1-20 of 705 Search Results for

measurement systems analysis

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
... Abstract Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. In this phase of the analysis, several tools and instruments are available to support the examination and analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... and electrical measurements were able to find most board related defects on these technologies and additional component analysis can be done in a separate failure analysis flow. Figure 1 Trend overview for semiconductor packaging integration on board and system level. [2] In present system...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270031
EISBN: 978-1-62708-301-0
... schematically the cutter head. Fig. 5.1 SSam surface sampling system: schematic of cutting process. Source: Ref 2 . With kind permission of Exponent Failure Analysis Associates As described in the following section, bulk mechanical properties can be obtained from miniature samples by punch...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110219
EISBN: 978-1-62708-247-1
... subsequent high-resolution physical analyses. 3D hot-spot localization electrical shorts lock-in thermography phase-shift analysis thermally active defects Introduction Today’s package developments including system in package (SiP) approaches, wafer level packaging (WLP), chip embedding...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420239
EISBN: 978-1-62708-310-2
... to the selective oxidation or vaporization of one or more of its components. Measures should be taken to avoid composition variations by the adjustment of the conditions of the experiment, but when this cannot be done, repeated sampling and analysis throughout the course of the constitutional study become...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... This article discusses the state-of-the-art in commercially available Laser Voltage Probing (LVP) technology for the purpose of integrated-circuit failure analysis. An overview of LVP history, theory, system architecture, and application extensions will be reviewed. Current limitations and future work...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780089
EISBN: 978-1-62708-281-5
... properties of reactive thermoset systems, while the second utilizes these thermal characteristics as the basis for monitoring and control during processing. thermoset resins chromatography infrared spectroscopy physical test thermal analysis THERMOSETTING RESINS are unique among engineering...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720293
EISBN: 978-1-62708-305-8
... in thickness from some preset standard and provide a digital readout and a permanent record of results for statistical analysis. The use of measuring systems employing capacitance, electrical contact, or linear displacement transducers are capable of high accuracy and the output can be linked directly...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110499
EISBN: 978-1-62708-247-1
... Abstract This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980551
EISBN: 978-1-62708-342-3
... defects, their effects and causes as well as the preventive measures are systematically determined. This can be product-specific ( Table 8.4 ). Failure modes and effect analysis for the extrusion process Table 8.4 Failure modes and effect analysis for the extrusion process Step failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2022
DOI: 10.31399/asm.tb.isceg.t59320323
EISBN: 978-1-62708-332-4
..., and compacted graphite irons. Grain fineness and grain size distribution are other significant characteristics. Grain size influences the surface finish and the surface area and affects the percentage clay (bond) content. The grain size distribution is measured using the sieve analysis, and fineness...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110209
EISBN: 978-1-62708-247-1
... at 250 K to 350 K. Infrared Thermography It is evident from Figure 2 that IR detectors is required for analysis of devices that emit radiation in 3 um to 12 um range. Most IR thermography systems use one of two types of detectors; indium antimonide or mercury cadmium telluride. Indium...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090091
EISBN: 978-1-62708-462-8
... measurements, and a stable environment, it may be possible to distinguish between frontside vs. backside metal stacks in a BPD device in ideal cases. This information would be extremely useful for guiding the next steps of the isolation process. The limitations of this type of analysis need to be more...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.pht2.t51440085
EISBN: 978-1-62708-262-4
... of the entire system. Details on the shim analysis procedure can be found in Ref 4 . Dew Point Instrument Use of a dew point measuring device is another method of monitoring or controlling the carbon potential of a furnace atmosphere. It can also be used to determine the moisture content of any given...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780343
EISBN: 978-1-62708-281-5
... Abstract This article introduces procedures an engineer or materials scientist can use to investigate failures. It provides a brief survey of polymer systems and key properties that need to be measured during failure analysis. The article begins with an overview of the problem-solving approach...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260233
EISBN: 978-1-62708-336-2
... and analyzed, and if any correlation can be obtained, feedback is given to the process control system. The following are sampling processes used in statistical analysis ( Ref 11 ): Single-sampling plan Double-sampling plan Sequential-sampling plan Grouped sequential-sampling plan MIL-STD...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... Abstract This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060163
EISBN: 978-1-62708-355-3
..., with consequent effects on the measured “tensile” stress, in contrast to the behavior that might be seen in a direct tensile test with lower dilatational stress and no shear. Of these various “tensile” tests, by far the most commonly used are the three-and four-point flexure tests. A detailed analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780011
EISBN: 978-1-62708-268-6
... cost. It provides information on the use of Pareto analyses from both frequency-of-occurrence and cost perspectives to target specific areas for improvement. hidden factory Pareto analysis NEARLY EVERY ORGANIZATION has experienced “showstopper” system failures, similar to the one described...