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lead-base soft solders

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980195
EISBN: 978-1-62708-342-3
... spectrum of materials to be extruded. This chapter focuses on the processes involved in the extrusion of semifinished products in various metals and their alloys, namely tin, lead, lead-base soft solders, tin-base soft solders, zinc, magnesium, aluminum, copper, titanium, zirconium, iron, nickel...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110099
EISBN: 978-1-62708-483-3
..., cadmium, and bismuth. The higher-activation-temperature fluxes are used with the tin-base, lead-base, and aluminum-zinc solders. The flux activation temperature must complement the solder alloy and its process temperature to prevent these circumstances from leading to solderability problems, including...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170528
EISBN: 978-1-62708-297-6
... and the amounts and combinations in which they are found. lead alloys tin alloys tin-based bearing alloys tin-lead solders Composition Introduction and Overview Lead and tin are low melting point metals that are often alloyed together. For example, solders in the tin-lead system are the most...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t6244000x
EISBN: 978-1-62708-352-2
... production. Silver extraction from ores involved cupellation of lead, and the base metal was then recovered from the litharge [ Tylecote 1976 ]. The softness and malleability of lead were clearly recognized, and there exist examples of lead being used as a setting agent to fix posts in the ground and lock...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.9781627084833
EISBN: 978-1-62708-483-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240597
EISBN: 978-1-62708-251-8
... to the sweet taste of lead-base paint chips; therefore, lead should be removed from homes/structures to avoid ingestion by humans, particularly young children. The most important applications of lead and lead alloys are lead acid storage batteries, solders, cable sheathing, and building construction...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... publications [e.g., Klein Wassink 1989, Manko 2002, Schwartz 2003 ] as well as suppliers’ data sheets and manuals. All solder alloys are based on combinations of two or more constituents, chosen from nine common elements, namely antimony, bismuth, cadmium, gold, indium, lead, silver, tin, and zinc...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... of Soldering and Brazing went to press. Even the “hot topic” of the 1990s—lead-free solders—is based on alloys that were known and largely characterized previously. Soldering is a relatively mature technology, so that while there has been progress and many undoubted improvements made in recent years...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060315
EISBN: 978-1-62708-261-7
... than that of tin-lead solder. Bismuth is one of the few metals to increase in volume upon solidification. It is diamagnetic (slightly repelled by magnetic fields) and has a low capture cross section for thermal neutrons. Low-melting-point alloys such as Bi-Cd-Sn-Pb-In alloy, which melts at 47 °C...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... on its surface. Wetting actually depends on a slight surface alloying of the base metal with the brazing filler metal. Lead, for example, does not alloy with iron and will not wet it. Tin, on the other hand, does form an alloy with iron, so a tin-lead solder will wet steel. Fig. 7.2 Principle...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050317
EISBN: 978-1-62708-311-9
... (RTV) (e) Molds accurately; flexible; useful for soft soldering to 315 °C (600 °F) Fired Lava (f) Easily machinable before firing; good heat resistance; less strength than Diamonite Nonmagnetic metals (g) Aluminum alloys Fixture base plates, worktables; useful for soft soldering (does...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110067
EISBN: 978-1-62708-483-3
... of steel components, joining and loosening of shrink-fit joints, and annealing of base materials before and after metalworking processes. Among the joining processes, induction heating is used to make longitudinal seam welds of tubes as well as provide the heat source for brazing and soldering...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440103
EISBN: 978-1-62708-352-2
... is almost invariably a lead-tin (or lead-free tin-base) alloy. Because electronic components tend to be manufactured and stored under reasonably cool, clean, and dry conditions, they are likely to have only a thin layer of copper oxide as a barrier to wetting. This, coupled with the fact that soldering...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170003
EISBN: 978-1-62708-297-6
... during cooling. High-temperature brazing fillers can be produced from alloys containing silver and other precious metals with nickel and copper, while low-temperature solder alloys are made from lead, tin, silver, indium, antimony, cadmium, and zinc. Formability Good formability requires...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300163
EISBN: 978-1-62708-323-2
... are single phase, up to about 40% zinc; many alloys evolved for different applications. Lead is commonly added to brasses to aid machinability. It is not soluble in brass, so it tends to exist as nodules or spheres in the microstructure. Brasses are soft but have less ductility than pure copper. Cu...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
... phase of Fe 3 P in a similar manner to the reaction of tin-base solders with iron and steels to form FeSn 2 . On the other hand, solid solutions form between silver-lead solders and copper just as they do between the common silver-base brazes and copper. Also, there exist brazes for aluminum that melt...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110035
EISBN: 978-1-62708-483-3
... temperature. Heating times of less than 0.2 s are not unusual ( Ref 4.1 ). The induction coil must provide through-heating across the solder joint to achieve a uniform temperature that supports solder wetting and spreading through the joint clearance without overheating the base material. The power must...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220085
EISBN: 978-1-62708-341-6
...     Melting 1095 (2000) 3.3 0.81 0.47 0.26 1.2 0.039 0.018 Lead:     Soft soldering 260 (500) 6.7 1.6 0.99 0.52 0.23 0.078 0.037     Melting 325 (620) 7.3 1.8 1.0 0.56 0.25 0.084 0.040 Steel:     Stress relieving 540 (1000) 1.4 0.35 0.20 0.11 0.05...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... of Soft Solders Gold is widely used as the surface layer in metallization schemes because of its chemical inertness and ease of visual inspection. The change in the melting point (solidus temperature) of selected binary tin-base solders, when these have dissolved gold, is given in Table 4.3...