Organic coatings (paints and plastic or rubber linings), metallic coatings, and nonmetallic inorganic coatings (conversion coatings, cements, ceramics, and glasses) are used in applications requiring corrosion protection. These coatings and linings may protect substrates by three basic mechanisms: barrier protection, chemical inhibition, and galvanic (sacrificial) protection. This chapter begins with a section on organic coating and linings, providing a detailed account of the steps involved in the coating process, namely, design and selection, surface preparation, application, and inspection and quality assurance. The next section discusses the methods by which metals, and in some cases their alloys, can be applied to almost all other metals and alloys: electroplating, electroless plating, hot dipping, thermal spraying, cladding, pack cementation, vapor deposition, ion implantation, and laser processing. The last section focuses on nonmetallic inorganic coatings including ceramic coating materials, conversion coatings, and anodized coatings.

There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.

Roll forming is a process in which flat strip or sheet material is progressively bent as it passes through a series of contoured rollers. This chapter describes the basic configuration and operating principles of a roll forming line and the cross-sectional profiles that can be achieved. It explains how to determine strip width and bending sequences and identifies the cause of common roll-forming defects. It also discusses the selection of roll materials and explains how software helps simplify the design of roll forming lines.

This chapter explains the significance of the phase diagram and its use in the development of new materials. The chapter describes the basic rules of heterogeneous equilibrium, presents a comparison between liquidus line and solidus line, and provides information on the solubility curve and the binodal curve.

In a perfect crystalline structure, there is an orderly repetition of the lattice in every direction in space. Real crystals contain a considerable number of imperfections, or defects, that affect their physical, chemical, mechanical, and electronic properties. Defects play an important role in processes such as deformation, annealing, precipitation, diffusion, and sintering. All defects and imperfections can be conveniently classified under four main divisions: point defects, line defects, planar defects, and volume defects. This chapter provides a detailed discussion on the causes, nature, and impact of these defects in metals. It also describes the mechanisms that cause plastic deformation in metals.

Alloying, heat treating, and work hardening are widely used to control material properties, and though they take different approaches, they all focus on imperfections of one type or other. This chapter provides readers with essential background on these material imperfections and their relevance in design and manufacturing. It begins with a review of compositional impurities, the physical arrangement of atoms in solid solution, and the factors that determine maximum solubility. It then describes different types of structural imperfections, including point, line, and planar defects, and how they respond to applied stresses and strains. The chapter makes extensive use of graphics to illustrate crystal lattice structures and related concepts such as vacancies and interstitial sites, ion migration, volume expansion, antisite defects, edge and screw dislocations, slip planes, twinning planes, and dislocation passage through precipitates. It also points out important structure-property correlations.

This chapter discusses the context in which metallography is used and some of the challenges of analyzing three-dimensional structures from a two-dimensional perspective. It describes the hierarchical nature of metals, the formation of grain boundaries, and the notable characteristics of microstructure. It explains how microstructure can be represented qualitatively by points, lines, surfaces, and volumes associated to a large extent with grain contact, and how qualitative features (including grains) can be quantified based on cross-sectional area, volume fraction, density, distribution, and other such metrics.

Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.

This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.

This chapter provides a brief overview of phase diagrams, explaining what they represent and how and why they are used. It identifies key points, lines, and features on a binary nickel-copper phase diagram and explains what they mean from a practical perspective. It also discusses the concept of equilibrium, the significance of Gibb’s phase rule, the theorem of Le Chatelier, and the use of the lever rule.

This chapter begins by presenting a generic eutectic phase diagram and identifying critical points, lines, and features. It then describes the composition and properties of aluminum-silicon and lead-tin eutectic systems, the characteristics of eutectic morphologies, the solidification and scale of eutectic structures, and the competitive growth of dendrites and eutectic colonies or cells. It also examines the different types of precipitation structures that form during slow cooling cycles.

