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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
..., and ion milling, either in the FIB or in a dedicated ion mill. chemical etchants chemo-mechanical polishing cross-sectioning delineation methods focused ion beam ion milling semiconductor devices Introduction Sample preparation for physical failure analysis has been a challenge since...
Abstract
Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.
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Published: 01 August 2005
Fig. 12 Titanium domes. Before chemical milling (left) and after chemical milling (right) in an incorrect etchant that caused the dome to undergo brittle fracture
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Published: 01 November 2019
Figure 12 Scanning electron micrograph of a cracked solder bump; ion beam milling was used to clean up the smear caused by manual cross sectioning and reveal the details of the failure. This device was subject to a temperature cycle stress.
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in Chip-Scale Packaging and Its Failure Analysis Challenges
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 8 Milling and repackaging process for backside emission analysis on the failing die in MCP devices.
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Published: 01 March 2002
Fig. 10.1 Typical speeds for face milling of selected superalloys versus some steels, titanium, and refractory metal alloys
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Published: 30 April 2020
Fig. 2.10 Attritor milling is a means to mechanically alloy ingredients. The combination of impaction and fracture induces a lamination and layering structure such that each particle is an alloy, but no melting is required.
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Published: 01 November 2012
Fig. 49 Residual stress from surface milling 4340 steel quenched and tempered to 52 HRC. Note that while increased tool wear produced higher compressive residual stresses below the surface, it also increased the tensile residual stresses at the surface. Source: Adapted from Ref 27
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Published: 01 December 2003
Fig. 21 Auger electron spectroscopy-ion milling depth profiles comparing laminates. (a) X laminate, 5 nm (50 Å)/min. (b) Y laminate, 10 nm (100 Å)/min
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Published: 01 December 2003
Fig. 22 X-ray photoelectron spectroscopy-ion milling depth profiles comparing laminates. (a) X laminate, 5 nm (50 Å)/min. (b) Y laminate, 5 nm (50 Å)/min
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Published: 01 June 1985
Fig. 5-18. Each individual spline had been formed with a vertical milling cutter. The rounded area at the shoulder was swaged into square corners with a hammer and chisel. Each corner was precracked, which resulted in a fatigue failure.
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Published: 30 September 2023
Figure 13.13: Illustration of stability lobes in milling, used to avoid chatter [ 30 ]. Reprinted by permission of Pearson Education, Inc.
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Published: 30 September 2023
Figure 13.22: Schematic illustrations of slab milling: (a) up (conventional) and (b) down (climb) milling [ 30 ]. Reprinted by permission of Pearson Education, Inc.
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in Laser-Based, Photon, and Thermal Emission
> Electronic Device Failure Analysis Technology Roadmap
Published: 01 November 2023
Fig. 4 (a) Contour milling techniques for ultra-thinning of silicon substrate ( Ref 24 ). (b) Laser-reflected micrographs reveal Newton rings and localized thickness variation around C4 bumps.
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Published: 01 December 2003
Fig. 7 Milling cutter after ferritic oxynitrocarburizing. Courtesy of Plateg GmbH
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Published: 01 September 2005
Fig. 2 Relation of cutter and workpiece when milling teeth in a spur gear
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Published: 01 August 2012
Fig. 13.5 Machines used for incremental sheet forming (ISF). (a) Upgraded milling machine. (b) Dedicated machine for ISF by AMINO. (c) A special ISF machine built at the University of Cambridge. (d) Roboforming process using two robots. (a) to (c) Source: Ref 13.3 . (d) Source: Ref 13.5
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Published: 01 November 2013
Fig. 24 Basic milling operations and cutters illustrating the variety of surfaces and surface combinations that can be generated. Source: Ref 12
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Published: 01 November 2013
Fig. 25 Principal components of a plain knee-and-column milling machine with a horizontal spindle. Source: Ref 12
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Published: 01 November 2013
Fig. 26 Principal components of a horizontal-spindle bed-type milling machine. Source: Ref 12
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