Search Results for machine learning

This chapter covers the engineering aspects of corrosion inhibitors and their effect on corrosion reactions. It explains how different metallic salts and heterocyclic compounds influence chemical reactions on metal surfaces exposed to corrosive media or environments. It describes how to evaluate inhibition efficiency through weight loss measurements, linear polarization resistance tests, electrochemical impedance spectroscopy, electrochemical noise monitoring, and surface analysis. It demonstrates the use of potentiodynamic polarization curves, Tafel extrapolations, equivalent circuit models, and various methods for characterizing corrosion damage and protective surface films. It also discusses typical applications, industry trends, and the emerging role of high-throughput experimentation, quantitative modeling, and machine learning in the development of cleaner and more effective corrosion inhibitors.

This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.

This chapter summarizes critical gaps and long-term needs in failure analysis technology as it relates to logic and memory devices and IC packages. It assesses the impact of vertical integration, new materials, and expansion in the third dimension on volume analysis, sample preparation and measurement methods, and cross-sectioning and imaging.

This chapter discusses some of the ways that the lessons learned from failures have benefitted society, leading to improved product designs, better materials, safer industrial processes, and more robust codes and standards. It also provides several examples of how the technology and procedures associated with aviation security have been upgraded in the wake of air disasters.

A typical mobile processor die may contain, among other things, a variety of high-performance as well as low-power processing cores along with 5G modems, Wi-Fi modules, image processors, GPUs, and security modules, with a total transistor count exceeding 10 billion. Such designs pose many challenges for yield ramp and diagnostics. This chapter examines these challenges and the growing demand for innovative solutions to help failure analysts quickly and accurately isolate faults. It also assesses the capabilities and future potential of ATPG scan diagnostics, streaming scan networks, and advanced fault models for diagnosing embedded memory.

The technology of fabricating composite hardware and structures by filament winding has evolved empirically through the development and manufacturing of specific components. This chapter reviews areas of technology used in building composite parts and discusses the processes from which the current technology was derived. The discussion covers quality control requirements for composite fabrication technology and cleanliness standards in the workplace. It describes technology developed for specific components, including satellites struts, aircraft hydraulic cylinders, drill pipe, drive shafts, couplings, and cryogenic tubing.

This chapter is a detailed account of various factors pertinent to the development and launch of a product. It begins by describing the five phases in the product launch process, namely product design and development, process design and development, product and process validation, product launch, and continuous improvement. This is followed by sections covering product-process flow diagrams and also the process elements considered for process failure mode and effects analysis. Some of the aspects covered by the engineering specifications to meet the product performance requirements are then reviewed. Details on product validation requirements and definitions of parameters related to the launch process are also provided. The chapter discusses the purpose of manufacturing control plan, along with an illustration of a manufacturing control plan outlined for a safety-critical suspension casting. It ends with an overview of the contents of a program launch manual.

Failure investigation is an integral part of any design and manufacturing operation, providing critical information to solve manufacturing problems and assist in redesigns. This chapter addresses several aspects of failure investigation, beginning with the challenges of organizing such efforts and the need to define a clear and concise goal, direction, and plan prior to the investigation. It covers the causes of failure and the training and education organizations require to understand and prevent them. The chapter emphasizes the importance of discovering the root cause of failures, and uses examples to explain the factors involved and how to recognize them when the first appear.

This chapter provides information on the biennial International Wear of Materials Conference, which is the inspiration for this book. It reviews the fundamentals of tribology, tribosystems, and related terminology. The glossary at the end of this chapter is intended to familiarize readers with some of the fundamental tribology terms that will be repeated throughout this book.

Contaminants can be a cause of numerous types of system failures. There are numerous techniques for confirming contaminant presence. When the presence of a contaminant is suspected, the failure analysis team must find and eliminate the contaminant source, which can be obvious or quite subtle. This chapter summarizes a few commonly encountered contaminant sources to stimulate the reader's thinking about potential contaminant sources. A case study of titanium component washing at Litton Lasers is presented to illustrate how the presence of contaminants leads to a system failure.

Many companies conduct only metallurgical evaluations in the wake of failures, discovering nothing more than the physical mechanism by which the failure occurred. The origin of failures, however, is often complex, involving not only physical mechanisms, but also human behavior and latent factors. Failures may also involve multiple parts, entire machines, or processes of any size and shape. The chapter examines the unique aspects of many failures and explains how they can sometimes be traced to systemic issues. It also covers the reasons why products fail, including improper service or operation, improper maintenance, improper testing, assembly errors, fabrication or manufacturing errors, and design errors. The case of the Tacoma Narrows Bridge collapse is presented to illustrate the consequence of overlooked factors, in this case, wind dynamics, and the importance of identifying root causes to prevent repeat failures.

This chapter describes some of the technological milestones of the early 20th century, including the invention of tungsten carbide tool steel, the use of age-hardening aluminum in the Wright Flyer , the development of a new heat treating process for aluminum alloys, and Ford’s pioneering use of weight-saving vanadium alloys in Model T cars. It explains how interest in chromium alloys spread throughout the world, spurring the development of commercial stainless steels. The chapter concludes with a bullet point timeline of early 20th century achievements and a brief assessment of more recent innovations.

This chapter is a brief account of various factors pertinent to the development of an engineering component. The discussion covers the disciplines and interactions of design development, engineering of component design, validation of design and process analysis, and matrix of design and manufacturing elements.

This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics that a professional engineer must improve to conduct an effective and successful failure investigation, namely technical skills, communication skills, and technical integrity. The chapter also provides information on the additional basic tools available for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC.