Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing, image analysis, and image interpretation. Details of the processes involved, equipment used, and the factors to be considered are also presented. In addition, the applications of machine vision are discussed.

After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical and environmental approaches, and chemical and composition analysis for assessing material characteristics. This chapter is a detailed account of the working principle and the steps involved in these techniques and technologies.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

This chapter discusses some of the more advanced methods and procedures used in failure analysis, including in-service material sampling, in situ microstructure analysis, and a form of punch testing that can determine the fracture toughness of any material from a tiny specimen. The chapter also covers quantitative fractography, fracture surface topography analysis, and the use of oxide dating as well as fault tree and failure modes and effects analysis (FMEA) and computational techniques.

This chapter describes three approaches for 3D hot-spot localization of thermally active defects by lock-in thermography (LIT). In the first section, phase-shift analysis for analyzing stacked die packages is performed. The second example employs defocusing sequences for the localization of resistive electrical shorts in 3D architectures, and the third operates in cross sectional LIT mode to investigate defects in the insulation liner of Through Silicon Vias. All three approaches allow for a precise localization of thermally active defects in all three spatial dimensions to guide subsequent high-resolution physical analyses.

This chapter discusses some of the methods and measurements used to construct phase diagrams. It explains how cooling curves were widely used to determine phase boundaries, and how equilibrated alloys examined under controlled heating and cooling provide information for constructing isothermal and vertical sections as well as liquid projections. It also explains how diffusion couples provide a window into local equilibria and identifies typical phase diagram construction errors along with problems stemming from phase-boundary curvatures and congruent transformations.

This article focuses on characterization techniques used for analyzing the physical behavior and chemical composition of thermoset resins, namely chromatography and infrared spectroscopy. The main purpose is to give sufficient detail to permit the reader understand a particular test technique and its value to the thermoset resin field. Epoxy resins are emphasized in the examples because they dominate the airframe and aerospace industries. The article also provides information on two categories of characterization of the processing behavior of thermoset. The first studies the thermal properties of reactive thermoset systems, while the second utilizes these thermal characteristics as the basis for monitoring and control during processing.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

The inspection of castings normally involves checking for shape and dimensions, coupled with aided and unaided visual inspection for external discontinuities and surface quality. This chapter discusses methods for determining surface quality, internal discontinuities, and dimensional inspection. Casting defects including porosity, oxide films, inclusions, hot tears, metal penetration, and surface defects are reviewed. Liquid penetrant inspection, magnetic particle inspection, eddy current inspection, radiographic inspection, ultrasonic inspection, and leak testing for castings are discussed. The chapter provides information on the procedures involved in the inspection of castings that are limited to visual and dimensional inspections, weight testing, and hardness testing. It also discusses the use of computer equipment in foundry inspection operations.

This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.

The aim of every extrusion plant is the efficient production of competitive products that meet the appropriate quality requirements. This chapter discusses the processes involved in the selection and introduction of a quality management system, along with its application, advantages, and disadvantages. It describes the process chain for order processing within the quality circle and provides information on product liability legal issues. In addition, the chapter discusses the processes involved in quality control, along with its organization, responsibilities, audits, and testing.

This chapter provides an overview of key elements in controlling the casting process, systems to confirm the quality of outgoing components, and the steps needed to launch a novel product. The discussion also provides information on process control tools and techniques; incoming material control; process control of sand preparation and system maintenance; metallic charge materials; product quality control; and melting, metallurgical, and mechanical testing.

Many defects generate excessive heat during operation; this is due to the power dissipation associated with the excess current flow at the defect site. There are several thermal detection techniques for failure analysis and this article focuses on infrared thermography with lock-in detection, which detects an object's temperature from its infrared emission based on blackbody radiation physics. The basic principles and the interpretation of the results are reviewed. Some typical results and a series of examples illustrating the application of this technique are also shown. Brief sections are devoted to the discussion on liquid-crystal imaging and fluorescent microthermal imaging technique for thermal detection.

The temperature and atmosphere conditions must be precisely controlled in order to achieve the desired metallurgical results during heat treating operations. In order to ensure the repeatability of operation, a heat treating system must have the necessary sensors, timers, and variable (temperature, atmosphere, etc.) controllers to hold the process within prescribed or specified limits. This chapter discusses temperature and atmosphere sensors used in a heat treating system. The temperature sensors covered are contact and noncontact types. The atmosphere sensors covered are oxygen probe, dew point, and infrared. The chapter concludes with an overview of the development of integrated control systems.

This chapter provides an introduction to statistical process control and the concept of total quality management. It begins with a review of quality improvement efforts in the extrusion industry and the considerations involved in developing sampling plans and interpreting control charts. It then lays out the steps that would be followed in order to implement statistical testing for billet casting, die performance, or any other process or variable that impacts extrusion quality. The chapter concludes with an overview of the fundamentals of total quality management.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

This chapter describes tensile testing of advanced ceramic materials, a category that includes both noncomposite, or monolithic, ceramics and ceramic-matrix composites (CMCs). The chapter presents four key considerations that must be considered when carrying out tensile tests on advanced monolithic ceramics and CMCs. These include effects of flaw type and location on tensile tests, separation of flaw populations, design strength and scale effects, and lifetime predictions and environmental effects. The chapter discusses the advantages, problems, and complications of four basic categories of tensile testing techniques as applied to ceramics and CMCs. These categories are true direct uniaxial tensile tests at ambient temperatures, indirect tensile tests, tests where failure is presumed to result from tensile stresses, and high-temperature tensile tests.

The hidden factory refers to the activities associated with scrap and rework. This chapter presents a rudimentary understanding of what sorts of things the hidden factory is doing, focusing on how to get one's arms around the rejections that occur most frequently or have the highest cost. It provides information on the use of Pareto analyses from both frequency-of-occurrence and cost perspectives to target specific areas for improvement.

The overall chemical composition of metals and alloys is most commonly determined by x-ray fluorescence (XRF) and optical emission spectroscopy (OES). High-temperature combustion and inert gas fusion methods are typically used to analyze dissolved gases (oxygen, nitrogen, and hydrogen) and, in some cases, carbon and sulfur in metals. This chapter discusses the operating principles of XRF, OES, combustion and inert gas fusion analysis, surface analysis, and scanning auger microprobe analysis. The details of equipment set-up used for chemical composition analysis as well as the capabilities of related techniques of these methods are also covered.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.