This chapter focuses on what can cause a system to fail and addresses the challenge in approaching a system failure. It then examines the steps involved in the four-step problem-solving process: defining the problem, identifying all potential failure causes and evaluating the likelihood of each, identifying the potential solutions, and identifying the best solution. The chapter concludes by describing the responsibilities of a failure analysis team.

Corrective action means the implementation or modification of things designed to eliminate or reduce failure causes. This chapter addresses developing potential solutions and selecting the best solution. It discusses the special operations that should be used only as temporary or interim corrective actions to overcome design, process, and other failure causes. The chapter concludes by describing the process of corrective action implementation.

This chapter discusses the application of high-pressure cold spray to the automotive industry field, with special attention to three applications: additive manufacturing, fabrication methods, and protective coatings. Various studies on the automotive application of cold spray are reviewed. The background and purpose of each application are presented and practical cases are discussed.

This chapter describes incremental sheet forming processes, including single-point, two-point, and kinematic (two tool) techniques. It provides information on the tooling and equipment used, work flow and forming parameters, process mechanics and forming limits. It also discusses multistage forming strategies, process modeling and simulation, and advanced hybrid forming processes.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

This chapter gives an overview of how steel castings may be effectively adapted to modern concurrent engineering processes. The chapter discusses computer aided design programs, solid modeling, solidification simulation programs, and rapid prototyping.

This chapter begins with a review of some of the terms used in the gear industry to describe the design of gears and gear geometries. It then discusses the types of gears that operate on parallel shafts, intersecting shafts, and nonparallel and nonintersecting shafts. Next, the processes involved in the selection of gear are discussed, followed by information on the basic stresses applied to a gear tooth, the strength of a gear tooth, and the most widely used gear materials. Further, the chapter briefly reviews gear manufacturing methods and the heat treating processing steps including prehardening processes, through hardening, and case hardening processes.

This chapter discusses some of the promising developments in the use of titanium, including titanium aluminides, titanium matrix composites, superplastic forming, spray forming, nanotechnology, and rapid solidification rate processing. It also reports on efforts to increase the operating temperature range of conventional titanium alloys and reduce costs.

Increasing growth of high-pressure cold spraying applications on the industrial scale have forced global powder producers to face this challenge and develop specific powders for cold spray applications. This chapter provides information on the properties, classification, characteristics, manufacturing, and procedures for packaging of powders specific to cold spray applications.

This chapter summarizes the progress that has been made in the study of high-entropy alloy (HEA) systems and the process-structure-property relationships that define them. It describes the various ways HEAs can be strengthened and explains how alloying elements influence tensile and yield strength, fracture toughness, and fracture strength. It discusses the stages of plastic deformation in HEAs and the role of dislocations and twinning in the evolution of microstructure. It reviews some of the work that has been done on fatigue behaviors and the methods developed to assess fatigue performance. It discusses the influence of defects on fatigue life, the effect of temperature and grain size on fatigue-crack propagation, and the role of nanotwinning in crack-growth retardation. It describes the methods used to produce HEAs in bulk and powder form and to apply them as protective coatings and films. It also identifies potential applications based on properties such as strength, hardness, density, wear resistance, high-temperature stability, and biocompatibility.

This chapter describes surface modification processes that go beyond conventional heat treatments, including plasma nitriding, plasma carburizing, low-pressure carburizing, ion implantation, physical and chemical vapor deposition, salt bath coating, and transformation hardening via high-energy laser and electron beams. The chapter compares methods and includes several example applications.

This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.

This chapter discusses the fusion welding processes, namely oxyfuel gas welding, oxyacetylene braze welding, stud welding (stud arc welding and capacitor discharge stud welding), high-frequency welding, electron beam welding, laser beam welding, hybrid laser arc welding, and thermit welding.

This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.

This chapter discusses the factors that affect die steel selection for hot forging, including material properties such as hardenability, heat and wear resistance, toughness, and resistance to plastic deformation and mechanical fatigue. It then describes the relative merits of various materials and the basic requirements for cold forging dies. The chapter also covers die manufacturing processes, such as high-speed and hard machining, electrodischarge machining, and hobbing, and the use of surface treatments.

Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used by counterfeiters to create counterfeits. These include relabeling, refurbishing, and repackaging. The article presents a systematic inspection methodology that can be applied for detecting signs of possible part modifications. The methodology consists of external visual inspection, marking permanency tests, and X-ray inspection followed by material evaluation and characterization. These processes are typically followed by evaluation of the packages to identify defects, degradations, and failure mechanisms that are caused by the processes (e.g., cleaning, solder dipping of leads, reballing) used in creating counterfeit parts.

Titanium is a lightweight metal used in a growing number of applications for its strength, toughness, stiffness, corrosion resistance, biocompatibility, and high-temperature operating characteristics. This chapter discusses the applications, metallurgy, properties, compositions, and grades of commercially pure titanium and alpha and near-alpha, alpha-beta, and beta titanium alloys. It describes primary and secondary fabrication processes, including melting, forging, forming, heat treating, casting, machining, and joining as well as powder metallurgy and direct metal deposition. It also compares and contrasts the properties of wrought, cast, and powder metal titanium products and discusses corrosion behaviors.