1-20 of 372 Search Results for

optical analysis

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Image
Published: 30 June 2023
Fig. 4.6 Analysis of chemical composition by an optical emission spectroscopy (OES), which (a) creates a spark on the sample’s surface, and (b) then the aluminum alloy is vaporized and the different elements emit different wave lengths of energy More
Image
Published: 01 June 2022
Figure 5 Artifacts from optical microscopy and image analysis. More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030043
EISBN: 978-1-62708-349-2
... cloth. Note the rounded fiber interface and the lack of interferometer bands on the longitudinal fibers. Abstract Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite...
Image
Published: 01 November 2010
Fig. 10.5 Preformed-particle-modified interlayer regions of various carbon fiber composite materials showing differences in the optical analysis technique and the sample-preparation method. (a) Reflected-light optical analysis of an interlayer region showing particles residing More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030115
EISBN: 978-1-62708-349-2
... the optical path and interfere with the microscopic analysis. The second surface is prepared by initially cutting and shaping the mount. This is done so that it can be trimmed down using a vacuum chuck and also so it will fit inside of a sacrificial hand vise for further preparation. The overall procedure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... Abstract Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030089
EISBN: 978-1-62708-349-2
... the paint layer (10× objective). (b) A fluorescent penetration dye (Magnaflux Zyglo) was applied on the surface of the specimen to enhance the contrast of the microcracks. Epi-fluorescence, 390–440 nm excitation, 10× objective Abstract The analysis of composite materials using optical microscopy...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030177
EISBN: 978-1-62708-349-2
... contrast, 40× objective Fig. 10.5 Preformed-particle-modified interlayer regions of various carbon fiber composite materials showing differences in the optical analysis technique and the sample-preparation method. (a) Reflected-light optical analysis of an interlayer region showing particles...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... with the help of an air cushion which reduces friction between the wafer and platen, as shown in Figure 7(a) . The air flow is removed and vacuum activated once the die of interest arrives at the position for optical analysis. Since the tester is decoupled from the probe card via the cables, the probe card...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090003
EISBN: 978-1-62708-462-8
... photon emission microscopy spatial resolution technology scaling visible light probing Background Electrical/optical fault isolation (EFI) ( Ref 1 ) is a series of processes succeeding non-destructive testing (NDT) and microscopy in failure analysis (FA) of integrated circuits (ICs...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... Abstract This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090083
EISBN: 978-1-62708-462-8
... optical sumfrequency-microscope for interface and surface analysis. In 1999, he joined the failure analysis department of Infineon Technologies AG and works there currently in Munich as the lead principal failure analysis engineer. He is the author of several papers and international conference...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780193
EISBN: 978-1-62708-268-6
... Abstract This appendix is a compilation of suggested analysis methods for suspected component failure causes. component failure causes failure analysis Table A.1   Suspected component failure cause Suggested analysis method Nonconforming dimensions Dimensional...
Image
Published: 01 November 2007
Fig. 4.5 Formation of internal aluminum nitrides beneath external oxide scales and internal oxides in alloy 601 after exposing to a furnace oxidizing atmosphere for approximately 4 to 5 years in a temperature range of 760 to 870 °C (1400 to 1600 °F). (a) Optical micrograph showing the external More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110042
EISBN: 978-1-62708-247-1
... Abstract Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720139
EISBN: 978-1-62708-305-8
... of related techniques of these methods are also covered. chemical composition dissolved gases high-temperature combustion inert gas fusion methods optical emission spectroscopy scanning auger microprobe surface analysis X-ray fluorescence spectroscopy THE OVERALL CHEMICAL COMPOSITION...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780141
EISBN: 978-1-62708-268-6
... Abstract Contaminants can be a cause of numerous types of system failures. There are numerous techniques for confirming contaminant presence. When the presence of a contaminant is suspected, the failure analysis team must find and eliminate the contaminant source, which can be obvious or quite...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110499
EISBN: 978-1-62708-247-1
... techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... inspection environmental approaches failure mode assessment and assignment material characteristics mechanical approaches nondestructive test approaches optical approaches AFTER THE FAULT-TREE, a failure-cause identification method has identified potential failure causes and the failure analysis...