Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small details. It begins with the basic microscope column and construction. The article discusses microscope adjustments, brightfield and darkfield illumination, and microscope concepts important to liquid crystal techniques. It also discusses solid immersion lenses, infrared and ultraviolet microscopy and concludes with laser microscopy techniques such as thermal induced voltage alteration and external induced voltage alteration.

Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.

This chapter provides a general description of materials and methods for manufacturing high-performance composites. The materials covered are polymer matrices and prepreg materials and the methods include infusion processes, composite-toughening methods, matrix-toughening methods, and dispersed-phase toughening. In addition, the chapter provides information on interlayer-toughened composites and honeycomb or foam structure composite materials. It also discusses the processes in optical microscopy of composite materials.

This article is a brief account of various factors pertinent to the characterization of materials and analysis of optical components, namely transmission, haze, yellowness, refractive index, surface irregularity, birefringence, internal contamination, surface gloss, and color. In addition, details on ad hoc tests used for determining the acceptability of a plastic part for its application are provided, along with typical examples.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

The analysis of composite materials using optical microscopy is a process that can be made easy and efficient with only a few contrast methods and preparation techniques. This chapter is intended to provide information that will help an investigator select the appropriate microscopy technique for the specific analysis objectives with a given composite material. The chapter opens with a discussion of macrophotography and microscope alignment, and then goes on to describe various illumination techniques that are useful for specific analysis requirements. These techniques include bright-field illumination, dark-field illumination, polarized-light microscopy, interference and contrast microscopy, and fluorescence microscopy. The chapter also provides a discussion of sample preparation materials such as dyes, etchants, and stains for the analysis of composite materials using optical microscopy.

Specimen preparation is the first step that determines the quality of the microstructural information that can be obtained using optical microscopy. This chapter describes the sample preparation methods that are applicable to most types of composite materials containing short discontinuous or continuous fibers. The sample preparation methods cover documentation and labeling of samples, sectioning the composite, clamp-mounting composite samples, mounting composite samples in casting resins, and the addition of contrast dyes to casting resins. Information on the molds used for mounting composite materials is provided. The steps recommended to achieve a good mounted specimen without voids or specimen pull-out are also described. The chapter discusses the processes for clamping mounted composite samples in automated polishing heads and mounting composite materials for hand polishing. A summary of the mounting technique is also included.

Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite materials. First, it provides information on grinding and polishing equipment and describes the processes and process variables for sample preparation. Then, the chapter discusses the processes of abrasive sizing for grinding and rough polishing. Next, it provides a summary of grinding methods, rough polishing, and final polishing. Finally, information on common polishing artifacts that can result from any of the steps is provided.

The most common methods for preparing polymeric composites for microscopic analysis can be used for most fiber-reinforced composite materials. There are, however, a few composite materials that require special preparation techniques. This chapter discusses the processes involved in the preparation of titanium honeycomb composites, boron fiber composites, titanium/polymeric composite hybrids, and uncured prepreg materials.

Transmitted-light methods reveal more details of the morphology of fiber-reinforced polymeric composites than are observable using any other available microscopy techniques. This chapter describes the various aspects relating to the selection and preparation of ultrathin-section specimens of fiber-reinforced polymeric composites for examination by transmitted-light microscopy techniques. The preparation steps covered are a selection of the rough section, preparation of the rough section for preliminary mounting, grinding and polishing the primary-mount first surface, mounting the first surface on a glass slide, and preparing the second surface (top surface). The optimization of microscope conditions and analysis of specimens by microscopy techniques are also covered. In addition, examples of composite ultrathin sections that are analyzed using transmitted-light microscopy contrast methods are shown throughout.

Analyzing the structure of composite materials is essential for understanding how the part will perform in service. Assessing fiber volume variations, void content, ply orientation variability, and foreign object inclusions helps in preventing degradation of composite performance. This chapter describes the optical microscopy and bright-field illumination techniques involved in analyzing ply terminations, prepreg plies, splices, and fiber orientation to provide the insight necessary for optimizing composite structure and performance.

Achieving the best-performing composite part requires that the processing method and cure cycle create high-quality, low-void-content structures. If voids are present, the performance of the composite will be significantly reduced. There are multiple causes of voids in composite materials; they are generally categorized as voids that are due to volatiles (such as solvents, water) or voids that result from entrapped air. This chapter describes the analysis of various types of voids. It reviews techniques for analysis of voids at ply-drops, voids due to high fiber packing, and voids that occur in honeycomb core composites. The final section of the chapter discusses void documentation through the use of nondestructive inspection techniques and density/specific gravity measurement methods.

The formation of microcracks in composite materials may arise from static-, dynamic-, impact-, or fatigue-loading situations and also by temperature changes or thermal cycles. This chapter discusses the processes involved in the various methods for the microcrack analysis of composite materials, namely bright-field analysis, polarized-light analysis, contrast dyes analysis, and dark-field analysis. The analysis of microcracked composites using epi-fluorescence is also covered. In addition, the chapter describes the procedures for the determination and recording of microcracks in composite materials.

The second-generation composite materials were added to increase the strain to failure of the primary phase and/or create a dispersed second phase, thereby enhancing the fracture toughness of the thermosetting matrix. These matrices offered novel design capabilities for composites in a variety of aircraft applications. To improve the damage tolerance of composite materials even further, an engineering approach to toughening was used to modify the highly stressed interlayer with either a tougher material or through the use of preformed particles, leading to the third generation of composite materials. This chapter discusses the development, processes, application, advantages, and disadvantages of dispersed-phase toughening of thermoset matrices. Information on the processes of particle interlayer toughening of composite materials is also included.

As fiber-reinforced polymeric composites continue to be used in more damage-prone environments, it is necessary to understand the response of these materials when subjected to impact from foreign objects. This chapter provides an overview of the analysis methods for impact-damaged composites. It discusses the causes and effects of various failure mechanisms in composite materials. The failure mechanisms covered are brittle-matrix composite failure, tough-matrix composite failure, thermoplastic-matrix composite failure mechanisms, untoughened thermoset-matrix composite failure mechanisms, toughened thermoset-matrix composite failure mechanisms, particle interlayer-toughened composite failure mechanisms, and dispersed-phase, rubber-toughened thermoset-matrix composite failure mechanisms.

Microstructural analysis of the composite matrix is necessary to understand the performance of the part and its long-term durability. This chapter focuses on the microstructural analysis of engineering thermoplastic-matrix composites and the influence of cooling rate and nucleation on the formation of spherulites in high-temperature thermoplastic-matrix carbon-fiber-reinforced composites. It also describes the microstructural analysis of a bio-based thermosetting-matrix natural fiber composite system.