This chapter contains a list of technical papers and books related to the heat treatment of gears.

After pouring, castings are allowed to solidify and cool. They are later removed from the molds in the shakeout operation. A series of activities then follow, which are generally referred to as finishing and heat treatment. These activities can be broadly categorized as shakeout, abrasive blast cleaning, removal of risers, ingates, and discontinuities, rough inspection, removal of discontinuities, finishing welding, heat treatment, and final visual, dimensional, and NDT inspection. This chapter provides a detailed discussion on these activities.

Abradable coatings (such as Ni-4Cr-4Al/bentonite) are used throughout jet engines, primarily as sacrificial coatings into which moving components wear. This article presents the Accepted Practice for sample preparation of abradable coatings for metallographic analysis, based on round robin testing by several laboratories.

Lightning damage in polymer composites, as in metal structures, is manifested by damage at both the macroscopic or visual level and within the material microstructure. In addition to visual damage assessment, non-destructive inspection techniques are employed to detect damage within the composite part. This chapter describes the macroeffects of a lightning strike on composites and discusses the methods involved in the assessment of microstructural damage in composites.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.

This chapter discusses various factors pertinent to the applications of low-pressure permanent mold casting process, namely decorative automotive wheels, critical safety structural components, and chassis components.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

This appendix is a compilation of terms and definitions related to metallurgy.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.