Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability determinations, mean times between failure, and related topics are also discussed. The discussion covers the practices observed in fault-tree analysis quantification and processes involved in calculating the probability of the top undesired event.

This chapter analyzes four gearbox failures, in each case identifying the underlying failure mechanism and recommending changes to reduce vibration. These include failure of an offset parallel gearbox due to gear tooth geometry error; high vibration on high-speed offset parallel gearbox; failure of an epicyclic gearbox; and vibration due to tooth wear.

After the failure analysis team hypothesizes failure causes, prepares a failure mode assessment and assignment, and evaluates all potential failure causes, it may find in some cases that several causes are still suspect but cannot be confirmed. In this situation, an experiment is necessary to confirm or rule out suspected causes. This chapter discusses two predominant methods for doing this, namely analysis of variance (ANOVA) and Taguchi methods (a more powerful technique based on ANOVA).

This chapter provides an overview of how the disciplines of design, material, and manufacturing contribute to engineering for functional performance. It describes the interaction of product designers and casting engineers in product development. It discusses the consequences of component failure, uncertainty in data and assumptions, and selection of the factor of safety. The chapter also presents an overview of the functional requirements for product performance and provides an overview of product design development. It also presents a partial list of the different tests that are performed on prototypes and examples of product testing. The chapter describes the requirements of a traceability system.

This chapter explains why it is sometimes necessary to separate inelastic from elastic strains and how to do it using one of two methods. It first discusses the direct calculation of strain-range components from experimental data associated with large strains. It then explains how the method can be extended to the treatment of very low inelastic strains by adjusting tensile and compressive hold periods and continuous cycling frequencies. The chapter then begins the presentation of the second approach, called the total strain-range method, so named because it combines elastic and inelastic strain into a total strain range. The discussion covers important features, procedures, and correlations as well as the use of models and the steps involved in predicting thermomechanical fatigue (TMF) life. It also includes information on isothermal fatigue, bithermal creep-fatigue testing, and the predictability of the method for TMF cycling.

This chapter discusses the effect of fatigue on polymers, ceramics, composites, and bone. It begins with a general comparison of polymers and metals, noting important differences in microstructure and cyclic loading response. It then presents the results of several studies that shed light on the fatigue behavior and crack growth mechanisms of common structural polymers and moves on from there to discuss the fatigue behavior of bone and how it compares to stable and cyclically softening metals. It also discusses the fatigue characteristics of engineered and composited ceramics and ceramic fiber-reinforced metal-matrix composites.

Distortion failures are readily identified by the inherent change in size and/or shape. They are serious because they can lead to other types of failure or may even cause complete collapse of structures, such as bridges, ladders, beams, and columns. Distortion failures may be classified in different ways. One way is to consider them either as dimensional distortion (growth or shrinkage) or as shape distortion (such as bending, twisting, or buckling). They may also be classified as being either temporary or permanent in nature. This chapter discusses the nature, causes, and effects of all of these types of failures as well as the methods to manage them.

This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.

Failure analysis can sometimes involve considerations of statistics and probability. This chapter reviews some of the basic types of statistical distributions in order to understand some basic principles in their use. The main focus is on the uses of the normal distribution, which is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing.

This chapter covers the failure modes and mechanisms associated with boiler components and the tools and techniques used to assess damages and predict remaining component life. It begins with a review of the design and operation of a utility boiler and the materials used in construction. It then describes the various causes of failure in boiler tubes, headers, and steam pipes, explaining how and why they occur, how they are diagnosed, and how to mitigate their effects. The final and by far largest section in the chapter is a tutorial on damage and life assessment techniques for boiler components and assemblies. It demonstrates the use of various methods, including analytical techniques that estimate life expenditure based on operating history, component geometry, and material properties; predictive methods based on the extrapolation of failure statistics; methods that predict life based on dimensional measurements; methods based on metallographic studies; methods based on temperature estimates; and a method for estimating remaining life under creep conditions based on stress-rupture testing of service-exposed material samples. The chapter also discusses the use of fracture mechanics and presents a number of cases in which life assessments are made based on the integration of several methods.

This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.

In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.

Compacted graphite iron (GCI) is a cast iron grade that is engineered through graphite morphology modifications to achieve a combination of thermal and mechanical properties that are in between those of flake graphite iron and ductile iron. This chapter discusses the advantages of compacted graphite iron over gray iron and ductile iron. It presents examples of low- and high-frequency thermal cycling, both of which affect the thermal stresses that castings are exposed to during temperature fluctations. Information on optimum carbon and silicon ranges as well as mechanical property standards for CGI are provided. The chapter describes the critical factors that control CGI and discusses methods of CGI manufacturing.

This chapter explains how the authors assessed the potential risks of creep-fatigue in several aerospace applications using the tools and techniques presented in earlier chapters. It begins by identifying the fatigue regimes encountered in the main engines of the Space Shuttle. It then describes the types of damage observed in engine components and the methods used to mitigate problems. It also discusses the results of analyses that led to changes in design or approach and examines fatigue-related issues in turbine engines used in commercial aircraft.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.

The testing of plastics includes a wide variety of chemical, thermal, and mechanical tests. This chapter reviews the tensile testing of plastics, which has been standardized in ASTM D 638, "Standard Test Method for Tensile Properties of Plastics," and other comparable standards. It describes the fundamental factors that affect data from tensile tests, examines the stipulations in standardized tensile testing, and discusses the utilization of data from tensile tests.