Search Results for line defects

The building block of all matter, including metals, is the atom. This chapter initially provides information on atomic bonding and the crystal structure of metals and alloys, followed by a description of three crystal lattice structures of metals: face-centered cubic, hexagonal close-packed, and body-centered cubic. It then describes the four main divisions of crystal defects, namely point defects, line defects, planar defects, and volume defects. The chapter provides information on grain boundaries of metals, processes involved in atomic diffusion, and key properties of a solid solution. It also explains the aspects of a phase diagram that shows what phase or phases are present in the alloy under conditions of thermal equilibrium. Finally, a discussion on the applications of equilibrium phase diagrams is presented.

In a perfect crystalline structure, there is an orderly repetition of the lattice in every direction in space. Real crystals contain a considerable number of imperfections, or defects, that affect their physical, chemical, mechanical, and electronic properties. Defects play an important role in processes such as deformation, annealing, precipitation, diffusion, and sintering. All defects and imperfections can be conveniently classified under four main divisions: point defects, line defects, planar defects, and volume defects. This chapter provides a detailed discussion on the causes, nature, and impact of these defects in metals. It also describes the mechanisms that cause plastic deformation in metals.

Alloying, heat treating, and work hardening are widely used to control material properties, and though they take different approaches, they all focus on imperfections of one type or other. This chapter provides readers with essential background on these material imperfections and their relevance in design and manufacturing. It begins with a review of compositional impurities, the physical arrangement of atoms in solid solution, and the factors that determine maximum solubility. It then describes different types of structural imperfections, including point, line, and planar defects, and how they respond to applied stresses and strains. The chapter makes extensive use of graphics to illustrate crystal lattice structures and related concepts such as vacancies and interstitial sites, ion migration, volume expansion, antisite defects, edge and screw dislocations, slip planes, twinning planes, and dislocation passage through precipitates. It also points out important structure-property correlations.

This chapter introduces many of the key concepts on which metallurgy is based. It begins with an overview of the atomic nature of matter and the forces that link atoms together in crystal lattice structures. It discusses the types of imperfections (or defects) that occur in the crystal structure of metals and their role in mechanical deformation, annealing, precipitation, and diffusion. It describes the concept of solid solutions and the effect of temperature on solubility and phase transformations. The chapter also discusses the formation of solidification structures, the use of equilibrium phase diagrams, the role of enthalpy and Gibb’s free energy in chemical reactions, and a method for determining phase compositions along the solidus and liquidus lines.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.

The tensile test provides a relatively easy, inexpensive technique for developing mechanical property data for the selection, qualification, and utilization of metals and alloys in engineering service. The tensile test requires interpretation, and interpretation requires a knowledge of the factors that influence the test results. This chapter provides a metallurgical perspective for such interpretation. The topics covered include elastic behavior, anelasticity, damping, proportional limit, yield point, ultimate strength, toughness, ductility, strain hardening, and yielding and the onset of plasticity. The chapter describes the effects of grain size on yielding, effect of cold work on hardness and strength, and effects of temperature and strain-rate on the properties of metals and alloys. It provides information on true stress-strain relationships and special tests developed to measure the effects of test/specimen conditions. Finally, the chapter covers the characterization of tensile fractures of ductile metals and alloys.

This appendix provides a detailed overview of the crystal structure of metals. It describes primary bonding mechanisms, space lattices and crystal systems, unit cell parameters, slip systems, and crystallographic planes and directions as well as plastic deformation mechanisms, crystalline imperfections, and the formation of surface or planar defects. It also discusses the use of X-ray diffraction for determining crystal structure.

Deformation within a crystal lattice is governed principally by the presence of dislocations, which are two-dimensional defects in the lattice structure. Slip from shear stress is the most common deformation mechanism within crystalline lattices of metallic materials, although deformation of crystal lattices can also occur by other processes such as twinning and, in special circumstances, by the migration of vacant lattice sites. This appendix describes the notation used to specify lattice planes and directions and discusses the mechanisms of slip and twinning as well as the effect of stacking faults.

Roll forming is a process in which flat strip or sheet material is progressively bent as it passes through a series of contoured rollers. This chapter describes the basic configuration and operating principles of a roll forming line and the cross-sectional profiles that can be achieved. It explains how to determine strip width and bending sequences and identifies the cause of common roll-forming defects. It also discusses the selection of roll materials and explains how software helps simplify the design of roll forming lines.

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.

The hidden factory refers to the activities associated with scrap and rework. This chapter presents a rudimentary understanding of what sorts of things the hidden factory is doing, focusing on how to get one's arms around the rejections that occur most frequently or have the highest cost. It provides information on the use of Pareto analyses from both frequency-of-occurrence and cost perspectives to target specific areas for improvement.

The chapter presents an overview of the properties and operational limits of superconductive materials, as well as techniques used to fabricate practical superconducting wires. It introduces six properties: critical temperature, critical magnetic field, critical current density, stability, ac loss, and mechanical characteristics; for each property, typical data are provided and the experimental methods used to measure it are briefly described. The properties of the superconducting composites are tied together in the chapter to summarize their effect on superconductor material selection and the geometrical design of superconducting composites. The chapter also contains a reference guide to composite-design factors with links to the relevant chapter sections where each design consideration is addressed.

This chapter discusses the critical soldering faults that lead to quality degradation and potential failure of a soldered connection. It then describes the types of nondestructive evaluations used to inspect soldered and brazed joints, including dimensional and visual inspection, ultrasonic testing, radiographic examination, dye penetrant inspection, and leak testing, including overpressure tests. The chapter also provides an overview of destructive physical analysis.

This chapter identifies the primary causes of service failures and discusses the types of defects from which they stem. It presents more than a dozen examples of failures attributed to such causes as design defects, material defects, and manufacturing or processing defects as well as assembly errors, abnormal operating conditions, and inadequate maintenance. It also describes the precise usage of terms such as defect, flaw, imperfection, and discontinuity.