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material failure

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... product by doing finger print of the trace elements in this small particle. Based on our failure Pareto, 30-40% of the field return failures in semiconductor products are caused by a process or material aberration. To solve the problem and prevent re-occurrence, our manufacturing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110032
EISBN: 978-1-62708-247-1
... management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included. failure analysis laboratory...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... Abstract This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290279
EISBN: 978-1-62708-306-5
... strains in each material are equal. In the composite, the matrix resin acts as an adhesive to pass load from one fiber ply to the next. Because the matrix shear stiffness is low, the composite plies deform unequally in tension. Failure tends to initiate in the composite ply next to the adhesive near the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870001
EISBN: 978-1-62708-314-0
... when they reach a certain load (through yielding) without picking up more load and without failure. Two important benefits of this ductile yielding are that (1) it provides for local load relief by distributing excess load to an adjacent material or structure; therefore, ductile metals have a great...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780193
EISBN: 978-1-62708-268-6
... microscopic examination, dye penetrant inspection, fluorescent dye pressure testing, x-ray Mechanical disconnect Visual examination, dimensional inspection, surface fractography, stress analysis, strength of materials testing Metallic component compressive, tensile, brittle, fatigue failure Surface...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130133
EISBN: 978-1-62708-284-6
... forging hot forging IN-PROCESS OR SERVICE FAILURES of forgings may occur for a variety of reasons. The starting material may be of insufficient quality to be adequately formed without cracking, or the forging process may introduce various types of discontinuities that cause failure during services...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110219
EISBN: 978-1-62708-247-1
...-destructive failure localization techniques take a key role for successful and efficient root-cause analysis, particularly for advanced 2.5D and 3D packaging architectures including stacked dies and TSVs [2] . Microscopic lock-in thermography (LIT) [3] represents a promising candidate for electrical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... moisture/thermal-induced stresses sufficient to exceed the mechanical strength of the materials and interfaces in the package, resulting in “popcorn crack” failures. The term “popcorn crack” was coined due to the sounds of cracking packages near the Vapor Phase Reflow processors. Studies were published...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.9781627083010
EISBN: 978-1-62708-301-0
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110678
EISBN: 978-1-62708-247-1
... Abstract This article is a compilation of terms and definitions related to failure analysis that have been addressed in the proceedings of the International Symposium for Testing and Failure Analysis. failure analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
... toughness, grain size Loading direction may show failure was secondary or impact induced Low temperatures Cyclic stress exceeded the endurance limit of the material Check for proper strength, surface finish, assembly, and operation Prior damage by mechanical or corrosion modes may have...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... failure analysis units. High energy gallium, iodine, or xenon ions are generated and rastered across a grounded sample to very accurately remove small amounts of material. While routinely used for semiconductor, with the invention of plasmaassisted FIBs that cut up to twenty times faster, this technique...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.9781627082563
EISBN: 978-1-62708-256-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.fibtca.9781627082532
EISBN: 978-1-62708-253-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110545
EISBN: 978-1-62708-247-1
... projections requires a detailed understanding of failure mechanism for solar panels and components. Therefore, failure analysis is critical to reducing the long term cost of solar energy. Solar photovoltaic panels are manufactured with the series connection of many cells made of a variety of materials and...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780001
EISBN: 978-1-62708-268-6
... about failure analysis address component or material failures. Component failures are relatively easy to address (e.g., resistors can fail open or sometimes short circuit; metal parts can fail in fatigue, in tension, or in other discernable failure modes; plastic components can experience brittle...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130311
EISBN: 978-1-62708-284-6
... applications. Toughness is also important in the previously discussed application, preventing several catastrophic failures or, more commonly, adhesive wear failures, in which microchipping is a very important issue. In these situations, the advent of new materials with lower carbon and chromium contents has...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... FAILURES IN STEEL components, like any other material, may have various consequences, such as: Making the device or component completely inoperable Preventing an operable device from functioning satisfactorily Making the device or component unsafe or unreliable, with immediate removal from...