1-7 of 7 Search Results for

nanoscale 3D X-ray microscopy

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications. failure analysis integrated circuit boards integrated circuit packaging...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... Embedding Technology , ” IPC Apex Expo conference , Las Vegas, NV, USA , April 2011 [2] Schmidt C. , et al. , “ Nanoscale 3D X-Ray Microscopy for high density Multi-Chip Packaging FA ,” Proc 44rd Int’l Symp for Testing and Failure Analysis , Phoenix, CA , November 2018 , pp. 424...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... and 24 . Measured attributes include hole radius, eccentricity, and center position. Figure 23 3D plot of centers and contours taken from a memory device of from four adjacent holes over the entire length of the hole. Figure 24 Displacement of hole centers with depth, (Top) in the X...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... surfaces do not need to be as flat as the other methods. It is typically electrically insulating, which can be a problem or a feature. One advantage for FA is that these seals can be heated to decap them, and gaps are easy to see with SAM (Scanning Acoustic Microscopy) or X-ray. Metal-metal...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... analysis in complex 2.5d-based devices combining 3d magnetic field imaging and 3d x-ray microscopy . In Proceedings of the 44th International Symposium for Testing and Failure Analysis. AMS , 2018 . [12] Wikswo J. P. . The Magnetic Inverse Problem for NDE , pages 629 – 695 . Kluwer Academic...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.9781627082921
EISBN: 978-1-62708-292-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... M. , Eiles T. , Livengood R. H. , Rao V.R.M. , Winer P. , Yee W.M. , “ Novel Optical Probing and Micromachining Techniques for Silicon Debug of Flip Chip Packaged Microprocessors ,” Micro. Eng. , Vol. 46 , ( 1999 ), pp. 27 - 34 . 10.1016/S0167-9317(99)00009-X [45...