This appendix provides a brief review of thin film deposition methods and their uses in a question and answer format. The questions deal with recommended practices, process conditions, terminology, and classifications.

This chapter examines some of the behaviors that suit materials for electrical and electronic applications. It begins by explaining how charge carriers move in metals and semiconductors and how properties such as conductivity, mobility, and resistivity are derived. It discusses the significance of energy bands, intrinsic and extrinsic conduction, and the properties of compound semiconductors. It also covers semiconductor devices, including p-n junctions, light emitting diodes, transistors, and piezoelectric crystals.

This chapter presents an overview on the twins and stacking faults. It then provides an overview of the compositions, microstructures, thermodynamics, processing, deformation mechanism, mechanical properties, formability, and special attributes of twinning-induced plasticity steels.

This chapter briefly discusses the characteristics of mechanical twins and stacking faults in close-packed planes. It provides an overview of the composition, microstructures, thermodynamics, processing, deformation mechanism, mechanical properties, formability, and special attributes of twinning-induced plasticity steels.

This chapter begins with an overview of the history of ion nitriding. This is followed by sections that describe how the ion nitriding process works, glow discharge characteristics, process parameters requiring good control, and the applications of plasma processing. The chapter explores what happens in the ion nitriding process and provides information on its gas ratios. It describes the reactions that occur at the surface of the material being treated during iron nitriding and defines corner effect and nitride networking. Further, the chapter provides information on the stability of surface layers and processes involved in the degradation of surface finish and control of the compound zone formation. Gases primarily used for ion nitriding and the control parameters used in ion nitriding are also covered. The chapter also presents the philosophies and advantages of the plasma generation technique for nitriding. It concludes with processes involved in oxynitriding.

This chapter presents basic principles and the theoretical results of heat transport in solids. Thermal conductivity and thermal diffusivity are the principal properties discussed. Discussions are also included on the effects of temperature, magnetic field, and metallurgical variations caused by composition, processing, and heat-treatment differences. Numerous graphs illustrate the qualitative and quantitative effects of these variables. Measurement methods and associated accuracies and pertinent empirical correlations are presented.

This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.

This chapter discusses the ways in which the evolution of filament winding software systems has capitalized on the inherent flexibility of computer numerical controlled winding machines and enhanced their productivity. It provides a detailed discussion on different types of geometries that can be wound, from the simple to the highly complex, with insight into the limitations, advantages, and challenges of each. Components covered include classic axisymmetric parts (rings, pipes, driveshafts, pipe reducers, tapered shafts, closed-end pressure vessels, and storage tanks), nonround sections (aeromasts, airfoils, box sections, and fuselage sections), curved-axis parts (elbows, ducts), and special applications (tees). Basic winding concepts, such as band pattern, are discussed and explained, and some simple predictive formulae are introduced. The chapter also provides examples of programming various geometries using advanced software tools and discusses how various materials, such as rovings, tow-preg, prepreg tape, and woven materials, affect winding program generation.

This article discusses the role of alloying in the production and use of titanium. It explains how alloying elements affect transformation temperatures, tensile and creep strength, elasticity, hardness, and corrosion behaviors. It provides composition and property data for commercial grades of titanium, addresses processing issues, and identifies operating environments where certain titanium alloys are susceptible to stress-corrosion cracking.

This chapter provides a detailed analysis of the cyclic stress-strain behavior of materials under uniaxial stress and strain cycling. It first considers the case of a stable material under constant-amplitude strain cycling then broadens the discussion to materials that harden or soften with continued strain reversals. It compares and contrasts the response patterns of such materials, explaining how the movement of dispersed particles and dislocations influences their behavior. It then examines the behavior of materials under uniaxial strain reversals of varying amplitude and explains how to construct double-amplitude stress-strain curves that account for complex straining histories. For special cases, those involving complex materials such as gray cast iron or highly complex straining patterns, the chapter presents other methods of analysis, including the rainflow cycle counting method, mechanical modeling based on displacement-limited elements, Wetzel’s method, and deformation modeling. It also explains the difference between force cycling and stress cycling and presents alternate techniques for predicting whether a material will become harder or softer in response to strain cycling.

There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.

This chapter presents topics pertaining to resistance at cryogenic temperatures: measurement, the resistive mechanisms, and available data. The chapter also presents brief descriptions of the various mechanisms that are operative in producing resistance at low temperatures. The alloys discussed are the nondilute mixtures of metals. An introduction to low-temperature electrical properties of specific metals and alloys is included.

This chapter discusses the context in which metallography is used and some of the challenges of analyzing three-dimensional structures from a two-dimensional perspective. It describes the hierarchical nature of metals, the formation of grain boundaries, and the notable characteristics of microstructure. It explains how microstructure can be represented qualitatively by points, lines, surfaces, and volumes associated to a large extent with grain contact, and how qualitative features (including grains) can be quantified based on cross-sectional area, volume fraction, density, distribution, and other such metrics.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

This chapter covers the emerging practice of quantitative microscopy and its application in the study of the microstructure of metals. It describes the methods used to quantify structural gradients, volume fraction, grain size and distribution, and other features of interest. It provides examples showing how the various features appear, how they are measured, and how the resulting data are converted into usable form. The chapter also discusses the quantification of fracture morphology and its correlation with material properties and behaviors.

This chapter discusses the principles of corrosion of metals in aqueous environments. The thermodynamics of aqueous corrosion is the subject of the first half of this chapter, which addresses concepts such as corrosion reactions and free-energy change, the relationship between free energy and electrochemical potential, the effect of ionic concentration on electrode potential, and the corrosion behavior of a metal based on its potential-pH diagram. The corrosion (potential-pH) behavior of iron, gold, copper, zinc, aluminum, and titanium are described. Understanding the kinetics of corrosion and the factors that control the rates of corrosion reactions requires examination of the concepts of polarization behavior and identification of the various forms of polarization in an electrochemical cell. These concepts, addressed in the remaining of this chapter, include anodic and cathodic reactions, the mixed-potential theory, and the exchange currents.

This article describes the most common, general-purpose analog design-for-test (DFT) methods, analog test buses and loopback, and shows their advantages and limitations in diagnosability and automatability. It also describes DFT and built-in self-test (BIST) techniques for the most common analog functions, namely phase-locked loop, serializer-deserializer, analog/digital converters, and radio frequency. Lastly, the challenges of creating BIST for analog functions are summarized, along with seven principles that must be exploited to meet these challenges. These principles show how the design constraints for analog BIST circuitry can be more relaxed than for the circuit under test, while delivering the required test accuracy and speed.

Photon emission (PE) is one of the major optical techniques for contactless isolation of functional faults in integrated circuits (ICs) in full electrical operation. This article describes the fundamental mechanisms of PE in silicon based ICs. It presents the opportunities of contactless characterization for the most important electronic device, the MOS - Field Effect Transistor, the heart of ICs and their basic digital element, the CMOS inverter. The article discusses the specification and selection of detectors for proper PE applications. The main topics are image resolution, sensitivity, and spectral range of the detectors. The article also discusses the value and application of spectral information in the PE signal. It describes state of the art IC technologies. Finally, the article discusses the applications of PE in ICs and also I/O devices, integrated bipolar transistors in BiCMOS technologies, and parasitic bipolar effects like latch up.