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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170528
EISBN: 978-1-62708-297-6
... Abstract This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties...
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Published: 01 December 1984
Figure 1-40 Wragge’s lead print method (left) and the lead sweat test (center) were used to reveal the lead distribution in this free-machining steel billet disc. A few small spots of lead segregation were detected (right), otherwise the lead distribution was quite uniform.
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Published: 01 June 1988
Fig. 8.63 Effect of coil-lead spacing on lead inductance; closer spacing, as in (b), reduces lead inductance and thus power losses. From F. W. Curtis, High Frequency Induction Heating , McGraw-Hill, New York, 1950 ( Ref 1 )
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Published: 01 June 1988
Fig. 8.64 Lead construction for multiplace inductors; lead design in (b) is preferable because of lower lead inductance. From F. W. Curtis, High Frequency Induction Heating , McGraw-Hill, New York, 1950 ( Ref 1 )
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in Surface Analysis and Material Characterization Techniques Used in Semiconductor Industry to Identify and Prevent Failures
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 4 The AES analysis of plated lead surface is shown at top, while the AES depth profiling of the plated lead is shown at bottom.
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in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 6 C-scan images of the mold compound to die paddle and lead frame interface of a 68PLCC, obtained with a 50 MHz transducer. (A) The peak amplitude image shows a range of grayscale variation, but delamination locations are not obvious. (B) The phase inversion image clearly reveals
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