Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

This chapter is intended to identify materials, processes, and designs that will lead to great advances in powder-binder forming technologies. It discusses some of the structures obtained through these advances in powder-binder technologies such as binder jetting and extrusion-based additive manufacturing, including bound-metal deposition and fused-filament fabrication: oxidation-resistant high-temperature alloys, anisotropic structures, submicrometer-scale structures, surface hard materials, and artist metallic clays. Some of the advances discussed include the developments in process involving plastics, emulsions, ceramics, and porous structures and foams. Improvements in the design processes have led to the development of functional structures, controlled porosity, and bioinspired structures.

This chapter introduces the key powder fabrication attributes to assist in the identification of the right powders for an application. First, it describes the characteristics of engineering powders such as particle size distribution, powder shape and packing density, surface area, powder flow and rheology, and chemical analysis. The chapter then describes the general categories of powder fabrication methods, namely mechanical comminution, electrochemical precipitation, thermochemical reaction, and phase change and atomization. It provides information on the two largest contributors to powder price, namely raw material cost and conversion cost. The applicability of various processes to specific material systems is mentioned throughout this chapter.

This chapter summarizes critical gaps and long-term needs in failure analysis technology as it relates to logic and memory devices and IC packages. It assesses the impact of vertical integration, new materials, and expansion in the third dimension on volume analysis, sample preparation and measurement methods, and cross-sectioning and imaging.

This chapter focuses on key requirements for obtaining third-generation advanced high-strength steels (AHSS). The discussion covers the microstructure design for AHSS, novel AHSS processing routes, the development of nanostructured AHSS, and the development of third-generation AHSS by the Integrated Computational Materials Engineering approach.

With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.

This chapter includes a comprehensive set of definitions used in powder-binder processing.

This chapter assesses the capabilities and limitations of electric fault isolation (EFI) technology, the measurement challenges associated with new device architectures, and the pathways for improvement in emission microscopy, laser stimulation, and optical probing. It also assesses the factors that influence signal strength, spatial and timing resolution, and alignment accuracy between signal response images and the physical layout of the IC.

Post-mortem analysis of photovoltaic modules that have degraded performance is essential for improving the long term durability of solar energy. This article focuses on a general procedure for analyzing a failed module. The procedure includes electrical characterization followed by thermal imaging such as forward bias, reverse bias, and lock-in, and emission imaging such as electroluminescence and photoluminescence imaging.

Most steels that are hardened are subjected to a subcritical heat treatment referred to as tempering. Tempering improves the toughness of as-quenched martensitic microstructures but lowers strength and hardness. This chapter describes the microstructural changes that occur during tempering and their effect on the mechanical properties of steel. It also discusses the effect of alloying elements and the formation of oxide colors.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

When a material is sintered and evaluated for performance, the primary focus is on mechanical properties. This chapter discusses structural properties for representative materials. Some guidelines are presented on the types of tests and how property values depend on the testing procedure. Mechanical hardness and strength tabulations are provided to document sintered properties.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

An architectural shift to buried power rails (BPRs) with backside power delivery (BPD) is on the horizon as CMOS technology approaches the 2 nm node. The obstruction created by the presence of BPD networks obsoletes many of the electrical fault isolation (EFI) techniques that have been used for the past few decades and severely degrades the performance of others. This chapter provides an overview of EFI methods that are still applicable to ICs with BPD networks, including e-beam and atomic force probing, x-ray and magnetic field imaging, and lock-in thermography. It assesses the technical challenges of each method as well as the potential for improvement.

This chapter discusses the principles of scanning transmission electron microscopy (STEM) as implemented using conventional scanning electron microscopes (SEMs). It describes the pros and cons of low-energy imaging and diffraction, addresses basic hardware requirements, and provides information on imaging modes, detector positioning and alignment, and the effect of contrast reversal. It also discusses beam convergence and angular selectivity, the use of application-specific masks, and how to generate grain orientation maps for different material systems.

This chapter is a detailed account of various attributes related to mixing and testing of powder-binder feedstocks. Mixing parameters and their effects on feedstock properties is discussed. The attributes reviewed include mixture homogeneity, wetting, powder-binder ratio, feedstock density, elastic modulus, rheological behavior, particle size, formulation control, feedstock mixing, and feedstock properties. The chapter also provides information on the processes involved in feedstock preparation and testing.