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mechanical test
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870351
EISBN: 978-1-62708-314-0
... loads from the grips through shear to the test specimen without failing. Mechanical properties are usually reported in terms of the volume fraction of fibers or fiber volume percent. However, it is much easier to determine weights using laboratory analysis techniques. For example, a cured sample is...
Abstract
This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140039
EISBN: 978-1-62708-264-8
... Abstract Metals are used in many engineering applications because of their mechanical properties, particularly strength and ductility. This chapter explains how mechanical properties are measured and how to interpret the results. It describes the most widely used tests, including tensile tests...
Abstract
Metals are used in many engineering applications because of their mechanical properties, particularly strength and ductility. This chapter explains how mechanical properties are measured and how to interpret the results. It describes the most widely used tests, including tensile tests; Rockwell, Brinell, Vickers, and Knoop hardness tests; and Charpy V-notch impact tests. The chapter also provides information on loading conditions that can lead to fatigue failure, and in some cases, counteract or prevent it.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870373
EISBN: 978-1-62708-314-0
... discrepancies in the results reported, a result of obtaining data from multiple sources. Test methods for determining the mechanical properties of composite materials are discussed in Chapter 13, “Mechanical Property Test Methods.” Table 14.1 Typical properties of unidirectional composite materials...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290207
EISBN: 978-1-62708-306-5
... adhesive bonding, mechanical fastening provides better through-the-thickness reinforcement and is not as sensitive to peel stresses or residual stress affects. Mechanically fastened joints do not normally require nondestructive testing. Many mechanically fastened joints allow disassembly or panel...
Abstract
This chapter presents a comprehensive coverage of mechanical fastening methods. It begins with a discussion on the advantages and disadvantages of mechanical fastening followed by sections providing information on mechanically fastened joints and the selection of the correct fastener system. The chapter then describes important structural fasteners, namely bolts, screws, pins, collar fasteners, rivets, blind fasteners, machine pins, and spring clip fasteners. The following sections describe the process involved in presses, shrink fits, hole generation, and fastener installation. The chapter ends with information on miscellaneous mechanical fastening methods.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... analysis team can test the resistor to confirm that its resistance value is within tolerance limits. Resistors can also fail as a result of mechanical overstress conditions. A cracked resistor body, bent pins, or changes in the resistance value indicate that an overstress condition occurred...
Abstract
This chapter focuses on common failure characteristics exhibited by mechanical and electrical components. The topic is considered from two perspectives: one possibility is that the system failed because parts were nonconforming to drawing requirements and another possibility is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
... efficiency and minimal the artifacts several alternate delayering techniques were established. With continuous CMOS device to nanometer range and the increased complexity in today’s integrated circuits, diagnostic scan/ATPG (automatic test pattern generation) test techniques are helpful in determined the...
Abstract
With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
... need grounding. Grounding can be accomplished by laying down a metal line to from the area to a ground pin or a hole milled down to substrate. This can be filled with metal but usually the reposition of material on the sides of the hole will provide enough conduction. Test pads can be grounded by...
Abstract
Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720393
EISBN: 978-1-62708-305-8
... Abstract Fabricated powder metallurgy (P/M) parts are evaluated and tested at several stages during manufacturing for part acceptance and process control. The various types of tests included are dimensional evaluation, density measurements, hardness testing, mechanical testing, and...
Abstract
Fabricated powder metallurgy (P/M) parts are evaluated and tested at several stages during manufacturing for part acceptance and process control. The various types of tests included are dimensional evaluation, density measurements, hardness testing, mechanical testing, and nondestructive testing. This chapter is a detailed account of these testing methods. It describes the four most common types of defects in P/M parts, namely ejection cracks, density variations, microlaminations, and poor sintering. The chapter discusses the capabilities and limitations of various nondestructive evaluation methods to flaw detection in P/M parts. The nondestructive evaluation methods covered are mechanical proof testing, metallography, liquid penetrant crack detection, filtered particle crack detection, magnetic particle crack inspection, direct current resistivity testing, x-ray radiography, computed tomography, gamma-ray density determination, and ultrasonic techniques.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... of specimens, mechanical testing, macroexamination, microexamination, metallographic examination, determination of the fracture mechanism, chemical analysis, exemplar testing, and analysis and writing the report. The chapter ends with a discussion on various processes involved in the determination of...
Abstract
This chapter provides an overview of the possible mechanisms of failure for heat treated steel components and discusses the techniques for examining fractures, ductile and brittle failures, intergranular failure mechanisms, and fatigue. It begins with a description of the general sources of component failure. This is followed by a section on the stages of a failure analysis, which can proceed one after the other or occur at the same time. These stages of analysis are collection of background data, preliminary visual examination, nondestructive testing, selection and preservation of specimens, mechanical testing, macroexamination, microexamination, metallographic examination, determination of the fracture mechanism, chemical analysis, exemplar testing, and analysis and writing the report. The chapter ends with a discussion on various processes involved in the determination of the fracture mechanism.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110269
EISBN: 978-1-62708-247-1
... doesn’t matter for device characterization purposes where 4, 6 or even 8 probes have to contact structures in very small region. For AVC sometimes test structures are contacted at their probe pads because it is easier than to do so at tiny conducting lines. Probe pads often are several hundreds of...
