This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.

Metals are used in many engineering applications because of their mechanical properties, particularly strength and ductility. This chapter explains how mechanical properties are measured and how to interpret the results. It describes the most widely used tests, including tensile tests; Rockwell, Brinell, Vickers, and Knoop hardness tests; and Charpy V-notch impact tests. The chapter also provides information on loading conditions that can lead to fatigue failure, and in some cases, counteract or prevent it.

This chapter examines the static, fatigue, and damage tolerance properties of glass, aramid, and carbon fiber systems. It also explains how delaminations, voids, porosity, fiber distortion, and fastener hole defects affect impact resistance and strength.

This chapter presents a comprehensive coverage of mechanical fastening methods. It begins with a discussion on the advantages and disadvantages of mechanical fastening followed by sections providing information on mechanically fastened joints and the selection of the correct fastener system. The chapter then describes important structural fasteners, namely bolts, screws, pins, collar fasteners, rivets, blind fasteners, machine pins, and spring clip fasteners. The following sections describe the process involved in presses, shrink fits, hole generation, and fastener installation. The chapter ends with information on miscellaneous mechanical fastening methods.

This chapter focuses on common failure characteristics exhibited by mechanical and electrical components. The topic is considered from two perspectives: one possibility is that the system failed because parts were nonconforming to drawing requirements and another possibility is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components.

With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

Fabricated powder metallurgy (P/M) parts are evaluated and tested at several stages during manufacturing for part acceptance and process control. The various types of tests included are dimensional evaluation, density measurements, hardness testing, mechanical testing, and nondestructive testing. This chapter is a detailed account of these testing methods. It describes the four most common types of defects in P/M parts, namely ejection cracks, density variations, microlaminations, and poor sintering. The chapter discusses the capabilities and limitations of various nondestructive evaluation methods to flaw detection in P/M parts. The nondestructive evaluation methods covered are mechanical proof testing, metallography, liquid penetrant crack detection, filtered particle crack detection, magnetic particle crack inspection, direct current resistivity testing, x-ray radiography, computed tomography, gamma-ray density determination, and ultrasonic techniques.

This chapter provides an overview of the possible mechanisms of failure for heat treated steel components and discusses the techniques for examining fractures, ductile and brittle failures, intergranular failure mechanisms, and fatigue. It begins with a description of the general sources of component failure. This is followed by a section on the stages of a failure analysis, which can proceed one after the other or occur at the same time. These stages of analysis are collection of background data, preliminary visual examination, nondestructive testing, selection and preservation of specimens, mechanical testing, macroexamination, microexamination, metallographic examination, determination of the fracture mechanism, chemical analysis, exemplar testing, and analysis and writing the report. The chapter ends with a discussion on various processes involved in the determination of the fracture mechanism.

This chapter provides a comprehensive overview over all phenomena related to Voltage Contrast (VC) mechanisms in SEM and FIB. The multiple advantages, possibilities, and limits of active and passive VC failure localization are systemized and discussed. The knowledge of all facts influencing the VC generation (capacitance, leakage, doping, and circuitry) is very helpful for successful failure localization.

This chapter reviews the causes and cases associated with the problems originated by tempering of steels. To provide background on this phenomenon, a brief description of the martensite reactions and the steel heat treatment of tempering is given to review the different stages of microstructural transformation. A section describing the types of embrittlement from tempering, along with mechanical tests for the determination of temper embrittlement (TE), is presented. Various factors involved in the interaction of the TE phenomenon with hydrogen embrittlement and liquid-metal embrittlement are also provided. The cases covered are grinding cracks on steel cam shaft and transgranular and intergranular crack path in commercial steels.

This chapter discusses the various factors influencing the evaluation of fatigue fracture of nitrided layers. It begins by describing the problems of enhancing the fatigue resistance of machine components. The significance and detailed assessment of the effect of a structural flaw are then explained, using investigations of the effect of variable core conditions on fatigue resistance as an example. This is followed by a discussion on the processes involved in the evaluation of fatigue properties of nitrided steels. The chapter also describes the determination of the fatigue characteristics of nitrided steels after the carbonitriding treatment.

The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.

This chapter is a detailed account of the tensile testing procedure used for evaluating metals and alloys. The discussion covers the stress-strain behavior of metals determined by tensile testing, properties determined from testing, test machines for measuring mechanical properties, and general procedures of tensile testing. Three distinct aspects of standard test methods for tension testing of metallic materials are discussed: test piece preparation, geometry, and material condition; test setup and equipment; and test procedure.

This chapter discusses the operating mechanism, applications, advantages, and limitations of Brinell hardness testing, Rockwell hardness testing, Vickers hardness testing, Scleroscope hardness testing, and microhardness testing. In addition, the general precautions and selection criteria to be considered are described and details of equipment setup provided.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

This chapter presents various case histories that illustrate a variety of failure mechanisms experienced by the high-strength steel components in aerospace applications. The components covered are catapult holdback bar, AISI 420 stainless steel roll pin, main landing gear (MLG) lever, inboard flap hinge bolt, nose landing gear piston axle, multiple-leg aircraft-handling sling, aircraft hoist sling, internal spur gear, and MLG axle. In addition, the chapter provides information on full-scale fatigue testing, nondestructive testing, and failure analysis of fin attach bolts.

This chapter provides an overview of the various inspection methods used with metals and alloys, namely visual inspection, coordinate measuring machines, machine vision, hardness testing, tensile testing, chemical analysis, metallography, and nondestructive testing. The nondestructive testing methods discussed are liquid penetrant inspection, magnetic particle inspection, eddy current inspection, radiographic inspection, and ultrasonic testing.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.