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molding compounds
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Image
Published: 01 October 2012
Fig. 12.15 Tensile strength of typical automotive sheet molding compounds with petroleum and soy-based resins. UPHE, ultrahigh-density polyethylene; VE, vinyl ester. Source: Ref 12.23
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Published: 01 November 2010
Fig. 10.11 Types of sheet molding compound. Sheet molding compound (random) SMC-R; sheet molding compound (continuous/random) SMC-CR; sheet molding compound (continuous/random with continuous in X-pattern) XMC
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in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 6 C-scan images of the mold compound to die paddle and lead frame interface of a 68PLCC, obtained with a 50 MHz transducer. (A) The peak amplitude image shows a range of grayscale variation, but delamination locations are not obvious. (B) The phase inversion image clearly reveals
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Published: 01 October 2012
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Published: 01 October 2012
Fig. 12.13 Relative materials properties and costs. SMC, sheet molding compound. Source: Ref 12.21
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in Introduction—Composite Materials and Optical Microscopy
> Optical Microscopy of Fiber-Reinforced Composites
Published: 01 November 2010
Fig. 1.1 Composite cross sections. (a) Sheet molding compound made from carbon-black-filled epoxy resin and chopped glass fiber. Bright-field illumination, 65 mm macrophotograph montage. (b) Quasi-isotropic unidirectional prepreg laminate. Slightly uncrossed polarized light, 5× objective
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Published: 01 November 2010
Image
Published: 01 November 2010
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870285
EISBN: 978-1-62708-314-0
...-strength, glass fiber-reinforced parts using either thermoset or thermoplastic resins. Compression molding is the single largest primary manufacturing process used for automotive composite applications today. The three main groups of materials that are compression molded are sheet molding compounds...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... compound, and delamination of the molding compound from the die attach [5] . Apart from excess inventories, scrapped parts, and reclaimed parts, counterfeiters may also buy new parts and relabel or repackage them to make them appear to be a different part. Such parts may have handling or packaging...
Abstract
Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used by counterfeiters to create counterfeits. These include relabeling, refurbishing, and repackaging. The article presents a systematic inspection methodology that can be applied for detecting signs of possible part modifications. The methodology consists of external visual inspection, marking permanency tests, and X-ray inspection followed by material evaluation and characterization. These processes are typically followed by evaluation of the packages to identify defects, degradations, and failure mechanisms that are caused by the processes (e.g., cleaning, solder dipping of leads, reballing) used in creating counterfeit parts.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.9781627082815
EISBN: 978-1-62708-281-5
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780433
EISBN: 978-1-62708-281-5
... length critical crack length initial crack size acrylonitrile-butadiene-styrene acetals Auger electron spectroscopy aramid ber American National Standards Institute ammonium polyphosphate American Society for Testing and Materials alumina trihydrate thickness butadiene bulk molding compound Building...
Image
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 7 Typical acoustic echo signals (15MHz) from an area of good adhesion (solid) and a delaminated area (dashed) at the mold compound/die interface in a 68PLCC.
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Published: 01 August 2013
Fig. 1.9 Cost penalties for reducing mass of various lightweight materials. HS, high-strength; SMC, sheet molding compound; GF, glass fiber. Source: Ref 1.9
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in Surface Analysis and Material Characterization Techniques Used in Semiconductor Industry to Identify and Prevent Failures
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 17 Example of particles. A. optical microscopy: stainless steel particle exposed after FIB. B. SEM-EDX mapping: Cl-containing organic particle in SiO2 filled molding compound exposed after polish/look.
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2005
DOI: 10.31399/asm.tb.gmpm.t51250077
EISBN: 978-1-62708-345-4
...Property values for Nylons 6 and 6/6 Table 1 Property values for Nylons 6 and 6/6 Dry, as-molded, approximately 0.2% moisture content Property Nylon 6 Nylon 6/6 Molding compound Glass fiber reinforced, 30–33% Toughened Molding and extrusion compound Glass fiber reinforced, 30...
Abstract
Plastic gears are continuing to displace metal gears in applications ranging from automotive components to office automation equipment. This chapter discusses the characteristics, classification, advantages, and disadvantages of plastics for gear applications. It provides a comparison between the properties of metals and plastics for designing gears. The chapter reviews some of the commonly used plastic materials for gear applications including thermoplastic and thermoset gear materials. The chapter also describes the processes involved in plastic gear manufacturing.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780064
EISBN: 978-1-62708-281-5
... winding 0 0 n/a n/a … … n/a y n y y y n y n y Rotational casting 0.1 0.015 n/a n/a … … n n n y y n n y n n Thermoset plastics Compression Powder 60 8.7 30 3370 0.5 5 y y y y n n y n y y Sheet molding compound 6–20 0.85–3 30 3370...
Abstract
This article describes key processing methods and related design, manufacturing, and application considerations for plastic parts and includes a discussion on materials and process selection methodology for plastics. The discussion covers the primary plastic processing methods and how each process influences part design and the properties of the plastic part. It also includes a brief description of functional requirements in process selection; an overview of various process effects and how they affect the functions and properties of the part; and the selection of processes for size, shape, and design detail factors.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... lead frame (MLF)/(quad flat no-lead) QFN should not be used in automotive applications due to their tendency to shear interconnects or to form cracks under vibration and/or thermal cycling stress. Extremely small mold compound overlap to pins (when the chip size is little smaller than the fully...
Abstract
Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550325
EISBN: 978-1-62708-307-2
... competitors Material Processes Generalized plastics competitive position Primary Secondary Sheet steel Stamped Welded fabrication Sheet molding compound (SMC) or thermoplastic. SMCs offer 30% weight savings at similar room-temperature performance. Cost comparison depends on steel complexity...
Abstract
This chapter describes the molecular structures and chemical reactions associated with the production of thermoset and thermoplastic components. It compares and contrasts the mechanical properties of engineering plastics with those of metals, and explains how fillers and reinforcements affect impact and tensile strength, shrinkage, thermal expansion, and thermal conductivity. It examines the relationship between tensile modulus and temperature, provides thermal property data for selected plastics, and discusses the effect of chemical exposure, operating temperature, and residual stress. The chapter also includes a section on the uses of thermoplastic and thermosetting resins and provides information on fabrication processes and fastening and joining methods.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780115
EISBN: 978-1-62708-281-5
.... Plastics with seeds contain a higher crystalline fraction with small domains. Crystallinity is also affected by the temperature gradient in processing. A high mold temperature reduces temperature gradients and the amount of crystallization, whereas a low mold temperature increases the crystallization rate...
Abstract
This article covers the thermal analysis and thermal properties of engineering plastics with respect to chemical composition, chain configuration, and/or conformation of the base polymers. The thermal analysis techniques covered are differential scanning calorimetry, thermogravimetric analysis, thermomechanical analysis, and rheological analysis. The basic thermal properties covered include thermal conductivity, temperature resistance, thermal expansion, specific heat, and the determination of glass-transition temperatures. The article further describes various factors influencing the determination of service temperature of a material. Representative examples of different types of engineering thermoplastics are discussed in terms of structure and thermal properties. The article also discusses the thermal and related properties of thermoset resin systems.
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