation method. (a) Reflected-light optical analysis of an interlayer region showing particles residing
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030115
EISBN: 978-1-62708-349-2
... the optical path and interfere with the microscopic analysis. The second surface is prepared by initially cutting and shaping the mount. This is done so that it can be trimmed down using a vacuum chuck and also so it will fit inside of a sacrificial hand vise for further preparation. The overall procedure...
Abstract
Transmitted-light methods reveal more details of the morphology of fiber-reinforced polymeric composites than are observable using any other available microscopy techniques. This chapter describes the various aspects relating to the selection and preparation of ultrathin-section specimens of fiber-reinforced polymeric composites for examination by transmitted-light microscopy techniques. The preparation steps covered are a selection of the rough section, preparation of the rough section for preliminary mounting, grinding and polishing the primary-mount first surface, mounting the first surface on a glass slide, and preparing the second surface (top surface). The optimization of microscope conditions and analysis of specimens by microscopy techniques are also covered. In addition, examples of composite ultrathin sections that are analyzed using transmitted-light microscopy contrast methods are shown throughout.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... Abstract Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP...
Abstract
Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030089
EISBN: 978-1-62708-349-2
... the paint layer (10× objective). (b) A fluorescent penetration dye (Magnaflux Zyglo) was applied on the surface of the specimen to enhance the contrast of the microcracks. Epi-fluorescence, 390–440 nm excitation, 10× objective Abstract The analysis of composite materials using optical microscopy...
Abstract
The analysis of composite materials using optical microscopy is a process that can be made easy and efficient with only a few contrast methods and preparation techniques. This chapter is intended to provide information that will help an investigator select the appropriate microscopy technique for the specific analysis objectives with a given composite material. The chapter opens with a discussion of macrophotography and microscope alignment, and then goes on to describe various illumination techniques that are useful for specific analysis requirements. These techniques include bright-field illumination, dark-field illumination, polarized-light microscopy, interference and contrast microscopy, and fluorescence microscopy. The chapter also provides a discussion of sample preparation materials such as dyes, etchants, and stains for the analysis of composite materials using optical microscopy.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030177
EISBN: 978-1-62708-349-2
... contrast, 40× objective Fig. 10.5 Preformed-particle-modified interlayer regions of various carbon fiber composite materials showing differences in the optical analysis technique and the sample-preparation method. (a) Reflected-light optical analysis of an interlayer region showing particles...
Abstract
The second-generation composite materials were added to increase the strain to failure of the primary phase and/or create a dispersed second phase, thereby enhancing the fracture toughness of the thermosetting matrix. These matrices offered novel design capabilities for composites in a variety of aircraft applications. To improve the damage tolerance of composite materials even further, an engineering approach to toughening was used to modify the highly stressed interlayer with either a tougher material or through the use of preformed particles, leading to the third generation of composite materials. This chapter discusses the development, processes, application, advantages, and disadvantages of dispersed-phase toughening of thermoset matrices. Information on the processes of particle interlayer toughening of composite materials is also included.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical...
Abstract
As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... with the help of an air cushion which reduces friction between the wafer and platen, as shown in Figure 7(a) . The air flow is removed and vacuum activated once the die of interest arrives at the position for optical analysis. Since the tester is decoupled from the probe card via the cables, the probe card...
Abstract
This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090003
EISBN: 978-1-62708-462-8
... photon emission microscopy spatial resolution technology scaling visible light probing Background Electrical/optical fault isolation (EFI) ( Ref 1 ) is a series of processes succeeding non-destructive testing (NDT) and microscopy in failure analysis (FA) of integrated circuits (ICs...
Abstract
This chapter assesses the capabilities and limitations of electric fault isolation (EFI) technology, the measurement challenges associated with new device architectures, and the pathways for improvement in emission microscopy, laser stimulation, and optical probing. It also assesses the factors that influence signal strength, spatial and timing resolution, and alignment accuracy between signal response images and the physical layout of the IC.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... Abstract This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local...
Abstract
This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090083
EISBN: 978-1-62708-462-8
... optical sumfrequency-microscope for interface and surface analysis. In 1999, he joined the failure analysis department of Infineon Technologies AG and works there currently in Munich as the lead principal failure analysis engineer. He is the author of several papers and international conference...
Abstract
This chapter assesses the benefits of using a solid immersion lens (SIL) to detect faults in ICs via optical imaging and laser-stimulation techniques. It discusses the advantages and limitations of different types of SILs and their effect on spatial resolution, spot size, focus depth, and collection efficiency. It also provides a brief overview of technical challenges at the die level.
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780193
EISBN: 978-1-62708-268-6
... Abstract This appendix is a compilation of suggested analysis methods for suspected component failure causes. component failure causes failure analysis Table A.1 Suspected component failure cause Suggested analysis method Nonconforming dimensions Dimensional...
Image
Published: 01 November 2007
Fig. 4.5 Formation of internal aluminum nitrides beneath external oxide scales and internal oxides in alloy 601 after exposing to a furnace oxidizing atmosphere for approximately 4 to 5 years in a temperature range of 760 to 870 °C (1400 to 1600 °F). (a) Optical micrograph showing the external
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110042
EISBN: 978-1-62708-247-1
... Abstract Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small...
Abstract
Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small details. It begins with the basic microscope column and construction. The article discusses microscope adjustments, brightfield and darkfield illumination, and microscope concepts important to liquid crystal techniques. It also discusses solid immersion lenses, infrared and ultraviolet microscopy and concludes with laser microscopy techniques such as thermal induced voltage alteration and external induced voltage alteration.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720139
EISBN: 978-1-62708-305-8
... of related techniques of these methods are also covered. chemical composition dissolved gases high-temperature combustion inert gas fusion methods optical emission spectroscopy scanning auger microprobe surface analysis X-ray fluorescence spectroscopy THE OVERALL CHEMICAL COMPOSITION...
Abstract
The overall chemical composition of metals and alloys is most commonly determined by x-ray fluorescence (XRF) and optical emission spectroscopy (OES). High-temperature combustion and inert gas fusion methods are typically used to analyze dissolved gases (oxygen, nitrogen, and hydrogen) and, in some cases, carbon and sulfur in metals. This chapter discusses the operating principles of XRF, OES, combustion and inert gas fusion analysis, surface analysis, and scanning auger microprobe analysis. The details of equipment set-up used for chemical composition analysis as well as the capabilities of related techniques of these methods are also covered.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780141
EISBN: 978-1-62708-268-6
... Abstract Contaminants can be a cause of numerous types of system failures. There are numerous techniques for confirming contaminant presence. When the presence of a contaminant is suspected, the failure analysis team must find and eliminate the contaminant source, which can be obvious or quite...
Abstract
Contaminants can be a cause of numerous types of system failures. There are numerous techniques for confirming contaminant presence. When the presence of a contaminant is suspected, the failure analysis team must find and eliminate the contaminant source, which can be obvious or quite subtle. This chapter summarizes a few commonly encountered contaminant sources to stimulate the reader's thinking about potential contaminant sources. A case study of titanium component washing at Litton Lasers is presented to illustrate how the presence of contaminants leads to a system failure.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110499
EISBN: 978-1-62708-247-1
... techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change...
Abstract
This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... inspection environmental approaches failure mode assessment and assignment material characteristics mechanical approaches nondestructive test approaches optical approaches AFTER THE FAULT-TREE, a failure-cause identification method has identified potential failure causes and the failure analysis...
Abstract
After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical and environmental approaches, and chemical and composition analysis for assessing material characteristics. This chapter is a detailed account of the working principle and the steps involved in these techniques and technologies.
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