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Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170528
EISBN: 978-1-62708-297-6
... Abstract This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties...
Abstract
This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties of lead used in battery grids, type metals, and bearings. It, likewise, discusses the use of tin in various types of solder and in bearings and provides composition and property data for application-specific designations and grades. The article also discusses the effect of impurities in tin-lead solders and the amounts and combinations in which they are found.
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Published: 01 June 1985
Fig. 1-15. Charted lead patterns. (a) True lead a long both profiles. (b) True lead, tooth crowned 0.0015 in. per side. (c) True lead with crown. Indicator shows pitting a long the pitchline. (d) A crowned tooth with considerable lead error, shifting the crown toward opposite ends of each
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Published: 01 June 1988
Fig. 8.63 Effect of coil-lead spacing on lead inductance; closer spacing, as in (b), reduces lead inductance and thus power losses. From F. W. Curtis, High Frequency Induction Heating , McGraw-Hill, New York, 1950 ( Ref 1 )
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Published: 01 June 1988
Fig. 8.64 Lead construction for multiplace inductors; lead design in (b) is preferable because of lower lead inductance. From F. W. Curtis, High Frequency Induction Heating , McGraw-Hill, New York, 1950 ( Ref 1 )
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Published: 01 December 1984
Figure 1-40 Wragge’s lead print method (left) and the lead sweat test (center) were used to reveal the lead distribution in this free-machining steel billet disc. A few small spots of lead segregation were detected (right), otherwise the lead distribution was quite uniform.
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in Surface Analysis and Material Characterization Techniques Used in Semiconductor Industry to Identify and Prevent Failures
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 4 The AES analysis of plated lead surface is shown at top, while the AES depth profiling of the plated lead is shown at bottom.
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Published: 01 November 2019
Figure 7 X-ray image of packaged lead frame superimposed with current density image shows the location of short (red arrow). [7]
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in Chip-Scale Packaging and Its Failure Analysis Challenges
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 18 Thermal emission analysis detected a hot spot at the lead frame area on the TSOP package for the pin-to-pin short failure. Thermal emission site detected at the package level (top left and top right), CSAM image (bottom left) and X-ray image (bottom right) showed the emission site
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in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 6 C-scan images of the mold compound to die paddle and lead frame interface of a 68PLCC, obtained with a 50 MHz transducer. (A) The peak amplitude image shows a range of grayscale variation, but delamination locations are not obvious. (B) The phase inversion image clearly reveals
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Published: 01 March 2006
Fig. A.39 Typical simple types of loading that lead to multiaxial stresses and strains. (a) Bearing. (b) Torque. (c) Cracked body
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