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This appendix presents a comment on magnification markers.

Contaminants can be a cause of numerous types of system failures. There are numerous techniques for confirming contaminant presence. When the presence of a contaminant is suspected, the failure analysis team must find and eliminate the contaminant source, which can be obvious or quite subtle. This chapter summarizes a few commonly encountered contaminant sources to stimulate the reader's thinking about potential contaminant sources. A case study of titanium component washing at Litton Lasers is presented to illustrate how the presence of contaminants leads to a system failure.

This chapter explains what some of the terms used in physical metallurgy are intended to mean and how these meanings affect the manner in which the subject is treated throughout the book.

This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.

This chapter discusses the important role of metallography and the metallographer in predicting and understanding the properties of metals and alloys. Examples are presented of a metallographer working as part of a team in a research laboratory of a large steel company and a metallographer working alone at a small iron foundry. The three basic areas in all metallography laboratories are discussed: the specimen preparation area, the polishing/etching area, and the observation/micrography area. Important safety issues in a metallographic laboratory are also considered.

This chapter discusses the principles of scanning transmission electron microscopy (STEM) as implemented using conventional scanning electron microscopes (SEMs). It describes the pros and cons of low-energy imaging and diffraction, addresses basic hardware requirements, and provides information on imaging modes, detector positioning and alignment, and the effect of contrast reversal. It also discusses beam convergence and angular selectivity, the use of application-specific masks, and how to generate grain orientation maps for different material systems.

The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.

Microstructures can be altered intentionally or unintentionally. In some cases, metallographers must diagnose what may have happened to the steel or cast iron based on the microstructural details. This chapter discusses how microstructure in steels and cast irons can be intentionally altered during heat treatment, solidification, and deformation (hot and cold working). Some specific examples are then shown to illustrate what can go wrong through unintentional changes in microstructure, for example, the loss of carbon from the surface of the steel by the process known as decarburization or the buildup of brittle carbides on the grain boundaries of an austenitic stainless steel by the process known as sensitization.

This chapter describes the nine steps of a failure investigation. The steps add detail to the problem-solving process introduced in Chapter 3. The first five steps are (1) understanding and negotiating the investigation goals, (2) obtaining an understanding of the failure, (3) objectively and clearly identifying all possible root causes, (4) evaluating the likelihood of each root cause, and (5) converging on the most likely root cause(s). Many failure investigations stop at this point, but significant value is provided in the next four steps, which are (6) identifying all possible corrective actions, (7) evaluating each corrective action, (8) selecting the optimal corrective action(s), and (9) evaluating the effectiveness of each corrective action. Each step is discussed in detail with examples along with information on the procedures to be followed and resources needed for the investigation.

This chapter provides a practical overview of the tools and techniques used to assess the tribological aspects of metal forming processes. It describes test methods that have been developed to evaluate bulk deformation and sheet metal forming processes along with lubricant rheology, friction forces, and stress and strain distributions. It explains how to measure temperature between tooling and workpiece surfaces as well as surface topography and composition, film thickness, and wear. It also discusses the benefits of reduced-scale and simulation testing and the transfer of results from one process to another.

This chapter discusses corrosion prevention methods used with aluminum and its alloys. The methods range from relatively straightforward measures, such as proper handling and storage, to advanced early warning corrosion monitoring systems for military aircraft. The chapter summarizes the basic factors that influence design for corrosion resistance and discusses the use of conversion coatings, organic coatings, porcelain enameling, and electroplating. It also discusses corrosion monitoring methods used in chemical processing and refining industries.

This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.

This chapter instructs the metallographer on the basic skills required to prepare a polished metallographic specimen. It is organized in a chronological sequence starting with the information-gathering process on the material being investigated, then moving on to sectioning, mounting, grinding, and polishing processes, and ending with methods used to properly store metallographic specimens. The discussion covers the preparation procedures, the materials being investigated, and equipment used to perform these procedures.

This chapter examines the effects of welding on the structure of metal, particularly the changes induced in the isothermal regions adjacent to the weld. It presents more than 150 images identifying structures and features associated with fusion and solid-state welding processes, including electroslag, TIG, gas, electron-beam, and arc welding as well as vacuum diffusion, forge, friction, electrical-resistance, and explosive welding. It also discusses the effect of welding temperature, pressure, and composition on the transformations that occur in and around the weld, and it includes a short section on brazing and braze welding.

With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.

This chapter covers the failure modes and mechanisms associated with boiler components and the tools and techniques used to assess damages and predict remaining component life. It begins with a review of the design and operation of a utility boiler and the materials used in construction. It then describes the various causes of failure in boiler tubes, headers, and steam pipes, explaining how and why they occur, how they are diagnosed, and how to mitigate their effects. The final and by far largest section in the chapter is a tutorial on damage and life assessment techniques for boiler components and assemblies. It demonstrates the use of various methods, including analytical techniques that estimate life expenditure based on operating history, component geometry, and material properties; predictive methods based on the extrapolation of failure statistics; methods that predict life based on dimensional measurements; methods based on metallographic studies; methods based on temperature estimates; and a method for estimating remaining life under creep conditions based on stress-rupture testing of service-exposed material samples. The chapter also discusses the use of fracture mechanics and presents a number of cases in which life assessments are made based on the integration of several methods.