Search Results for metal-etching

With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.

This chapter explains how to achieve accurate, sharp delineation of the microstructure of metals using appropriate etching and contrasting techniques. It covers a variety of methods, including chemical etching, heat tinting, gas contrasting, vapor deposition, magnetic etching, ion bombardment, and dislocation etch pitting.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

This appendix provides a list of etch compositions and procedures that reveal the macrostructure of aluminum, beryllium, bismuth, antimony, cobalt, copper, lead, magnesium, nickel, tin, titanium, zinc, and their respective alloys as well as iron, steel, noble metals, refractory metals, silicon, zirconium, and hafnium.

This chapter discusses the important role of metallography and the metallographer in predicting and understanding the properties of metals and alloys. Examples are presented of a metallographer working as part of a team in a research laboratory of a large steel company and a metallographer working alone at a small iron foundry. The three basic areas in all metallography laboratories are discussed: the specimen preparation area, the polishing/etching area, and the observation/micrography area. Important safety issues in a metallographic laboratory are also considered.

This appendix provides information on the chemical composition, method of use, and applications of various etchants used in the metallography of carbon steels.

This chapter is an atlas of microstructures observed in AlSi7Mg, AlSi11, and Al21CuNiMg modified with either eutectic (strontium, sodium) or hypereutectic (phosphorus) silicon crystals. The microstructure images reveal the as-cast state of gravity castings made in sand and metal molds, before and after modification. The chapter also provides composition data and includes callouts identifying various phase constituents in the interdendritic eutectic microstructure.

This chapter describes several macroscopic examination techniques, including macroetching, contact printing, fracturing, and lead exudation. It explains how each method is implemented, why it is used, and what it reveals about manufacturing processes, defects, imperfections, and failure mechanisms.

This chapter describes the methods and equipment applicable to metallographic studies and discusses the preparation of specimens for examination by light optical microscopy. Five major operations for preparation of metallographic specimens are discussed: sectioning, mounting, grinding, polishing, and etching. The discussion covers their basic principles, advantages, types, and applications, as well as the equipment setup. The chapter includes tables that list etchants used for microscopic examination. It also provides information on microscopic examination, microphotography, and the effects of grain size on the structural properties of the material.

Beryllium’s machining characteristics are similar to those of heat-treated cast aluminum and chilled cast iron. Like the other materials, it can be turned, milled, drilled, bored, sawed, cut, threaded, tapped, and trepanned with good results. This chapter explains how these machining operations are conducted and describes the effect of tooling materials, cutting speeds, metal-removal rates, and other variables. It also explains how to assess and remove surface damage caused by machining such as microcracks and twins.

Steels are over 95% Fe, so a good starting point for understanding steel is to study the nature of solid iron. This chapter provides information on the composition, phase transformation, and associated changes in the crystal structure of pure iron at varying temperatures.

This chapter explains how to safely prepare beryllium alloy samples for metallographic analysis. It describes grinding, polishing, and etching procedures in detail. It also discusses the identification of major and minor constituents and the general appearance of beryllium microstructure.