Search Results for nitriding sensors

This chapter provides a discussion of nitriding furnace equipment and control systems. The discussion covers the essential design criteria of the furnace, types of nitriding furnaces, insulation for the reduction of furnace heat losses, and factors influencing furnace configuration and design. It also covers the processes involved in the construction and maintenance of retorts, methods for sealing a retort to prevent ammonia leaks, and safety precautions to be taken while using ammonia. Further, the chapter provides information on the factors for choosing a heating medium and discusses the processes involved in controlling temperature, gas dissociation, oxygen probes, and nitriding sensors.

Process gas control for plasma (ion) nitriding is a matter of estimating the flows necessary to accomplish the required surface metallurgy. This chapter reviews several studies aimed at better understanding process gas control in plasma nitriding and its influence on compound zone formation. Emphasis is placed on the effect of sputtering on the kinetics of compound zone formation. The discussion covers the processes involved in process gas control analysis by photo spectrometry and mass spectrometry and the difficulties associated with gas analysis.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.

This chapter discusses the advantages of using powder metallurgy to produce magnetic materials, particularly its ability to control chemistry and near-net shape. It also explains how process parameters and powder characteristics influence the physical and magnetic properties of common stainless steels.

Critical process variables must be controlled to ensure uniform and repeatable heat-treating results. This chapter covers the subject of controlling the heat-treating process. All heat-treating equipment utilizes various sensors, timers, and other components to monitor and control the process utilizing various control methods. The chapter focuses on temperature control and measurement, including a discussion about thermocouples and devices for measuring thermal and electrical conductivity.

This chapter recounts some of the early efforts and milestones in the development of stainless steel powders and their use in powder metallurgy applications.

This chapter provides information on the properties and behaviors of stainless steels and stainless steel powders. It begins with a review of alloy designation systems and grades by which stainless steels are defined. It then describes the composition, metallurgy, and engineering characteristics of austenitic, ferritic, martensitic, duplex, and precipitation hardening stainless steel powders and metal injection molding grades.

This chapter includes a comprehensive set of definitions used in powder-binder processing.

This chapter is intended to identify materials, processes, and designs that will lead to great advances in powder-binder forming technologies. It discusses some of the structures obtained through these advances in powder-binder technologies such as binder jetting and extrusion-based additive manufacturing, including bound-metal deposition and fused-filament fabrication: oxidation-resistant high-temperature alloys, anisotropic structures, submicrometer-scale structures, surface hard materials, and artist metallic clays. Some of the advances discussed include the developments in process involving plastics, emulsions, ceramics, and porous structures and foams. Improvements in the design processes have led to the development of functional structures, controlled porosity, and bioinspired structures.

This chapter discusses the selection, use, and integration of methods to control process variables in induction heating, including control of workpiece and processing temperature and materials handling systems. The discussion of temperature control includes a review of proportional controllers and heat-regulating devices. Integration of control functions is illustrated with examples related to heating of steel slabs, surface hardening of steel parts, vacuum induction melting for casting operations, and process optimization for electric-demand control. Distributed control within larger manufacturing systems is discussed. The chapter also covers nondestructive techniques for process control and methods for process simulation.

The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its microstructure in order to identify the root cause of failure. This chapter assesses the tools and techniques used for those purposes and the challenges brought on by continued transistor scaling, advanced 3D packages, and new IC architectures. The areas covered include sample preparation, nanoprobing, microscopy, FIB circuit edit, and scanning probe microscopy.

This chapter discusses the use of coating methods and materials and their impact on corrosion and wear behaviors. It provides detailed engineering information on a wide range of processes, including organic, ceramic, and hot dip coating, metal plating and cladding, and the use of weld overlays, thermal spraying, and various deposition technologies.

This chapter discusses the practices and procedures used to reveal and record macrostructural features such as hardening depth, weld thickness, crack size, porosity, hot folds, and machining and tooling marks. It provides information on sectioning, sample location, orientation, surface grinding, and etching. It describes macrographic etchants and the features they reveal along with common etching problems and how to avoid them. It explains how to evaluate etching results and how they can be improved using remedial processes such as light grinding. It also discusses photographic reproduction, lighting, and image enhancement techniques.

This chapter discusses the sintering process for stainless steel powders and its influence on corrosion resistance. It begins with a review of sintering furnaces and atmospheres and the effect of temperature and density on compact properties such as conductivity, ductility, and strength. It then describes the relationship between sintered density and corrosion resistance and how it varies for different types of powders and operating environments. The chapter also explains how stainless steel powders respond to different sintering atmospheres, including hydrogen, hydrogen-nitrogen, and vacuum, and liquid-phase sintering processes.

Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.