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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
..., and ion milling, either in the FIB or in a dedicated ion mill. chemical etchants chemo-mechanical polishing cross-sectioning delineation methods focused ion beam ion milling semiconductor devices Introduction Sample preparation for physical failure analysis has been a challenge since...
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Published: 01 August 2005
Fig. 12 Titanium domes. Before chemical milling (left) and after chemical milling (right) in an incorrect etchant that caused the dome to undergo brittle fracture More
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Published: 01 November 2019
Figure 12 Typical cross-section created by FIB milling. A polished cross-section is flanked at the sides by material re-deposition. More
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Published: 01 November 2019
Figure 13 Different milling strategies to improve material removal. (Left) Conventional staircase style milling. (Right) Milling strategy optimized to minimize re-deposition. More
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Published: 01 November 2019
Figure 16 Typical TEM lamella produced by FIB milling. A) Bulk lamella before polishing a thin region for TEM imaging. B) Top-down view of a lamella with a thin, electron transparent section on the right side. C) Side view of lamella with a very thin, transparent section for TEM imaging. More
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Published: 01 November 2019
Figure 5 XeF 2 assisted milling, when M6 cleared, M5 was exposed. Dielectric fill had been used in the fab process for copper planes to enable CMP processing to result in a more even surface. An attempt to use XeF 2 was made but it failed. [19] More
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Published: 01 November 2019
Figure 6 Direct comparison of milling patterns with ToF disabled and ToF enabled for varying dwell times. [24] More
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Published: 01 November 2019
Figure 14 Measured milling rates of silicon dioxide; this shows that the NH 4 OH chemistry reduces the removal rate of silicon dioxide and thus improves selectivity of copper over silicon oxide. [37] More
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Published: 01 November 2019
Figure 46 Ne + ion beam top view and cross sections of backside circuit milling activities in a 32 nm node IC. [96] More
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Published: 01 November 2019
Fig. 24 Top image shows section before ion milling. The bottom image is the same area after ion milling. More
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Published: 01 November 2019
Figure 15 (Left) Local thinning through laser milling or FIB provides an opportunity to get closer to an area of interest for high-resolution scanning. The SV MR sensor is shown in a cavity that is 500 µm ×500 µm and 250 µm deep. (Right) SV MR sensor on a die surface, with an illustrated More
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Published: 01 November 2019
Figure 19 Illustration of milling bit to sample interaction for A: 5-axis mode on convex surface. B: 3-axis mode on convex surface. C: 5-axis mode on concave surface. D: 3-axis mode on concave surface. More
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Published: 01 November 2019
Fig. 4 Localization Example: The right structure was grounded by milling a FIB hole through it followed by a metal deposition. The left structure is supposed to be dark because it is floating. If it isn’t, there must be a short (red) to the adjacent one. More
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Published: 01 November 2019
Figure 12 Scanning electron micrograph of a cracked solder bump; ion beam milling was used to clean up the smear caused by manual cross sectioning and reveal the details of the failure. This device was subject to a temperature cycle stress. More
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Published: 01 November 2019
Figure 8 Milling and repackaging process for backside emission analysis on the failing die in MCP devices. More
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Published: 01 March 2002
Fig. 10.1 Typical speeds for face milling of selected superalloys versus some steels, titanium, and refractory metal alloys More
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Published: 30 April 2020
Fig. 2.10 Attritor milling is a means to mechanically alloy ingredients. The combination of impaction and fracture induces a lamination and layering structure such that each particle is an alloy, but no melting is required. More
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Published: 01 October 2012
Fig. 5.35 Conventional and climb milling More
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Published: 01 November 2012
Fig. 49 Residual stress from surface milling 4340 steel quenched and tempered to 52 HRC. Note that while increased tool wear produced higher compressive residual stresses below the surface, it also increased the tensile residual stresses at the surface. Source: Adapted from Ref 27 More
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Published: 01 December 2003
Fig. 7 Milling cutter after ferritic oxynitrocarburizing. Courtesy of Plateg GmbH More