Abstract
This chapter provides a comprehensive overview over all phenomena related to Voltage Contrast (VC) mechanisms in SEM and FIB. The multiple advantages, possibilities, and limits of active and passive VC failure localization are systemized and discussed. The knowledge of all facts influencing the VC generation (capacitance, leakage, doping, and circuitry) is very helpful for successful failure localization.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130285
EISBN: 978-1-62708-284-6
... microstructural transformation. A section describing the types of embrittlement from tempering, along with mechanical tests for the determination of temper embrittlement (TE), is presented. Various factors involved in the interaction of the TE phenomenon with hydrogen embrittlement and liquid-metal embrittlement...
Abstract
This chapter reviews the causes and cases associated with the problems originated by tempering of steels. To provide background on this phenomenon, a brief description of the martensite reactions and the steel heat treatment of tempering is given to review the different stages of microstructural transformation. A section describing the types of embrittlement from tempering, along with mechanical tests for the determination of temper embrittlement (TE), is presented. Various factors involved in the interaction of the TE phenomenon with hydrogen embrittlement and liquid-metal embrittlement are also provided. The cases covered are grinding cracks on steel cam shaft and transgranular and intergranular crack path in commercial steels.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130241
EISBN: 978-1-62708-284-6
... properties, as well as methods and testing equipment, stem from the multitude of different mechanisms for failure of structural materials from which components, assemblies, and whole machines are made. Among the most important of these are failures due to the action of static loading. There is, however, an...
Abstract
This chapter discusses the various factors influencing the evaluation of fatigue fracture of nitrided layers. It begins by describing the problems of enhancing the fatigue resistance of machine components. The significance and detailed assessment of the effect of a structural flaw are then explained, using investigations of the effect of variable core conditions on fatigue resistance as an example. This is followed by a discussion on the processes involved in the evaluation of fatigue properties of nitrided steels. The chapter also describes the determination of the fatigue characteristics of nitrided steels after the carbonitriding treatment.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... signature analysis and GHz-SAM. GHz -SAM integrated circuit inspection scanning acoustic microscope semiconductor packages spectral signature analysis The Scanning Acoustic Microscope (SAM) has been adopted by assembly and test facilities, packaging researchers and...
Abstract
The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720117
EISBN: 978-1-62708-305-8
... Abstract This chapter is a detailed account of the tensile testing procedure used for evaluating metals and alloys. The discussion covers the stress-strain behavior of metals determined by tensile testing, properties determined from testing, test machines for measuring mechanical properties...
Abstract
This chapter is a detailed account of the tensile testing procedure used for evaluating metals and alloys. The discussion covers the stress-strain behavior of metals determined by tensile testing, properties determined from testing, test machines for measuring mechanical properties, and general procedures of tensile testing. Three distinct aspects of standard test methods for tension testing of metallic materials are discussed: test piece preparation, geometry, and material condition; test setup and equipment; and test procedure.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720085
EISBN: 978-1-62708-305-8
... Abstract This chapter discusses the operating mechanism, applications, advantages, and limitations of Brinell hardness testing, Rockwell hardness testing, Vickers hardness testing, Scleroscope hardness testing, and microhardness testing. In addition, the general precautions and selection...
Abstract
This chapter discusses the operating mechanism, applications, advantages, and limitations of Brinell hardness testing, Rockwell hardness testing, Vickers hardness testing, Scleroscope hardness testing, and microhardness testing. In addition, the general precautions and selection criteria to be considered are described and details of equipment setup provided.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... failure mechanisms and ICs themselves become more complex, testing is becoming not only more difficult, but also more important. Specifically, the increasing difficulty of physical failure analysis (PFA) coupled with the time-to-market-driven need for rapid yield-learning is creating an increasingly...
Abstract
This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.mmfi.9781627083096
EISBN: 978-1-62708-309-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130351
EISBN: 978-1-62708-284-6
..., inboard flap hinge bolt, nose landing gear piston axle, multiple-leg aircraft-handling sling, aircraft hoist sling, internal spur gear, and MLG axle. In addition, the chapter provides information on full-scale fatigue testing, nondestructive testing, and failure analysis of fin attach bolts. high...
Abstract
This chapter presents various case histories that illustrate a variety of failure mechanisms experienced by the high-strength steel components in aerospace applications. The components covered are catapult holdback bar, AISI 420 stainless steel roll pin, main landing gear (MLG) lever, inboard flap hinge bolt, nose landing gear piston axle, multiple-leg aircraft-handling sling, aircraft hoist sling, internal spur gear, and MLG axle. In addition, the chapter provides information on full-scale fatigue testing, nondestructive testing, and failure analysis of fin attach bolts.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720001
EISBN: 978-1-62708-305-8
... test is the most common test used to evaluate the mechanical properties of materials. Tensile testing is normally conducted by the material producer and the results are supplied to the user as part of the material certification sheet. Since the tensile test is a destructive test, it is not performed...
Abstract
This chapter provides an overview of the various inspection methods used with metals and alloys, namely visual inspection, coordinate measuring machines, machine vision, hardness testing, tensile testing, chemical analysis, metallography, and nondestructive testing. The nondestructive testing methods discussed are liquid penetrant inspection, magnetic particle inspection, eddy current inspection, radiographic inspection, and ultrasonic testing.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... nodes within the cell. There are a host of other features that can be added to the layout to order to aid in the FA effort. These may include toplayer mechanical probe pads on key nodes. Also, test structures fit into the scribe streets can provide important clues especially early on in the process...
Abstract
Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.