Two compressor rotors of similar design and construction were severely damaged during operation. In one rotor, all the blades in the third and fourth stages had been sheared off and some had lifted from the dovetail portion of the drum. The damage in the other rotor was more extensive. Most of the blades in the first four stages had sheared off and many lifted from the dovetail region, particularly in the first two stages where several mounting dovetails had also fractured. Based on visual examination and the results of SEM fractography, metallography, and chemical analysis, investigators concluded that the compressor rotors failed due to stress-corrosion cracking in the dovetail mountings. They also provided recommendations to prevent or mitigate future occurrences.

The nose landing gear on an aircraft malfunctioned during landing roll. After the incident, two fractured studs were found in the retraction jack support beam. Based on visual examination and the results of SEM fractography, investigators concluded that the studs failed by fatigue, a vulnerability because of the way they were mounted. A sketch showing the correct mounting configuration is included in the report.

This chapter explains how to prepare material samples for optical microscopy, the most common method for characterizing the microstructure of cast iron and steel. It provides information on sectioning, mounting, polishing, etching, and recording. It describes the nature of surface roughness, the factors that contribute to it, and its effect on image quality. It discusses the use of fixturing and holding devices, includes photographic examples of polishing defects and drying marks, and provides an overview of micrographic etchants and the features they reveal. It also describes the steps involved in replicating part surfaces.

This chapter instructs the metallographer on the basic skills required to prepare a polished metallographic specimen. It is organized in a chronological sequence starting with the information-gathering process on the material being investigated, then moving on to sectioning, mounting, grinding, and polishing processes, and ending with methods used to properly store metallographic specimens. The discussion covers the preparation procedures, the materials being investigated, and equipment used to perform these procedures.

A pair of bearings mounted side by side in an aircraft engine failed in service. Photographs show that the inner rings were either broken or deformed, the balls were worn and flattened, and the cages severely damaged. The bearing races were damaged as well, but only on one side indicating a directional thrust. In addition to their examination, investigators also conducted metallographic studies and hardness tests, which indicated that the balls and inner rings reached temperatures above 825 °C (1520 °F). Based on their findings, investigators concluded that the bearings failed due to overheating, possibly as a result of misalignment compounded by insufficient lubrication and high speeds.

Metal particles were frequently detected in the oil of an aircraft engine, triggering an investigation that led to a torque sensor and its mounting components. The sensor assembly was removed and examined in greater detail. As the chapter explains, investigators discovered that one of the bearings had been subjected to excessive friction, evidenced by brinelling, metal flow, heat tinting, deformation, and wear. They also observed extensive grooving on a retaining plate and several washers matching the diameter of the outer bearing races. Based on their findings, investigators concluded that excessive clearance allowed the outer bearing races to rotate, thus removing material from adjacent contact surfaces and accelerating the buildup of metal particles in the engine oil. The chapter recommends several design changes to remedy the problem.

A test flight was cut short after a fire warning came on indicating a problem with one of the four engines on an aircraft. A visual examination following the precautionary landing revealed several burned hoses, a melted bolt, and fuel leaking from the base of the main burner. The fuel nozzle was also damaged, and based on its microstructure, came very close to melting. Investigators determined that the burner was mounted backwards, facing the compressor rather than the turbine. They also recommended a redesign to prevent the fuel nozzle from being reversed.

This chapter describes the methods and equipment applicable to metallographic studies and discusses the preparation of specimens for examination by light optical microscopy. Five major operations for preparation of metallographic specimens are discussed: sectioning, mounting, grinding, polishing, and etching. The discussion covers their basic principles, advantages, types, and applications, as well as the equipment setup. The chapter includes tables that list etchants used for microscopic examination. It also provides information on microscopic examination, microphotography, and the effects of grain size on the structural properties of the material.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.

Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types include tantalum, aluminum electrolytic, multi-layered ceramics, film, and super capacitors. The article then provides a discussion on the two common types of inductors, namely, common mode choke coil and surface mount powder choke coil.

This chapter explains how to prepare metallographic samples for light microscopy and how to anticipate and avoid related problems. It describes standard practices and procedures for sectioning, mounting, grinding, and polishing and identifies common defects along with their causes and cures. It also provides recommendations for handling specific materials and addresses safety concerns.

This chapter discusses the important role of metallography and the metallographer in predicting and understanding the properties of metals and alloys. Examples are presented of a metallographer working as part of a team in a research laboratory of a large steel company and a metallographer working alone at a small iron foundry. The three basic areas in all metallography laboratories are discussed: the specimen preparation area, the polishing/etching area, and the observation/micrography area. Important safety issues in a metallographic laboratory are also considered.

This chapter discusses various factors pertinent to the applications of low-pressure permanent mold casting process, namely decorative automotive wheels, critical safety structural components, and chassis components.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

During cyclic spin tests, the turbine disc in an aircraft engine broke apart with a loud noise, followed by a fire. Based on a detailed examination and the results of SEM fractography and hardness measurements, failure analysts concluded that a locking plate became dislodged due to the shearing of the screws that hold it in place. They also provided recommendations to remediate the problem.

This chapter provides a comprehensive overview over all phenomena related to Voltage Contrast (VC) mechanisms in SEM and FIB. The multiple advantages, possibilities, and limits of active and passive VC failure localization are systemized and discussed. The knowledge of all facts influencing the VC generation (capacitance, leakage, doping, and circuitry) is very helpful for successful failure localization.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

This article presents a general overview of outdoor weather aging factors, their effects on plastic materials, and the accelerated test methods that can be used to estimate the reaction of a plastic component during actual use. Weather and radiation factors that contribute to degradation in plastics include temperature variations, moisture, sunlight, oxidation, microbiologic attack, and other environmental elements. The article also describes the tests used to predict the behavior of a plastic material to outdoor exposure, discussing the use of xenon arc lamp for the weatherometer and fadeometer and the use of fluorescent sunlamp in test devices.