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measurement systems analysis

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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780343
EISBN: 978-1-62708-281-5
... Abstract This article introduces procedures an engineer or materials scientist can use to investigate failures. It provides a brief survey of polymer systems and key properties that need to be measured during failure analysis. The article begins with an overview of the problem-solving approach...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
... Abstract Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. In this phase of the analysis, several tools and instruments are available to support the examination and analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270031
EISBN: 978-1-62708-301-0
... Publication 75-SAF-3, 1975 22. Fussell J.B. and Wagner D.P. , Fault Tree Analysis as a Part of Mechanical Systems Design , Engineering Design , Proceedings of the Mechanical Failures Prevention Group, 25th Meeting, NBS 487 , National Bureau of Standards, 1976 , p 289 – 308 23...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... Abstract In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110219
EISBN: 978-1-62708-247-1
... been recently developed alongside with the implementation and evaluation of the TRTR analysis [7] , [8] . In this approach, custom and application specific signal shapes are designed and employed for repetitive electrical stimulation of the sample during the lock-in measurement. According to system...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420239
EISBN: 978-1-62708-310-2
... to the selective oxidation or vaporization of one or more of its components. Measures should be taken to avoid composition variations by the adjustment of the conditions of the experiment, but when this cannot be done, repeated sampling and analysis throughout the course of the constitutional study become...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720293
EISBN: 978-1-62708-305-8
... for statistical analysis. The use of measuring systems employing capacitance, electrical contact, or linear displacement transducers are capable of high accuracy and the output can be linked directly to microcomputers for data recording and statistical analysis to meet the requirements of statistical process...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... This article discusses the state-of-the-art in commercially available Laser Voltage Probing (LVP) technology for the purpose of integrated-circuit failure analysis. An overview of LVP history, theory, system architecture, and application extensions will be reviewed. Current limitations and future work...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780089
EISBN: 978-1-62708-281-5
... properties of reactive thermoset systems, while the second utilizes these thermal characteristics as the basis for monitoring and control during processing. thermoset resins chromatography infrared spectroscopy physical test thermal analysis THERMOSETTING RESINS are unique among engineering...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110209
EISBN: 978-1-62708-247-1
.... It is evident from Figure 2 that IR detectors is required for analysis of devices that emit radiation in 3 um to 12 um range. Most IR thermography systems use one of two types of detectors; indium antimonide or mercury cadmium telluride. Indium antimonide (InSb) detectors are sensitive in the wavelength range...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... Abstract This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260233
EISBN: 978-1-62708-336-2
... and analyzed, and if any correlation can be obtained, feedback is given to the process control system. The following are sampling processes used in statistical analysis ( Ref 11 ): Single-sampling plan Double-sampling plan Sequential-sampling plan Grouped sequential-sampling plan MIL-STD...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110499
EISBN: 978-1-62708-247-1
... Abstract This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980551
EISBN: 978-1-62708-342-3
... department also include the organization of the tests throughout the process chain. Failure modes and effect analysis (FMEA) can be used to determine the need for particular tests and their extent. With the FMEA potential defects, their effects and causes as well as the preventive measures are systematically...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... the process. Gas injection systems containing XeF 2 crucibles are readily available for both FIB and PFIB systems. The reaction [11] of XeF 2 with silicon is 2 XeF 2 + Si → 2 Xe + SiF 4. Etch rates associated with this reaction have been measured as high as 460nm/min [12...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.pht2.t51440085
EISBN: 978-1-62708-262-4
... by a shim test can improve the accuracy of the entire system. Details on the shim analysis procedure can be found in Ref 4 . Use of a dew point measuring device is another method of monitoring or controlling the carbon potential of a furnace atmosphere. It can also be used to determine the moisture...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... system that processes tip response and controls the scanning system in all three axes (x, y, z), where x and y define the location on the sample and z is a measure of some physical properties (height, capacitance, charge, current flow, etc…) at that location. Figure 1 Typical SPM configuration...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220667
EISBN: 978-1-62708-259-4
... corrections, JCGM , Vol 200 , 2012, http://www.bipm.org/en/publications/guides/vim.html (accessed April 2017) 10. Vieira P.R.M. and Paciornik S. , Uncertainty Evaluation of Metallographic Measurements by Image Analysis and Thermodynamic Modeling , Mat. Charact. , Vol 47 ( No. 3–4...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... ION BEAM SYSTEMS .,” Rev. Sci. Instrum 69 ( 1998 ) pg. 91 - 94 10.1063/1.1148483 [22] Ximen H. , Talbot C.G. , “ Halogen-Based Selective FIB Milling for IC Probe-Point Creation and Repair ”, Proc 20th Int’l Symp for Testing and Failure Analysis , Los Angeles, CA , November...