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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110042
EISBN: 978-1-62708-247-1
... Abstract Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110132
EISBN: 978-1-62708-247-1
... review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030001
EISBN: 978-1-62708-349-2
... toughening. In addition, the chapter provides information on interlayer-toughened composites and honeycomb or foam structure composite materials. It also discusses the processes in optical microscopy of composite materials. References References 1. Halpin J.C. , The Role of the Polymeric...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780177
EISBN: 978-1-62708-281-5
... Abstract This article is a brief account of various factors pertinent to the characterization of materials and analysis of optical components, namely transmission, haze, yellowness, refractive index, surface irregularity, birefringence, internal contamination, surface gloss, and color...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.9781627083492
EISBN: 978-1-62708-349-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... to ceramic cavity devices, injection molded parts, and ball grid arrays. backside preparation ball grid arrays ceramic cavity devices injection molded parts milling optics polishing thinning This tutorial will assist the analyst in making decisions on backside thinning and polishing...
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Published: 01 November 2019
Figure 3 An optical microscope image from a unit after the backside silicon etch process was completed. Silicon is removed from regions where the unit appears dark. The few remaining small bright spots are locations where silicon remains. More
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Published: 01 November 2019
Figure 7 Optical microscope images taken from a unit both before (left) and after (right) the dimpling process was performed. The contrast observed in these images is used to determine the endpoint for the dimpling process. More
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Published: 01 November 2019
Figure 10 Optical infrared emission image using 3.0 N.A. lens, CAD layout and electron beam image of the same devices from the backside of the chip More
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Published: 01 November 2019
Figure 14 Optical imaging of device FEOL from the substrate after backside delayering and etched More
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Published: 01 November 2019
Figure 30 Optical photo of the STEM-in-SEM sample holder mounted to the SEM stage. The pole piece of the objective lens is visible above the sample holder. More
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Published: 01 November 2019
Figure 3 Optical images of typical QFP leads (left) and BGA sphere (right). The green squares indicate areas that were analyzed with AES surface and AES depth profiling. More
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Published: 01 November 2019
Figure 10 A) and B) Optical microscope images of good and failed device, respectively; C) and D) SEM image failed device showing short between two pins causing electrical failure. More
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Published: 01 November 2019
Figure 17 Example of particles. A. optical microscopy: stainless steel particle exposed after FIB. B. SEM-EDX mapping: Cl-containing organic particle in SiO2 filled molding compound exposed after polish/look. More
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Published: 01 November 2019
Figure 5 (a) Low magnification optical image of the 3mm diameter membrane coated grid. The location of the sample is indicated by the arrow. (b) High magnification optical image of the TEM sample, placed on the membrane coated grid. More
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Published: 01 November 2019
Figure 17 (a) Optical image of the back of a flip-chip mounted die showing mechanical damage to corner (b) Infrared imaging shows that the damage extends to the front side circuitry More
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Published: 01 November 2019
Figure 18 Optical image of laterally stuck MEMS accelerometer More
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Published: 01 November 2019
Figure 3 Different types of Ta-CAPS: (a) Optical image showing external construction of variety of surface mount and through hole Ta-CAPS. X-ray images show internal constructions of (b) regular surface mount, (c) face down and (d) multi anode Ta- CAPS. More
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Published: 01 November 2019
Figure 14 Optical Image showing flex cracking in a cross sectioned MLCC. More
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Published: 01 November 2019
Figure 12 Optical photo showing location of the multiple data lines (horizontal) feeding into buffers below. More