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microchemical analysis

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270019
EISBN: 978-1-62708-301-0
... for bulk chemical analysis and microchemical analysis. The principles, capabilities, and limitations of these tools are described in detail in Ref 1 to 3 . A few features are listed subsequently. Techniques for Average Bulk Chemical Analysis Spectrophotometry: Applicable to nearly all...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270045
EISBN: 978-1-62708-301-0
...), cyclotetramethylene tetranitramine (HMX), tetryl (trinitrophenyl methylnitramine), and pentaerythritol tetranitrate (PETN) contain nitro and nitramine groups. Various microanalytical techniques and spot tests are available for detecting and identifying these residues even in traces. Microchemical analysis...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780383
EISBN: 978-1-62708-281-5
... with secondary electron and x-ray detectors Table 2 Comparison summary of scanning electron beam instruments equipped with secondary electron and x-ray detectors Instrument Features optimized Minimum area Comments Surface pictures Microchemical analysis Scanning electron microscope Surface...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
... recommended. There are two main categories of chemical analysis that are often used by failure analysts: Bulk composition evaluation: often performed in order to determine whether the correct alloy was used in the subject component Microchemical analysis: to find evidence of contamination...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... nanoprobing which has demonstrated value in process characterization of transistor performance for yield. Circuit edit FIB probe pads are often necessary in combination with thermal emission failure analysis when a dead short exists in the first stepping of a product, there is no software or test feature...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... interfaces with the same expected surface finish. Removing a significant portion of the die substrate will usually affect the stability of the package. Proper planning of the entire backside analysis strategy is a requirement that is frequently trivialized at the peril of the project, as will be shown...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130417
EISBN: 978-1-62708-284-6
... at the beginning of the 1960s. For high-quality machine parts and parts subjected to heavy thermomechanical loads, different levels of description of the surface integrity were defined. A basic level of the surface-integrity description includes measurement of roughness and analysis of the microstructure...