This chapter provides a brief overview of monotectic alloy systems and reactions. It begins by presenting a monotectic phase diagram and identifying important points, lines, and regions. It then describes the monotectic reactions that occur in copper-lead systems and the associated solidification structures. It also discusses the morphology of the microstructure produced during directional solidification and the classification criteria of low- and high-dome alloys.

This chapter discusses the construction, interpretation, and use of ternary phase diagrams. It begins by examining a hypothetical phase space diagram and several corresponding two-dimensional plots. It then describes one of the most basic tools of metallurgy, the Gibbs triangle, and explains how to construct tie lines to analyze intermediate compositions and phases. It also discusses the use of three-dimensional temperature-composition diagrams, three- and four-phase equilibrium phase diagrams, and binary and ternary phase diagrams associated with the iron-chromium-nickel alloy system.

This chapter examines the microstructure and properties of annealed and normalized steels containing more than 0.25% carbon. It shows, using detailed micrographs, how incrementally higher levels of carbon affect the structure and distribution of pearlite and how it intermingles with proeutectoid ferrite and cementite. It explains how ferrite and pearlite respond to deformation and how related features such as slip lines, dislocations, shear bands, and kinking can be detected as well as what they reveal. It also describes the structure of patented wires, cast steels, and sintered steels and the morphology of manganese sulfide inclusions in castings.

The building block of all matter, including metals, is the atom. This chapter initially provides information on atomic bonding and the crystal structure of metals and alloys, followed by a description of three crystal lattice structures of metals: face-centered cubic, hexagonal close-packed, and body-centered cubic. It then describes the four main divisions of crystal defects, namely point defects, line defects, planar defects, and volume defects. The chapter provides information on grain boundaries of metals, processes involved in atomic diffusion, and key properties of a solid solution. It also explains the aspects of a phase diagram that shows what phase or phases are present in the alloy under conditions of thermal equilibrium. Finally, a discussion on the applications of equilibrium phase diagrams is presented.

This chapter discusses various factors pertinent to the prevention of corrosion in alloys for petroleum applications and reviews the selection of stainless steels for petroleum applications, including oil country tubular goods, line pipe, offshore platforms, liquefied natural gas vessels, and refinery equipment.

This chapter introduces many of the key concepts on which metallurgy is based. It begins with an overview of the atomic nature of matter and the forces that link atoms together in crystal lattice structures. It discusses the types of imperfections (or defects) that occur in the crystal structure of metals and their role in mechanical deformation, annealing, precipitation, and diffusion. It describes the concept of solid solutions and the effect of temperature on solubility and phase transformations. The chapter also discusses the formation of solidification structures, the use of equilibrium phase diagrams, the role of enthalpy and Gibb’s free energy in chemical reactions, and a method for determining phase compositions along the solidus and liquidus lines.

Besides the induction coil and workpiece, the induction generator (source of ac power) is probably the most important component of an overall induction heating system. Such equipment is typically rated in terms of its frequency and maximum output power (in kilowatts). This chapter addresses the selection of power supplies in terms of these two factors as well as the operational features of different types of sources. The six different types of power supplies for induction heating applications covered in this chapter are line-frequency supplies, frequency multipliers, motor-generators, solid-state (static) inverters, spark-gap converters, and radio-frequency power supplies. The chapter discusses the design and characteristics of each of the various types of power supplies.

This chapter familiarizes readers with the methods used to quantify the effects of fatigue on component lifetime and failure. It discusses the development and use of S-N (stress amplitude vs. cycles to failure) curves, the emergence of strain-based approaches to fatigue analysis, and important refinements and modifications. It demonstrates the use of approximate equations, including the method of universal slopes and the four-point correlation technique, which provides reasonable estimates of elastic and plastic lines from information obtained in standard tensile tests. It also discusses high-cycle, low-cycle, and ultra-high cycle fatigue and presents several models that are useful for fatigue life predictions.